Patentable/Patents/US-20260185882-A1
US-20260185882-A1

6-Axis Force Torque Sensor Based on Photocoupler and Method of Sensing 6-Axis Force Torque Based on Photocoupler Measurement

PublishedJuly 2, 2026
Assigneenot available in USPTO data we have
Technical Abstract

The present disclosure relates to a 6-axis force-torque sensing apparatus that measures the magnitude and direction of an external force using a photocoupler, and includes a spring structure that includes a vertical displacement portion and a horizontal displacement portion and elastically deforms by an external force; a sensing substrate that includes a vertical displacement photocoupler that senses a vertical displacement of the vertical displacement portion and a horizontal displacement photocoupler that senses a horizontal displacement of the horizontal displacement portion; and a sensing substrate support that forms a predetermined gap between the spring structure and the sensing substrate.

Patent Claims

Legal claims defining the scope of protection, as filed with the USPTO.

1

a deformable structure comprising a spring structure including a vertical displacement portion and a horizontal displacement portion and configured to elastically deform in response to an external force, and a frame structure configured to support the spring structure; a sensing substrate comprising a vertical displacement photocoupler disposed below the vertical displacement portion and configured to sense a vertical displacement of the vertical displacement portion, and a horizontal displacement photocoupler disposed horizontally outward of the horizontal displacement portion and configured to sense a horizontal displacement of the horizontal displacement portion; and a sensing substrate support configured to support the sensing substrate and coupled to the frame structure such that a gap of a predetermined range is formed between the spring structure and the sensing substrate. . A photocoupler-based 6-axis force-torque sensing apparatus, comprising:

2

claim 1 the spring structure includes at least three beam portions arranged at regular intervals extending radially in a horizontal direction from a central portion and connected to the frame structure, the vertical displacement portion is a portion connected from the central portion to the frame structure in each beam portion, the horizontal displacement portion is a portion extending vertically downward from one widthwise end of the vertical displacement portion in each beam portion. . The photocoupler-based 6-axis force-torque sensing apparatus of, wherein

3

claim 1 the spring structure includes at least three beam portions extending radially in a horizontal direction from a central portion and connected to the frame structure, and at least three spring protrusions extending radially in a horizontal direction from the central portion, the vertical displacement portions are the respective beam portions, and the horizontal displacement portion is formed at the end of a linear extension portion extending radially in a horizontal direction from the central portion of each spring protrusion. . The photocoupler-based 6-axis force-torque sensing apparatus of, wherein

4

claim 1 the vertical displacement photocoupler and the horizontal displacement photocoupler each include a light-emitting element that emits light and a light-receiving element that senses light and converts it into an electrical signal according to the intensity, the light emitted from the light-emitting element of the vertical displacement photocoupler is reflected on a bottom surface of the vertical displacement portion and then collected by the light-receiving element of the vertical displacement photocoupler, thereby sensing a change in the gap between the vertical displacement photocoupler and the bottom surface of the vertical displacement portion, and the light emitted from the light-emitting element of the horizontal displacement photocoupler is reflected on a horizontally outward surface of the horizontal displacement portion and then collected by the light-receiving element of the horizontal displacement photocoupler, thereby sensing a change in the gap between the horizontal displacement photocoupler and the horizontally outward surface of the horizontal displacement portion. . The photocoupler-based 6-axis force-torque sensing apparatus of, wherein

5

claim 4 the sensing substrate further comprises a data processing unit that receives an electrical signal corresponding to the intensity of light collected through the light-receiving elements of the vertical displacement photocoupler and the horizontal displacement photocoupler, and calculates the displacement of the spring structure based thereon. . The photocoupler-based 6-axis force-torque sensing apparatus of, wherein

6

claim 4 the light-emitting element and the light-receiving element of the vertical displacement photocoupler are arranged parallel to the bottom surface of the vertical displacement portion at a predetermined distance, and the light-emitting element and the light-receiving element of the horizontal displacement photocoupler are arranged parallel to the outward surface of the horizontal displacement portion at a predetermined distance. . The photocoupler-based 6-axis force-torque sensing apparatus of, wherein

7

claim 1 further comprising a cover coupled to an upper side of the spring structure and coupled to an external force apparatus above it to transmit an external force from the external force apparatus to the spring structure. . The photocoupler-based 6-axis force-torque sensing apparatus of,

8

claim 2 the spring structure includes a first beam portion, a second beam portion, and a third beam portion arranged at 120-degree intervals, the first beam portion includes a first vertical displacement portion and a first horizontal displacement portion, the second beam portion includes a second vertical displacement portion and a second horizontal displacement portion, and the third beam portion includes a third vertical displacement portion and a third horizontal displacement portion, and the sensing substrate comprises a first vertical displacement photocoupler for measuring displacement of the first vertical displacement portion, a first horizontal displacement photocoupler for measuring displacement of the first horizontal displacement portion, a second vertical displacement photocoupler for measuring displacement of the second vertical displacement portion, a second horizontal displacement photocoupler for measuring displacement of the second horizontal displacement portion, a third vertical displacement photocoupler for measuring displacement of the third vertical displacement portion, and a third horizontal displacement photocoupler for measuring displacement of the third horizontal displacement portion, disposed at positions corresponding respectively to the first vertical displacement portion, the first horizontal displacement portion, the second vertical displacement portion, the second horizontal displacement portion, the third vertical displacement portion, and the third horizontal displacement portion. . The photocoupler-based 6-axis force-torque sensing apparatus of, wherein

9

claim 8 a longitudinal direction of the first beam portion is set as an x-axis, a direction orthogonal to the x-axis in a plane between the first beam portion and the second beam portion is set as a y-axis, and an upward direction of the spring structure, which is orthogonal to the x-axis and the y-axis, is set as a z-axis, x y z x y an x-axis component F, a y-axis component F, and a z-axis component Fof an external force, and an x-axis-based rotational moment Mand a y-axis-based rotational moment Mgenerated by the external force are measured through the first vertical displacement portion, the first horizontal displacement portion, the second vertical displacement portion, the second horizontal displacement portion, the third vertical displacement portion, and the third horizontal displacement portion, 1 2 3 4 5 6 a displacement Δdof the first vertical displacement portion, a displacement Δdof the first horizontal displacement portion, a displacement Δdof the second vertical displacement portion, a displacement Δdof the second horizontal displacement portion, a displacement Δdof the third vertical displacement portion, and a displacement Δdof the third horizontal displacement portion are calculated according to Equations 1 to 6 below, respectively, and . The photocoupler-based 6-axis force-torque sensing apparatus of, wherein 1 2 3 4 5 6 x y z x y z a relationship between the displacement Δdof the first vertical displacement portion, the displacement Δdof the second vertical displacement portion, the displacement Δdof the third vertical displacement portion, the displacement Δdof the first horizontal displacement portion, the displacement Δdof the second horizontal displacement portion, and the displacement Δdof the third horizontal displacement portion, the x-axis component F, the y-axis component F, the z-axis component Fof the external force, the x-axis-based rotational moment M, the y-axis-based rotational moment M, a z-axis-based rotational moment Mgenerated by the external force is defined as in Equation 7 below, s1 rMxv s1 dFzv s1 wherein ris a position radius of the vertical displacement photocoupler, kis a torsional spring constant of the vertical displacement portion due to x-axis and y-axis rotational moments at the point r, and Kis a spring constant corresponding to z-axis deformation of the vertical displacement portion at the point r, s2 rMxh s2 dFyh s2 rMzh s2 ris a position radius of the horizontal displacement photocoupler, Kis a spring constant corresponding to deformation of the horizontal displacement portion due to x-axis and y-axis rotational moments at the point r, Kis a spring constant corresponding to deformation of the horizontal displacement portion caused by a force in a y-axis direction at the point r, and Kis a spring constant corresponding to deformation of the horizontal displacement portion caused by a z-axis rotational moment at the point r, h is a vertical thickness of the spring structure, and c is a vertical distance from a substrate of the sensing substrate to the horizontal displacement photocoupler.

10

claim 9 a calibration matrix G is calculated according to Equation 8 below, and . The photocoupler-based 6-axis force-torque sensing apparatus of, wherein G a regulated calibration matrixis defined according to Equation 9 below.

11

applying an external force to a spring structure configured to elastically deform in response to the external force, thereby causing deformation; sensing a vertical displacement of a vertical displacement portion of the spring structure via a vertical displacement photocoupler disposed below the vertical displacement portion, and sensing a horizontal displacement of a horizontal displacement portion of the spring structure via a horizontal displacement photocoupler disposed horizontally outward of the horizontal displacement portion; receiving, at a data processing unit, an electrical signal corresponding to an intensity of light collected by a light-receiving element of the vertical displacement photocoupler and by a light-receiving element of the horizontal displacement photocoupler, and calculating a displacement of the spring structure based thereon; and calculating, at the data processing unit, a magnitude and direction of the external force applied to the spring structure using the displacement of the spring structure. . A photocoupler-based 6-axis force-torque sensing apparatus, comprising:

Detailed Description

Complete technical specification and implementation details from the patent document.

This application claims the benefit of and priority to Korean Patent Application No. 10-2025-0000095, filed on Jan. 2, 2025. The entire disclosure of the aforementioned application is incorporated herein by reference in their entirety.

The present disclosure relates to a 6-axis force-torque sensing apparatus and a 6-axis force-torque sensing method, and more particularly, to a photocoupler-based 6-axis force-torque sensing apparatus and a 6-axis force-torque sensing method for measuring a magnitude and direction of an external force using a photocoupler.

Force torque measurement technology has been continuously discussed and developed as more sophisticated control is required in the field of robot control.

In a conventional force-torque sensor, there is a method of measuring the magnitude and direction of an external force by detecting deformation using 12 or more strain gauges. This method allows for precise force-torque measurement, but it is expensive and difficult to miniaturize due to the large number of installed sensors, and in the case of miniaturization, a separate external signal processing device was required. In addition, since the strain gauge sensor is attached to a spring structure with silicone, the adhesion of the silicone weakens as impact accumulates, increasing the likelihood of sensor detachment. The silicone attachment process is also mainly performed manually, resulting in high manufacturing costs and a complex process.

Additionally, a conventional force-torque sensor includes a capacitance-based force-torque sensor that measures the magnitude and direction of an external force by measuring the capacitance between electrode plates. This method is easy to manage, allows for miniaturization, and is relatively inexpensive as it uses a single type of sensor, but it has the disadvantage of requiring multiple sensing apparatuses to be installed in various locations to achieve high accuracy. Additionally, due to the characteristics of the sensor, the capacitance method requires a grounding metal plate to serve as a reference point for capacitance measurement. This grounding metal plate must be connected to ground, and additional components are required to implement this. Additionally, the capacitance method had the disadvantage of being easily affected by external static electricity or electromagnetic fields.

Accordingly, research has been conducted from various angles on a force-torque sensor that minimizes components, can be miniaturized, has high impact durability, has low manufacturing costs, and can minimize the influence of external static electricity or electromagnetic fields.

A photocoupler-based 6-axis force-torque sensing apparatus according to the present disclosure may include: a deformable structure including a spring structure, which has a vertical displacement portion and a horizontal displacement portion and is elastically deformed by an external force, and a frame structure supporting the spring structure; a sensing substrate including a vertical displacement photocoupler, which is disposed below the vertical displacement portion to sense a vertical displacement thereof, and a horizontal displacement photocoupler, which is disposed horizontally outward of the horizontal displacement portion to sense a horizontal displacement thereof, and a sensing substrate support supporting the sensing substrate and coupled to the frame structure such that a gap of a predetermined range is formed between the spring structure and the sensing substrate.

The spring structure may include at least three beam portions arranged at regular intervals, extending radially in a horizontal direction from a central portion and connected to the frame structure; the vertical displacement portion may be a portion connected from the central portion to the frame structure in each beam portion; and the horizontal displacement portion may be a portion extending vertically downward from one widthwise end of the vertical displacement portion in each beam portion.

In addition, the spring structure include at least three beam portions extending radially in a horizontal direction from a central portion and connected to the frame structure, and at least three spring protrusions extending radially in a horizontal direction from a central portion, wherein the vertical displacement portions are the respective beam portions, and the horizontal displacement portions can be formed at the ends of linear extension portions extending radially in a horizontal direction from the central portion in each spring protrusion.

In addition, the vertical displacement photocoupler and the horizontal displacement photocoupler each include a light-emitting element that emits light and a light-receiving element that detects the light and converts it into an electrical signal according to its intensity. The light emitted from the light-emitting element of the vertical displacement photocoupler is reflected from a bottom surface of the vertical displacement portion and then collected by the light-receiving element of the vertical displacement photocoupler to detect a change in the gap between the vertical displacement photocoupler and the bottom surface of the vertical displacement portion. The light emitted from the light-emitting element of the horizontal displacement photocoupler is reflected from the horizontally outward surface of the horizontal displacement portion and then collected by the light-receiving element of the horizontal displacement photocoupler to detect a change in the gap between the horizontal displacement photocoupler and the outward surface of the horizontal displacement portion.

In addition, the sensing substrate may further include a data processing unit that receives an electrical signal corresponding to the intensity of light collected through the light-receiving elements of the vertical displacement photocoupler and the horizontal displacement photocoupler, and calculates the displacement of the spring structure based on the electrical signal.

In addition, the light-emitting element and the light-receiving element of the vertical displacement photocoupler may be arranged parallel to the bottom surface of the vertical displacement portion at a predetermined distance, and the light-emitting element and the light-receiving element of the horizontal displacement photocoupler may be arranged parallel to the outward surface of the horizontal displacement portion at a predetermined distance.

The apparatus may further include a cover that is coupled to the upper side of the spring structure and is coupled to an external force apparatus on the upper side to transmit an external force applied from the external force apparatus to the spring structure.

In addition, the spring structure may include a first beam portion, a second beam portion, and a third beam portion arranged at 120-degree intervals, wherein the first beam portion includes a first vertical displacement portion and a first horizontal displacement portion, the second beam portion includes a second vertical displacement portion and a second horizontal displacement portion, and the third beam portion includes a third vertical displacement portion and a third horizontal displacement portion. In addition, the sensing substrate may include a first vertical displacement photocoupler for measuring the displacement of the first vertical displacement portion, a first horizontal displacement photocoupler for measuring the displacement of the first horizontal displacement portion, a second vertical displacement photocoupler for measuring the displacement of the second vertical displacement portion, a second horizontal displacement photocoupler for measuring the displacement of the second horizontal displacement portion, a third vertical displacement photocoupler for measuring the displacement of the third vertical displacement portion, and a third horizontal displacement photocoupler for measuring the displacement of the third horizontal displacement portion, which may be disposed at positions corresponding to the first vertical displacement portion, the first horizontal displacement portion, the second vertical displacement portion, the second horizontal displacement portion, the third vertical displacement portion, and the third horizontal displacement portion, respectively.

Therein, the longitudinal direction of the first beam portion may be set as the x-axis, the direction orthogonal to the x-axis in the plane between the first beam portion and the second beam portion may be set as the y-axis, and the upward direction of the spring structure, which is the direction orthogonal to the x-axis and the y-axis, may be set as the z-axis.

x y z x y 1 2 3 4 5 6 In addition, by measuring the x-axis component F, the y-axis component F, and the z-axis component Fof an external force, and an x-axis-based rotational moment Mand a y-axis-based rotational moment Mgenerated by the external force through the first vertical displacement portion, the first horizontal displacement portion, the second vertical displacement portion, the second horizontal displacement portion, the third vertical displacement portion, and the third horizontal displacement portion, the displacement Δdof the first vertical displacement portion, the displacement Δdof the first horizontal displacement portion, the displacement Δdof the second vertical displacement portion, the displacement Δdof the second horizontal displacement portion, the displacement Δdof the third vertical displacement portion, and the displacement Δdof the third horizontal displacement portion can be calculated as shown in Equations 1 to 6 below, respectively.

1 2 3 4 5 6 x y z x y z In addition, the relationship between the displacement Δdof the first vertical displacement portion, the displacement Δdof the second vertical displacement portion, the displacement Δdof the third vertical displacement portion, the displacement Δdof the first horizontal displacement portion, the displacement Δdof the second horizontal displacement portion, the displacement Δdof the third horizontal displacement portion, and the x-axis component F, y-axis component F, the z-axis component Fof the external force, the x-axis-based rotational moment M, the y-axis-based rotational moment M, a z-axis-based rotational moment Mgenerated by the external force can be defined as in the following Equation 7.

s1 rMxv s1 dFzv s1 s2 rMxh s2 dFyh s2 rMzh s2 wherein ris the position radius of the vertical displacement photocoupler, kis the torsional spring constant of the vertical displacement portion due to the x-axis and y-axis rotational moments at r, Kis the spring constant corresponding to the z-axis deformation of the vertical displacement portion at the point r, ris the position radius of the horizontal displacement photocoupler, Kis the spring constant corresponding to the deformation of the horizontal displacement portion due to the x-axis and y-axis rotational moments at the point r, Kis the spring constant corresponding to the deformation of the horizontal displacement portion caused by the y-axis directional force at the point r, Kis the spring constant corresponding to the deformation of the horizontal displacement portion caused by the z-axis rotational moment at the point r, h is the vertical thickness of the spring structure, and c is the vertical distance from the substrate of the sensing substrate to the horizontal displacement photocoupler.

Additionally, a calibration matrix G can be calculated as in Equation 8 below.

G Additionally, a corrected calibration matrixcan be defined as in Equation 9 below.

A photocoupler-based 6-axis force-torque sensing method using a photocoupler-based 6-axis force-torque sensing apparatus according to the present disclosure comprises:

applying an external force to a spring structure that elastically deforms due to the external force; sensing a vertical displacement of the vertical displacement portion of the spring structure through a vertical displacement photocoupler disposed below the vertical displacement portion, and sensing a horizontal displacement of the horizontal displacement portion through a horizontal displacement photocoupler disposed horizontally outward of the horizontal displacement portion; receiving, at a data processing unit, an electrical signal corresponding to an intensity of light collected by a light-receiving element of the vertical displacement photocoupler and by a light-receiving element of the horizontal displacement photocoupler, and calculating a displacement of the spring structure based thereon; and calculating a magnitude and direction of the external force applied to the spring structure using the displacement of the spring structure at the data processing unit.

Hereinafter, specific embodiments for carrying out the present disclosure will be described in detail with reference to the accompanying drawings. However, in the following description, specific descriptions of well-known functions or configurations will be omitted if they are likely to unnecessarily obscure the gist of the present disclosure.

In the accompanying drawings, identical or corresponding components are assigned the same reference numerals. Additionally, in the description of the embodiments below, a redundant description of identical or corresponding components may be omitted. However, even if a description of a component is omitted, it is not intended that such a component is excluded from an embodiment.

The advantages and features of the embodiments disclosed herein, and methods for achieving them, will become apparent with reference to the embodiments described below in conjunction with the accompanying drawings. However, the present disclosure is not limited to the embodiments disclosed below but may be embodied in various different forms. These embodiments are provided only to fully disclose the present invention and to fully inform one of ordinary skill in the art of the scope of the disclosure.

Unless otherwise defined, all terms (including technical and scientific terms) used herein may be used in a meaning that can be commonly understood by one of ordinary skill in the art to which the present disclosure belongs. Also, terms defined in commonly used dictionaries are not to be interpreted ideally or excessively unless explicitly defined.

For example, the term “technology” may refer to systems, methods, computer-readable instructions, modules, algorithms, hardware logic, and/or operations as permitted by the context described above and throughout the document.

The terms used in this specification will be briefly described, and the disclosed embodiments will be described in detail. The terms used herein have been selected from general terms that are currently widely used, while taking into account their functions in the present disclosure. However, these terms may change depending on the intent of a person skilled in the relevant art, judicial precedents, or the emergence of new technologies. In addition, in certain cases, there are terms arbitrarily selected by the applicant, and in such cases, the meanings thereof will be described in detail in the corresponding portion of the description of the disclosure. Therefore, the terms used in the present disclosure should be defined based on their meanings and the overall content of the present disclosure, rather than their simple names.

In this specification, singular expressions include plural expressions unless the context clearly indicates otherwise. In addition, plural expressions include singular expressions unless the context clearly indicates otherwise. Throughout this specification, when a portion is stated to “comprise” a component, this means that it may further include other components and does not exclude other components, unless otherwise stated.

In the present disclosure, terms such as “comprise” and “comprising” may indicate the presence of features, steps, operations, elements, and/or components, but such terms do not preclude the addition of one or more other functions, steps, operations, elements, components, and/or combinations thereof.

In the present disclosure, when a component is referred to as being “coupled,” “combined,” “connected,” “associated” with, or “reacting” with another component, the component may be directly coupled, combined, connected to, associated with, and/or react with, the other component, but is not limited thereto. For example, there may be one or more intermediate components between one component and another component. Additionally, in the present disclosure, “and/or” may include each of one or more of the listed items or a combination of at least a portion of one or more of the listed items.

In the present disclosure, terms such as “first” and “second” are used to distinguish a component from another component, and the aforementioned components are not limited by these terms. For example, a “first” component may be an element of the same or similar form as a “second” component.

In this specification, a ‘portion’ or ‘module’ includes a unit realized by hardware or software, or a unit realized using both; one unit may be realized using two or more hardware components, and two or more units may be realized by one hardware component.

In this specification, the vertical direction refers to a direction perpendicular to the ground, i.e., the z-axis direction in the drawings, and the horizontal direction refers to a direction parallel to the ground, i.e., the x-axis and y-axis directions in the drawings.

In this specification, screw holes may be replaced with through-holes, and through-holes may be replaced with screw holes. Here, when coupling two parts through two through-holes, various other coupling methods can be used instead of screw coupling, including pin joints, tab-slot joints, and mortise-tenon joints.

The system described below constitutes one embodiment and is not intended to limit the scope of the claims to any one particular operating environment. It may be used in other environments without departing from the technical spirit and scope of the claimed subject matter.

1 1 7 FIGS.to Hereinafter, a 6-axis force-torque sensing apparatus () according to a first embodiment of the present disclosure will be described with reference to.

1 2 FIGS.and 1 FIG. 2 FIG. 3 FIG. 1 2 FIGS.and 1 1 are exploded perspective views of a 6-axis force-torque sensing apparatus () according to a first embodiment of the present disclosure.shows an exploded perspective view from above, andshows an exploded perspective view from below. In addition,shows a perspective view of the 6-axis force-torque sensing apparatus () in which the components shown inare assembled.

1 3 FIGS.to 1 100 200 300 200 400 300 Referring to, a 6-axis force-torque sensing apparatus () according to the first embodiment of the present disclosure includes a cover () to which an external force is applied, a deformable structure () that is elastically deformed by the external force, a photocoupler-based sensing substrate () that senses the deformation of the deformable structure (), and a sensing substrate support () that supports the sensing substrate ().

100 100 100 100 100 100 100 In this specification, an external force refers to a force applied to the cover () from the outside of the cover (). For example, although not shown in the drawings, a predetermined external apparatus may be coupled to the cover (), and a predetermined external force may be applied to the cover () from the coupled external apparatus. Hereinafter, an external apparatus that is coupled to the cover () as described above and applies a predetermined external force is referred to as an external force apparatus. Additionally, the external force is not limited to the force applied to the cover () from an external force apparatus, but also includes forces applied to the cover () in various other ways.

100 200 300 400 1 In addition, the cover () and the deformable structure () can be grouped as an upper structure to which the external force is transmitted, and the sensing substrate () and the sensing substrate support () can be grouped as a lower structure for measuring the external force. That is, according to the present disclosure, a 6-axis force-torque sensing apparatus () simplified into an upper structure and a lower structure can be provided.

100 200 200 The cover () is a force transmission structure for receiving an external force and transmitting it to the deformable structure (), and can be coupled to the outside of the deformable structure ().

100 210 200 100 210 100 210 210 The cover () may be configured to be coupled to the upper side of the spring structure () of the deformable structure () and transmit an external force applied from the upper side of the cover () to the spring structure (). In addition, the cover () is not limited to the above-described form and can be coupled to the spring structure () in various ways, and can be implemented to transmit an external force applied from various directions to the spring structure ().

100 100 100 210 100 The cover () can be designed in the shape of a circular plate of uniform thickness. In this case, the uniform thickness of the cover () can minimize variables occurring during the external force transmission process, and the circular structure with a constant radius can contribute to improving the accuracy of measuring the magnitude and direction of the external force. Additionally, the cover () may be made of a rigid, inelastic metal to absorb unnecessary external shocks and prevent damage to the spring structure (). In addition, the cover () is not limited to the above-described shape and material and can be implemented in various shapes with various materials.

1 210 100 211 210 1 1 211 1 100 210 A cover through-hole (H) for coupling between an external force apparatus and the spring structure () may be formed in the cover (). The upper protrusion () of the spring structure () can be inserted into the cover through-hole (H), and the inner surface of the cover through-hole (H) can be formed in a shape that corresponds to the outer surface of the protrusion (). In addition, the cover through-hole (H) may be formed at the center of gravity of the cover () so that the magnitude and direction of the external force transmitted from the external force apparatus are fully transmitted to the spring structure (), but is not limited thereto and may be formed at various locations.

1 2 3 4 5 6 210 101 100 101 100 100 1 Additionally, vertical deformable structure coupling screw holes (h, h, h, h, h, h) for screw coupling with the spring structure () can be formed in the central portion () of the cover (). Here, the central portion () of the cover () may be an area within a predetermined distance from the center of gravity of the cover (), and may be an area centered on the cover through-hole (H).

1 2 3 4 5 6 1 210 1 2 3 4 5 6 1 Here, at least three deformable structure coupling screw holes (h, h, h, h, h, h) are formed at equiangular intervals centered on the cover through-hole (H) so that the magnitude and direction of the external force transmitted from the external force apparatus can be designed to be fully transmitted to the spring structure (). Preferably, 6 deformable structure coupling screw holes (h, h, h, h, h, h) can be formed at 60-degree intervals centered on the cover through-hole (H).

7 8 9 10 102 100 102 100 101 100 Additionally, vertical external force apparatus coupling screw holes (h, h, h, h) for screw coupling with an external force apparatus can be formed at the edge portion () of the cover (). Here, the edge portion () of the cover () may be an area between the central portion () of the cover () and the edge.

7 8 9 10 1 2 3 4 5 6 1 210 7 8 9 10 1 Here, the external force apparatus coupling screw holes (h, h, h, h) are formed at equiangular intervals on the outside of the deformable structure coupling screw holes (h, h, h, h, h, h) centered on the cover through-hole (H), so that the magnitude and direction of the external force transmitted from the external force apparatus can be designed to be fully transmitted to the spring structure (). Preferably, four external force apparatus coupling screw holes (h, h, h, h) can be formed at 90-degree intervals centered on the cover through-hole (H).

200 210 100 220 210 400 300 210 The deformable structure () may include a spring structure () that is coupled to the cover () to receive an external force, and a frame structure () that supports the spring structure () and is coupled to a sensing substrate support () to position the sensing substrate () within a predetermined separation distance from the spring structure ().

220 The frame structure () can be provided as a cylindrical structure with an open top and bottom.

210 220 100 210 220 220 100 100 220 100 Therein, a spring structure () is supported on the inside of a frame structure (), and a cover () in the shape of a circular plate that is coupled to the upper side of the spring structure () can be inserted into the upper interior of the frame structure (). At this time, the inner diameter of the cylinder at the top of the frame structure () is formed to be larger than the diameter of the cover (), so that a predetermined gap can be formed between the cover () and the frame structure (), and through this design, vertical movement and tilting of the cover () due to external force can be smoothly induced.

400 220 17 18 19 20 21 22 400 220 Additionally, a sensing substrate support () can be coupled to the lower side of the frame structure (). Here, vertical sensing substrate support coupling screw holes (h, h, h, h, h, h) for screw coupling with the sensing substrate support () can be formed at regular intervals at the bottom of the frame structure ().

220 In addition, the frame structure () can be designed to have a uniform thickness on the side of the cylindrical shape, so as to minimize variables occurring during the external force transmission process.

210 100 210 320 330 340 350 360 370 300 The spring structure () is deformed according to the magnitude and direction of the external force transmitted through the cover (), and the displacement of the spring structure () is sensed through a plurality of photocouplers (,,,,,) installed on the sensing substrate ().

210 320 330 340 350 360 370 210 210 320 330 340 350 360 370 210 Accordingly, the spring structure () can be made of a material that is elastically deformable and has a high reflectivity for the light emitted from the photocoupler (,,,,,). For example, the spring structure () may be made of an elastic metal such as AL7075-T6. In this case, since the displacement of the spring structure () can be directly sensed through the photocoupler (,,,,,), a separate medium for the sensor to sense the displacement of the elastic body is not required, so not only is manufacturing and management easy, but the time and cost required for manufacturing and management can be reduced. Additionally, the 6-axis force-torque sensing apparatus can be made more compact, saving installation space. In addition, the spring structure () is not limited thereto and can be implemented with various types of materials.

210 In addition, the spring structure () can be designed to have a uniform thickness in the vertical direction to minimize variables that occur during the external force transmission process.

210 210 212 213 214 215 212 220 Additionally, the spring structure () can be provided as a cross-shaped elastic beam-type spring structure. In detail, the spring structure () may be composed of a central portion (), which is an area within a predetermined distance from the center of gravity, and at least three beam portions (,,) which extend radially in a horizontal direction from the central portion () and have their ends fixed to a frame structure ().

210 213 214 215 According to the spring structure () with a cross-shaped elastic beam-type spring structure as described above, at least one of normal deformation due to a vertical force or torque and shear deformation due to a horizontal force or torque can occur in at least one of the three beam portions (,,), depending on the magnitude and direction of the external force.

211 211 212 210 211 1 100 211 1 100 211 1 211 211 211 211 210 211 211 A protrusion () in which a vertical screw hole (h) is formed may be formed on top of the central portion () of the spring structure (). The protrusion () can be inserted into the cover through-hole (H) of the cover () from below and can be screw-coupled to an external apparatus through the screw hole (h) while inserted in the cover through-hole (H) of the cover (). Here, the protrusion () can be formed in a shape in which its outer surface corresponds to the inner surface of the cover through-hole (H), and the screw hole (h) of the protrusion () can be formed in a shape in which the upper end is open and the lower end is closed. Additionally, the screw hole (h) of the protrusion () can be formed at the top center of gravity of the spring structure (). Further, the present disclosure is not limited thereto, and the protrusion () and the screw hole (h) can be formed in various ways.

11 12 13 14 15 16 100 212 210 11 12 13 14 15 16 1 2 3 4 5 6 100 100 210 1 2 3 4 5 6 6 11 12 13 14 15 16 1 211 Additionally, vertical cover coupling screw holes (h, h, h, h, h, h) for screw coupling with the cover () may be formed in the central portion () of the spring structure (). In addition, the cover coupling screw holes (h, h, h, h, h, h) can be formed in the same number of corresponding positions as the deformable structure coupling screw holes (h, h, h, h, h, h) of the cover (), and the cover () and the spring structure () can be coupled by coupling screws to the corresponding screw holes of each pair. For example, 6 deformable structure coupling screw holes (h, h, h, h, h, h) andcover coupling screw holes (h, h, h, h, h, h) can be formed at the same distance at 60-degree intervals centered on the cover through-hole (H) and the protrusion ().

213 214 215 210 212 210 213 214 215 210 220 The beam portions (,,) of the spring structure () can be formed at equiangular intervals centered on the central portion () of the spring structure (). Preferably, three beam portions (,,) can be formed at 120-degree intervals. Accordingly, the spring structure () can be stably fixed to the frame structure () and can be deformed to reflect the directionality of the external force.

210 212 213 214 215 212 213 214 215 In addition, the spring structure () may be a single, integrally formed configuration in which the central portion () and the beam portions (,,) are integrated, or may be configured such that the central portion () and the beam portions (,,) are provided as separate components and then coupled.

210 If the spring structure () has a single configuration, it may be composed of a single material that can be elastically deformed by an external force.

212 213 214 215 210 212 213 214 215 212 213 214 215 Meanwhile, if the central portion () and the beam portions (,,) of the spring structure () are separate components, they may be composed of the same material or different materials. For example, the central portion () may be a circular plate made of a non-elastic material, and the beam portions (,,) may be made of an elastic material, or the central portion () and the beam portions (,,) may be made of elastic materials of different materials.

213 214 215 213 1 214 1 215 1 212 210 213 2 214 2 215 2 213 1 214 1 215 1 213 2 214 2 215 2 213 1 214 1 215 1 213 1 214 1 215 1 212 210 213 1 214 1 215 1 213 1 214 1 215 1 In addition, the beam portions (,,) may include vertical displacement portions (-,-,-) connected from the central portion () to the spring structure (), and horizontal displacement portions (-,-,-) extending vertically downward from one widthwise end of the vertical displacement portions (-,-,-). Here, the horizontal displacement portions (-,-,-) can be formed to a predetermined length along the longitudinal direction of the vertical displacement portions (-,-,-). Here, the longitudinal direction of the vertical displacement portions (-,-,-) is a horizontal direction connected from the central portion () to the spring structure (), and the width direction of the vertical displacement portions (-,-,-) is a horizontal direction that is perpendicular to the longitudinal direction of the vertical displacement portions (-,-,-).

213 1 214 1 215 1 213 2 214 2 215 2 213 2 214 2 215 2 213 1 214 1 215 1 210 In addition, the vertical displacement portions (-,-,-) can be formed as a linear structure with a predetermined width and vertical height and having parallel top and bottom surfaces, and the horizontal displacement portions (-,-,-) can be formed as a thin rectangular plate-shaped structure. In addition, the vertical height of the horizontal displacement portions (-,-,-) can be formed to be greater than the vertical height of the vertical displacement portions (-,-,-), and can be designed to be longer than the vertical deformation range of the spring structure () due to an external force.

213 1 214 1 215 1 213 2 214 2 215 2 213 214 215 213 1 214 1 215 1 320 330 340 213 214 215 213 2 214 2 215 2 350 360 370 According to the configuration of the vertical displacement portions (-,-,-) and horizontal displacement portions (-,-,-) as described above, the vertical displacement of each beam portion (,,) can be measured by sensing the vertical deformation of the vertical displacement portions (-,-,-) through the vertical displacement photocouplers (,,). In addition, the horizontal displacement of each beam portion (,,) can be measured by sensing the horizontal deformation of the horizontal displacement portions (-,-,-) through the horizontal displacement photocouplers (,,).

213 214 215 213 214 215 213 214 215 213 214 215 220 210 220 a a a a a a In addition, support portions (,,) extending in the width direction on both sides of the beam portions (,,) are provided at the longitudinal ends of the beam portions (,,), and as both ends of the support portions (,,) are fixed to the frame structure (), the spring structure () can be coupled to the frame structure ().

210 220 220 220 Additionally, the spring structure () may be formed integrally with the frame structure (), or may be provided as a separate component from the frame structure () and coupled to the frame structure ().

210 220 220 210 220 210 210 220 200 300 Here, when the spring structure () and the frame structure () are integrally formed, the material of the frame structure () may be composed of an elastic material identical to the material of the spring structure (). In this case, since the frame structure () and the spring structure () are composed of the same material, the time and cost required for manufacturing and management can be reduced. In addition, since not only the spring structure () but also the frame structure () is elastically deformed by an external force, a wider variety of external forces can be reflected in the deformation of the deformable structure (), thereby improving the force-torque measurement range of the sensing substrate () and increasing its utility.

210 220 220 210 220 220 300 Meanwhile, when the spring structure () and the frame structure () are provided as separate structures and then coupled, the material of the frame structure () may be the same as or different from the material of the spring structure (). For example, the frame structure () may be composed of a rigid, non-elastic metal material. In this case, the frame structure () can remain undeformed under an external force and maintain a stable, fixed structure, thereby minimizing the force-torque measurement variables of the sensing substrate () and increasing accuracy.

400 200 300 300 210 The sensing substrate support () is coupled to the deformable structure () on its upper side and supports the sensing substrate () on its inner side, thereby positioning the sensing substrate () within a predetermined gap below the spring structure ().

400 300 220 200 Specifically, the sensing substrate support () is formed as a cylindrical structure with an accommodating space (s) formed on the inside and an open top, such that the sensing substrate () is coupled to the accommodating space (s), and the open top can be coupled to the frame structure () of the deformable structure ().

200 300 200 300 200 Here, the gap between the deformable structure () and the sensing substrate () can be set differently depending on the deformation range of the deformable structure (), and can be set to maintain a non-contact state with the sensing substrate () even when the deformable structure () is deformed to its maximum.

5 6 7 8 9 10 220 400 5 6 7 8 9 10 17 18 19 20 21 22 220 400 5 6 7 8 9 10 17 18 19 20 21 22 5 6 7 8 9 10 Additionally, deformable structure coupling through-holes (H, H, H, H, H, H) for coupling with the frame structure () may be formed at regular intervals on the top of the sensing substrate support (). The deformable structure coupling through-holes (H, H, H, H, H, H) can be provided in a number and shape corresponding to the sensing substrate support coupling screw holes (h, h, h, h, h, h) of the frame structure (). Here, screws (not shown) can be inserted from the lower side of the sensing substrate support () through the deformable structure coupling through-holes (H, H, H, H, H, H) and fastened to the sensing substrate support coupling screw holes (h, h, h, h, h, h), respectively. In addition, the deformable structure coupling through-holes (H, H, H, H, H, H) can be formed to have a step that is narrower at the top than at the bottom, so that the screw head can be caught and fixed on the step.

23 24 25 300 400 23 24 25 2 3 4 300 23 24 25 2 3 4 300 Additionally, substrate coupling screw holes (h, h, h) for coupling with the sensing substrate () can be formed at regular intervals on the inside of the sensing substrate support (). The substrate coupling screw holes (h, h, h) can be provided in a number and shape corresponding to the sensing substrate support coupling through-holes (H, H, H) of the sensing substrate (), and can be provided at corresponding positions. Here, screws (not shown) can be fastened to the substrate coupling screw holes (h, h, h) through the sensing substrate support coupling through-holes (H, H, H) from the upper side of the sensing substrate (), respectively.

400 401 300 Additionally, the sensing substrate support () may further be provided with an external connection portion () through which a wire connected to the sensing substrate () can be connected to an external apparatus.

300 320 330 340 350 360 370 310 The sensing substrate () may be configured with a plurality of photocouplers (,,,,,) on a substrate () on which a conductive pattern is formed.

310 310 The substrate () is for physically mounting electronic components and providing electrical connections to form an electronic circuit, may be a Printed Circuit Board (PCB), and may be provided as any one of a Flexible Printed Circuit Board (FPCB), a Ceramic Substrate, a Low Temperature Co-fired Ceramic (LTCC), a Metal Core PCB (MCPCB), and a Glass Fiber Substrate. Additionally, it may be a Hybrid Substrate composed of a mixture of various substrate materials, or may be composed of a Multilayer Substrate. Additionally, the substrate () may be provided in a circular plate shape, and for example, may be provided with a diameter of 31 mm. Additionally, without limitation, various types of substrates may be provided in various shapes.

2 3 4 400 310 300 2 3 4 23 24 25 400 Additionally, sensing substrate support coupling through-holes (H, H, H) for coupling with the sensing substrate support () may be formed at regular intervals at the edge of the substrate () of the sensing substrate (). The sensing substrate support coupling through-holes (H, H, H) may be provided in a number and shape corresponding to the substrate coupling screw holes (h, h, h) of the sensing substrate support () and may be provided at corresponding positions.

320 330 340 350 360 370 321 331 341 351 361 371 322 332 342 352 362 372 The photocoupler (,,,,,) is configured to include a light-emitting element (,,,,,) and a light-receiving element (,,,,,).

321 331 341 351 361 371 393 321 331 341 351 361 371 The light-emitting element (,,,,,) is configured to emit a predetermined light at regular time intervals or according to a light-emission signal received from a data processing unit (). For example, the light-emitting element (,,,,,) may be an LED that emits infrared rays.

322 332 342 352 362 372 The light-receiving element (,,,,,) is configured to sense light and convert it into an electrical signal according to its intensity. For example, it may be composed of any one of a photodiode, a phototransistor, and a photothyristor.

320 330 340 350 360 370 321 331 341 351 361 371 210 210 322 332 342 352 362 372 393 320 330 340 350 360 370 393 210 322 332 342 352 362 372 320 330 340 350 360 370 210 210 Each photocoupler (,,,,,) can be designed to emit a predetermined light from a light-emitting element (,,,,,) toward a spring structure () at a predetermined angle, collect the light reflected from the spring structure () at a light-receiving element (,,,,,), and transmit an electrical signal corresponding to the intensity of the collected light to a data processing unit (). For example, by processing light emission and reception at a rate of 1 kHz or higher of a photocoupler (,,,,,) and transmitting the sampling data to a data processing unit (), the displacement of the spring structure () can be sensed in real time. Here, the intensity of light collected at the light-receiving element (,,,,,) is measured differently depending on the gap between each photocoupler (,,,,,) and the spring structure (), and thus serves as position information indicating the displacement of the spring structure ().

320 330 340 350 360 370 310 210 At least 6 photocouplers (,,,,,) can be arranged at predetermined intervals on the substrate (), and can sense the displacement of the spring structure () at each location.

320 330 340 350 360 370 213 214 215 210 320 330 340 350 360 370 213 214 215 For example, at least one photocoupler (,,,,,) may be disposed below each of the three beam portions (,,) of the spring structure (), so that the photocouplers (,,,,,) may be designed to sense the displacement of the beam portions (,,) at their corresponding positions.

320 330 340 350 360 370 320 330 340 210 350 360 370 210 320 330 340 350 360 370 210 In addition, the photocouplers (,,,,,) may be provided as vertical displacement photocouplers (,,) that sense vertical deformation of the spring structure () and horizontal displacement photocouplers (,,) that sense horizontal deformation of the spring structure (). Here, when the vertical displacement photocouplers (,,) and the horizontal displacement photocouplers (,,) are arranged in pairs adjacent to each other, the vertical deformation and the horizontal deformation of the spring structure () can be sensed simultaneously at a predetermined position.

320 330 340 350 360 370 213 214 215 210 Using this, a pair of vertical displacement photocouplers (,,) and horizontal displacement photocouplers (,,) can be disposed adjacent to each beam portion (,,) of the spring structure ().

4 5 FIGS.and 4 FIG. 5 FIG. 5 FIG. 213 214 215 320 330 340 350 360 370 200 213 214 215 210 300 320 330 340 350 360 370 310 320 330 340 350 360 370 213 214 215 212 210 213 214 215 213 214 215 213 1 214 1 215 1 illustrate a schematic arrangement between the beam portions (,,) and the photocouplers (,,,,,).is a top-down view illustrating a configuration in which a deformable structure () with three beam portions (,,) on a spring structure () is disposed above a sensing substrate (), wherein photocouplers (,,,,,) are configured on a substrate (). In addition,is a view of a configuration in which a pair of vertical displacement photocouplers (,,) and horizontal displacement photocouplers (,,) are disposed adjacent to the beam portions (,,), as viewed from the central portion () of the spring structure () toward the longitudinal direction of the beam portions (,,). Here, the longitudinal direction of the beam portions (,,) refers to the longitudinal direction of the vertical displacement portions (-,-,-), and is the direction penetrating the plane of the drawing in.

4 5 FIGS.and 320 330 340 213 1 214 1 215 1 213 214 215 350 360 370 213 2 214 2 215 2 320 213 1 213 350 213 2 213 330 214 1 214 360 214 2 214 340 215 1 215 370 215 2 215 Referring to, vertical displacement photocouplers (,,) may be disposed below the vertical displacement portions (-,-,-) of the beam portions (,,), and horizontal displacement photocouplers (,,) may be disposed horizontally outward of the horizontal displacement portions (-,-,-). Specifically, a first vertical displacement photocoupler () may be disposed below a vertical displacement portion (-) of a first beam portion (), and a first horizontal displacement photocoupler () may be disposed below a horizontal displacement portion (-) of the first beam portion (). Additionally, a second vertical displacement photocoupler () may be disposed below the vertical displacement portion (-) of the second beam portion (), and a second horizontal displacement photocoupler () may be disposed below the horizontal displacement portion (-) of the second beam portion (). Additionally, a third vertical displacement photocoupler () may be disposed below the vertical displacement portion (-) of the third beam portion (), and a third horizontal displacement photocoupler () may be disposed below the horizontal displacement portion (-) of the third beam portion ().

321 331 341 322 332 342 320 330 340 213 1 214 1 215 1 351 361 371 352 362 372 350 360 370 213 2 214 2 215 2 213 1 214 1 215 1 213 214 215 320 330 340 213 2 214 2 215 2 350 360 370 Here, the light-emitting element (,,) and the light-receiving element (,,) of each vertical displacement photocoupler (,,) can be arranged parallel to the bottom surface (A) of each vertical displacement portion (-,-,-). Likewise, the light-emitting element (,,) and the light-receiving element (,,) of each horizontal displacement photocoupler (,,) can be arranged parallel to the horizontally outward surface (B) of each horizontal displacement portion (-,-,-). In addition, the vertical reference gap (D), which is the gap between the vertical displacement portions (-,-,-) of each beam portion (,,) and the vertical displacement photocouplers (,,) when no external force is applied, can be designed to have a constant predetermined value. Likewise, the horizontal reference gap (d), which is the gap between the horizontal displacement portions (-,-,-) and the horizontal displacement photocouplers (,,) when no external force is applied, can be designed to have a constant predetermined value. Here, the vertical reference gap (D) and the horizontal reference gap (d) may be designed to have the same value or different values.

321 331 341 320 330 340 213 1 214 1 215 1 322 332 342 320 330 340 213 1 214 1 215 1 320 330 340 213 1 214 1 215 1 351 361 371 350 360 370 213 2 214 2 215 2 352 362 372 350 360 370 213 2 214 2 215 2 350 360 370 213 2 214 2 215 2 According to the arrangement as described above, by analyzing the light emitted from the light-emitting element (,,) of the vertical displacement photocoupler (,,), reflected from the bottom surface (A) of the vertical displacement portion (-,-,-), and then collected by the light-receiving element (,,) of the vertical displacement photocoupler (,,), a change in the gap between the vertical displacement portion (-,-,-) and the vertical displacement photocoupler (,,) can be sensed, thereby measuring the vertical displacement of the vertical displacement portion (-,-,-). Likewise, by analyzing the light emitted from the light-emitting element (,,) of the horizontal displacement photocoupler (,,), reflected from the outward surface (B) of the horizontal displacement portion (-,-,-), and then collected by the light-receiving element (,,) of the horizontal displacement photocoupler (,,), a change in the gap between the horizontal displacement portion (-,-,-) and the horizontal displacement photocoupler (,,) can be sensed, thereby measuring the horizontal displacement of the horizontal displacement portion (-,-,-).

1 210 210 320 330 340 350 360 370 320 330 340 350 360 370 Meanwhile, since the 6-axis force-torque sensing apparatus () according to the present disclosure is structured such that an external force is applied from the upper side of the spring structure (), the vertical deformation of the spring structure () occurs within a relatively large range, and the horizontal deformation occurs within a relatively small range. Accordingly, the vertical displacement photocoupler (,,) can be provided as an optical sensor capable of stably measuring a large range of displacement, and can be, for example, a TCRT1000 model. Additionally, the horizontal displacement photocoupler (,,) may be provided as an optical sensor capable of precisely sensing a small range of displacement with a sensitive and fast response, and may be, for example, a QRE1113GR model. In addition, the present disclosure is not limited thereto, and various types of vertical displacement photocouplers (,,) and horizontal displacement photocouplers (,,) may be provided.

391 393 394 395 396 310 300 300 300 6 FIG. 7 FIG. Additionally, a communication unit (), a data processing unit (), a temperature sensor (), a voltage regulator (), and a data processing unit debugger () may be further configured on the substrate () of the sensing substrate (). In this regard,shows the top side of the sensing substrate (), andshows the bottom side of the sensing substrate ().

391 320 330 340 350 360 370 391 391 The communication unit () is a communication module configured to communicate with other apparatuses and can transmit data measured by the photocouplers (,,,,,) to a predetermined external apparatus. For example, the communication unit () may be configured as a CAN transceiver, in which case a 5-Mbps CAN FD communication method may be used. In addition, the communication unit () is not limited to a specific communication method, and various types of communication modules and connection methods can be utilized.

393 322 332 342 352 362 372 320 330 340 350 360 370 210 The data processing unit () receives an electrical signal corresponding to the intensity of light measured by the light-receiving element (,,,,,) of the photocoupler (,,,,,), calculates the displacement of the spring structure () based thereon, and can calculate the magnitude and direction of the external force using this displacement.

393 392 393 1 394 393 Additionally, the data processing unit () can receive measurement data from the inertial measurement unit () and reflect it into the calculation of the magnitude and direction of the external force. In this process, the temperature compensation function of the data processing unit () is reflected in the calculation of the magnitude and direction of the external force, thereby reducing measurement errors due to temperature changes. Here, the temperature value of the 6-axis force-torque sensing apparatus () measured by the temperature sensor () can be transmitted to the data processing unit ().

393 300 Additionally, the data processing unit () can be connected to other components configured on the sensing substrate () to control the entire sensing system for smooth operation.

393 An example of the data processing unit () is a Microcontroller Unit (MCU), but various types of data processing units may be used without being limited thereto.

393 320 330 340 350 360 370 394 310 320 330 340 350 360 370 394 393 Additionally, the data processing unit () may be configured to include an Analog-to-Digital Converter (ADC) that converts an analog signal measured from the photocouplers (,,,,,) and the temperature sensor () into a digital signal. For example, the analog-to-digital converter may be designed to process digital signals at 16 bits and 3.6 MSPS. Additionally, an analog-to-digital converter may be separately provided on the substrate () to transmit analog signals measured from the photocouplers (,,,,,) and the temperature sensor () to the data processing unit ().

394 300 394 The temperature sensor () is a sensor that measures the temperature of the sensing substrate () and can be designed to enable precise temperature measurement. For example, a temperature sensor () having a temperature accuracy of 0.1° C. can be applied.

395 300 395 The voltage regulator () is a component for stably supplying voltage to components on the sensing substrate () through power conversion and minimizing noise. For example, the voltage regulator () may be a Low Dropout Regulator (LDO), but various types of voltage regulators may be provided without being limited thereto.

396 393 396 The data processing unit debugger () is a component for debugging, analyzing, and modifying the program state of the data processing unit (). For example, the data processing unit debugger () may be an MCU debugger, but is not limited thereto and may be provided in various ways.

300 401 400 300 In addition, the sensing substrate () can be connected to an external apparatus such as a power supply, a display apparatus, or a computing apparatus through an external connection portion () of the sensing substrate support (). For example, 5V, 0.8 W of power can be supplied to the sensing substrate () through an external power supply.

397 310 391 397 300 Additionally, a CAN/PW connector () may be further configured on the substrate (). In this case, a CAN communication signal can be transmitted from the communication unit () to an external apparatus through the CAN/PW connector (), and at the same time, power can be supplied to the sensing substrate () from an external power supply.

310 1 Additionally, an inertial measurement unit may be further configured on the substrate (). The inertial measurement unit is a module that measures 3-axis acceleration and angular velocity, and can provide position and movement data of the 6-axis force-torque sensing apparatus () in real time.

393 The measurement data of the inertial measurement unit can be transmitted to the data processing unit () and incorporated into the calculation of the 6-axis force-torque measurement accuracy, thereby improving the accuracy of measuring the magnitude and direction of an external force, especially in a dynamic environment.

394 Additionally, the temperature compensation function of the inertial measurement unit is incorporated into the 3-axis acceleration and angular velocity measurements, which can reduce measurement errors due to temperature changes. For this purpose, the temperature value measured by the temperature sensor () may be designed to be transmitted to the inertial measurement unit.

An example of an inertial measurement unit is an Inertial Measurement Unit (IMU) that includes an accelerometer (not shown) and a gyroscope (not shown), but various types of inertial measurement units may be used without being limited thereto.

1 300 400 300 Additionally, although not shown in the drawings, the 6-axis force-torque measuring apparatus () may be configured to include a battery apparatus. In this case, the sensing substrate () is connected to the battery apparatus and can be driven without external power. For example, a battery apparatus may be accommodated in the accommodating space (s) of the sensing substrate support () to supply power of 5V, 0.8 W to the sensing substrate ().

1 320 330 340 350 360 370 393 8 13 FIGS.to Hereinafter, a method for calculating the direction and magnitude of an external force using a 6-axis force-torque sensing apparatus () according to the first embodiment of the present disclosure will be described with reference to. Here, the described calculation method and formulas can be included in a data processing process that calculates the direction and magnitude of an external force based on an electrical signal corresponding to the intensity of light collected through a light-receiving element of a photocoupler (,,,,,) in a data processing apparatus ().

8 FIG.A 4 FIG. 8 FIG.B 200 213 214 215 210 300 213 214 215 213 214 215 a a a is a top-down view of a configuration in which a deformable structure (), having three beam portions (,,) formed at 120-degree intervals on a spring structure (), is disposed above a sensing substrate (), as described in. In addition,shows a perspective view for explaining the length setting of the beam portions (,,) and the support portions (,,).

8 FIG.A 210 213 213 214 210 Referring to, with respect to the center of the spring structure (), the longitudinal direction of the first beam portion () can be set as the x-axis, and the direction orthogonal to the x-axis in the plane between the first beam portion () and the second beam portion () can be set as the y-axis. Additionally, the upward direction of the spring structure (), which is orthogonal to the x-axis and y-axis, i.e., the direction emerging from the plane of the drawing, can be set as the z-axis.

y z x y z According to the x-axis, y-axis, and z-axis direction settings as described above, the x-axis component x, y-axis component F, and z-axis component Fof the external force can be set. Additionally, an x-axis-based rotational moment M, a y-axis-based rotational moment M, and a z-axis-based rotational moment Mcaused by an external force can be set.

x y z x y z 320 350 330 360 340 370 The x-axis component F, y-axis component F, and z-axis component Fof the external force, set as described above, and the x-axis-based rotational moment M, y-axis-based rotational moment M, and z-axis-based rotational moment Mgenerated by the external force can be measured as shown in Table 1 below through the first vertical displacement photocoupler (), the first horizontal displacement photocoupler (), the second vertical displacement photocoupler (), the second horizontal displacement photocoupler (), the third vertical displacement photocoupler (), and the third horizontal displacement photocoupler (), respectively.

TABLE 1 First First Second Second Third Third vertical horizontal vertical horizontal vertical horizontal displacement displacement displacement displacement displacement displacement photocoupler photocoupler photocoupler photocoupler photocoupler photocoupler (320) (350) (330) (360) (340) (370) x F ~ ~ ~ + + ~ − − y F ~ + + ~ − ~ + z F − ~ − ~ − ~ x M ~ ~ + + ~ − − ~ y M + + ~ − − ~ ~ z M ~ + ~ + ~ +

320 330 340 350 360 370 210 320 330 340 350 360 370 210 Here, the plus (+) symbol means that a positive displacement is calculated as the distance between each photocoupler (,,,,,) and the spring structure () increases from the vertical reference gap (D) or the horizontal reference gap (d) due to an external force. Also, the minus (−) symbol means a case in which a negative displacement is calculated as the distance between each photocoupler (,,,,,) and the spring structure () decreases from the vertical reference gap (D) or the horizontal reference gap (d) due to an external force.

320 330 340 350 360 370 210 320 330 340 350 360 370 210 In addition, the double plus (++) symbol means that a positive displacement with a large absolute value is calculated compared to the case of the plus (+) symbol as the distance between each photocoupler (,,,,,) and the spring structure () greatly increases from the vertical reference gap (D) or the horizontal reference gap (d) due to an external force. In addition, the minus minus (−−) symbol means a case in which a negative displacement having a large absolute value is produced compared to the case of the minus (−) symbol as the distance between each photocoupler (,,,,,) and the spring structure () is greatly reduced from the vertical reference distance (D) or the horizontal reference distance (d) due to an external force.

320 330 340 350 360 370 210 In addition, the tilde (˜) symbol means that the distance between each photocoupler (,,,,,) and the spring structure () is maintained within a predetermined error range based on the vertical reference gap (D) or the horizontal reference gap (d), and thus no significant displacement is calculated.

210 360 214 2 360 370 215 2 370 For example, when an external force in the x-axis direction is applied, the spring structure () is deformed along the x-axis, and accordingly, the distance between the second horizontal displacement photocoupler () and the second horizontal displacement portion (-), as measured by the second horizontal displacement photocoupler (), is greatly increased from the horizontal reference gap (d), so that a large positive displacement can be calculated. Additionally, the measured distance between the third horizontal displacement photocoupler () and the third horizontal displacement portion (-), as measured by the third horizontal displacement photocoupler (), is greatly decreased from the horizontal reference gap (d).

210 320 213 1 320 330 214 1 330 340 215 1 340 As another example, when an external force in the z-axis direction is applied, the spring structure () is deformed along the z-axis, and accordingly, the measured distance between the first vertical displacement photocoupler () and the first vertical displacement portion (-), as measured by the first vertical displacement photocoupler (), slightly decreases from the vertical reference gap (D). Likewise, the measured distance between the second vertical displacement photocoupler () and the second vertical displacement portion (-), as measured by the second vertical displacement photocoupler (), and the measured distance between the third vertical displacement photocoupler () and the third vertical displacement portion (-), as measured by the third vertical displacement photocoupler (), also slightly decrease from the vertical reference gap (D).

x y z x y z 210 320 350 330 360 340 370 As shown in Table 1 above, for the x-axis component F, y-axis component F, and z-axis component Fof the external force, and the x-axis-based rotational moment M, y-axis-based rotational moment M, and z-axis-based rotational moment Mgenerated by the external force, the displacement of the spring structure () measured through the first vertical displacement photocoupler (), the first horizontal displacement photocoupler (), the second vertical displacement photocoupler (), the second horizontal displacement photocoupler (), the third vertical displacement photocoupler (), and the third horizontal displacement photocoupler () can be expressed in the form of a 6×6 matrix. The 6×6 matrix calculated as above is called the Sensor Response Matrix, and the magnitude and direction of the external force can be calculated from this.

x y z x y z 320 350 330 360 340 370 In addition, based on the sensor response matrix, a Calibration Matrix G representing the conversion relationship between the x-axis component F, the y-axis component F, the z-axis component Fof the external force, the x-axis-based rotational moment M, the y-axis-based rotational moment M, and the z-axis-based rotational moment Mgenerated by the external force, and the output signals of the first vertical displacement photocoupler (), the first horizontal displacement photocoupler (), the second vertical displacement photocoupler (), the second horizontal displacement photocoupler (), the third vertical displacement photocoupler (), and the third horizontal displacement photocoupler () can be derived.

210 320 330 340 350 360 370 The calibration matrix G is a core mathematical model of the 6-axis force-torque sensor and connects the physical external force (F) applied to the spring structure () and the voltage (V) output from the photocouplers (,,,,,), as shown in Equations 1 and 2.

320 330 340 350 360 370 Here, ΔF is the change in external force, and ΔV is the change in voltage output from the photocouplers (,,,,,).

320 330 340 350 360 370 In addition, according to Equations 1 and 2, the larger the calibration matrix G value, the higher the sensitivity of the photocoupler (,,,,,) in response to external force. That is, the larger the calibration matrix G value, the more sensitively it responds to external force, allowing even small changes in external force to be measured precisely.

210 210 213 214 215 213 214 215 213 214 215 220 210 1 2 a a a Additionally, the smaller the Condition Number Con(G) of the calibration matrix G, the better the numerical stability of the calibration matrix G. Here, the Condition Number Con(G) of the matrix G can be adjusted by adjusting the geometric design and physical characteristics of the spring structure (). For example, the geometric design of the spring structure () can be adjusted by adjusting the length (l) of the beam portions (,,) and the length (l) of the support portions (,,) where the beam portions (,,) are coupled to and supported by the frame structure (). Additionally, the physical properties can be adjusted by adjusting the elastic modulus and shear modulus of the spring structure ().

Therefore, by maximizing the calibration matrix G and minimizing the condition number Con(G) of the calibration matrix G, thereby minimizing the value Con(G)/|G|, a 6-axis force torque sensing apparatus with high sensitivity and stability can be provided.

8 8 FIGS.A andB 1 2 3 4 5 6 213 1 214 1 215 1 213 2 214 2 215 2 In addition, referring to, the displacement Δdof the first vertical displacement portion (-), the displacement Δdof the second vertical displacement portion (-), the displacement Δdof the third vertical displacement portion (-), the displacement Δdof the first horizontal displacement portion (-), the displacement Δdof the second horizontal displacement portion (-), and the displacement Δdof the third horizontal displacement portion (-) can be calculated as in Equations 3 to 8 below.

dFzv s1 1 2 3 s1 320 330 340 210 320 330 340 210 321 331 341 322 332 342 320 330 340 213 1 214 1 215 1 210 320 330 340 Here, Kis the position radius of the vertical displacement photocouplers (,,), which is the horizontal distance from the center of the spring structure () to the vertical displacement photocouplers (,,). Specifically, rmay be the horizontal distance from the center of the spring structure () to the center point between the light-emitting element (,,) and the light-receiving element (,,) of the vertical displacement photocouplers (,,). According to this setting, the vertical displacement (Δd, Δd, Δd) of the vertical displacement portions (-,-,-) located at a distance rfrom the center of the spring structure () can be measured through the vertical displacement photocouplers (,,).

s2 s2 4 5 6 s2 350 360 370 210 350 360 370 210 351 361 371 352 362 372 350 360 370 213 2 214 2 215 2 210 350 360 370 Additionally, ris the position radius of the horizontal displacement photocouplers (,,), which is the horizontal distance from the center of the spring structure () to the horizontal displacement photocouplers (,,). Specifically, rmay be the distance from the center of the spring structure () to the center point between the light-emitting element (,,) and the light-receiving element (,,) of the horizontal displacement photocouplers (,,). According to this setting, the horizontal displacement (Δd, Δd, Δd) of the horizontal displacement portions (-,-,-) located at a distance rfrom the center of the spring structure () can be measured through the horizontal displacement photocouplers (,,).

213 2 214 2 215 2 213 214 215 213 214 215 210 210 210 213 2 214 2 215 2 a a a Additionally, h is the vertical length of the horizontal displacement portions (-,-,-). For example, when the beam portions (,,) and support portions (,,) of the spring structure () are formed to have a constant thickness in the vertical direction, h may be a numerical value indicating the vertical thickness of the spring structure (). Here, the vertical thickness h of the spring structure () is a value excluding the vertical length of the horizontal displacement portions (-,-,-).

310 350 360 370 310 351 361 371 352 362 372 350 360 370 213 2 214 2 215 2 350 360 370 Additionally, c is the vertical distance from the substrate () to the horizontal displacement photocouplers (,,). Specifically, c may be the distance from the substrate () to the vertical center point of the light-emitting element (,,) and the light-receiving element (,,) of the horizontal displacement photocouplers (,,). For example, horizontal displacement portions (-,-,-) with h of 6 mm may be provided, and horizontal displacement photocouplers (,,) may be provided such that c is 0.04 mm.

213 2 214 2 215 2 350 360 370 213 2 214 2 215 2 350 360 370 In addition, h/2-c represents the vertical offset distance between the vertical center of the horizontal displacement portions (-,-,-) and the vertical center of the horizontal displacement photocouplers (,,), and is a value for mathematically correcting the positional deviation between the horizontal displacement portions (-,-,-) and the horizontal displacement photocouplers (,,) to minimize measurement error.

rMxv s1 dFzv s1 213 1 214 1 215 1 320 330 340 213 1 214 1 215 1 320 330 340 Additionally, kmay be a torsional spring constant of the vertical displacement portions (-,-,-) due to x-axis and y-axis rotational moments at the position radius rof the vertical displacement photocouplers (,,). Additionally, Kmay be a spring constant corresponding to the z-axis deformation of the vertical displacement portions (-,-,-) at the position radius rof the vertical displacement photocouplers (,,).

rMxh s20 dFyh s2 rMzh s2 213 2 214 2 215 2 350 360 370 213 2 214 2 215 2 350 360 370 213 2 214 2 215 2 350 360 370 Additionally, Kmay be a spring constant corresponding to the deformation of the horizontal displacement portion (-,-,-) due to the x-axis and y-axis rotational moments at the position radius rf the horizontal displacement photocoupler (,,). Additionally, Kmay be a spring constant corresponding to the deformation of the horizontal displacement portions (-,-,-) due to x-axis and y-axis rotational moments at the position radius rof the horizontal displacement photocouplers (,,). Additionally, Kmay be a spring constant corresponding to the deformation of the horizontal displacement portions (-,-,-) caused by the force in the y-axis direction at the position radius rof the horizontal displacement photocouplers (,,).

9 FIG.A 9 FIG.B 1 2 3 0 1 2 3 1 2 3 0 0 213 210 214 215 210 210 In addition,illustrates an embodiment of a first beam portion deformation force (f), which is a deformation force acting on a first beam portion () of a spring structure () by an external force; a second beam portion deformation force (f), which is a deformation force acting on a second beam portion (); and a third beam portion deformation force (f), which is a deformation force acting on a third beam portion (). Additionally, the total deformation force (F) of the spring structure (), which is the sum of the first beam portion deformation force (f), the second beam portion deformation force (f), and the third beam portion deformation force (f), is shown.illustrates a vector composition diagram in which the first beam portion deformation force (f), the second beam portion deformation force (f), and the third beam portion deformation force (f) are vectorially combined to form a total deformation force (F). The total deformation force (F) represents the overall response of the spring structure () to the external force.

F 0 0 210 In this regard, the following Equation 9 shows a method for calculating the total displacement Δdof the spring structure () due to the total deformation force (F).

f 1 1 f 2 2 f 1 3 0 210 Here, Δdis the displacement due to the first beam portion deformation force (f), Δdis the displacement due to the second beam portion deformation force (f), and Δdis the displacement due to the third beam portion deformation force (f). Additionally, kis a spring Stiffness Coefficient determined according to the material and geometric characteristics of the spring structure ().

9 FIG.A 9 FIG.B 210 0 Referring to,and Equation 9, the spring structure () has the same spring stiffness in the x-axis and y-axis directions due to isotropy, which can simplify calculations. That is, by calculating the linear spring stiffness and torsional spring stiffness of the x-axis, the linear spring stiffness and torsional spring stiffness of the y-axis can be obtained. Accordingly, it is sufficient to calculate the spring stiffness of four axes—i.e., the linear and torsional spring stiffness of the x-axis or y-axis, and the linear and torsional spring stiffness of the z-axis-without having to calculate the spring stiffness of all 6 axes. In particular, the linear stiffness coefficients of the x-axis and y-axis can be expressed as a single constant k, which can further simplify the calculation.

F z z 10 10 FIGS.A andB Hereinafter, a method for obtaining the linear spring stiffness coefficient kin the z-axis direction due to the z-axis component Fof the external force is described with reference to.

10 10 FIGS.A andB F z z 210 are diagrams schematically showing that a vertical displacement Δdof a spring structure () occurs due to the z-axis component Fof an external force.

10 FIG.A 10 FIG.A 212 210 213 214 215 212 210 213 214 215 213 214 215 212 213 214 215 213 214 215 213 214 215 213 214 215 220 210 210 a a a a a a a a a a a a z F z In, a circular figure representing the central portion () of the spring structure (); lines EA, DC, and FB representing beam portions (,,) connected from the central portion () of the spring structure () to support portions (,,); and lines PQ, HG, and JI representing the support portions (,,) are shown. Here, points E, D, and F are connection points between the central portion () and each beam portion (,,); points A, C, and B are connection points between each beam portion (,,) and each support portion (,,); and points Q, G, and I are fixed points whose positions are fixed as each support portion (,,) is coupled to the frame structure (). Hereinafter, in this specification, line EA, line DC, and line FB are referred to as beam portion EA, beam portion DC, and beam portion FB, respectively, and line PQ, line HG, and line JI are referred to as support portion PQ, support portion HG, and support portion JI, respectively. In addition,shows the z-axis component Fof the external force applied to the spring structure () and the corresponding vertical displacement Δdof the spring structure ().

10 FIG.B D D z 212 212 shows an embodiment in which a vertical force Fand a rotational moment Mare applied to point D by the z-axis component Fof an external force. In this case, point D moves vertically downward, the beam portion DC tilts downward toward the central portion (), the support portion HG bends vertically downward, and point C moves downward toward the central portion (). Additionally, rotational deformation occurs in the support portion HG and the beam portion DC, so that the beam portion DC can tilt downward by a predetermined angle $\theta$ with respect to point C.

F z D 210 Accordingly, the vertical displacement Δdof the spring structure () caused by the vertical force Fapplied to point D can be calculated as in Equation 10 below.

z1 D Here, δis the displacement caused by the vertical force F, and

D 1 1 2 20 8 FIG.B is the displacement caused by the rotational moment M. In addition, l′is the distance from the rotation center C of the beam portion DC to the displacement point D, which is the effective rotational distance of the beam portion DC, and can be the sum of the length lof the beam portion and the horizontal thickness bof the support portion. Here, the horizontal thickness bf the support portion can be confirmed with reference to.

z1 z2 Additionally, δ, δ, and the inclination angle θ of the beam portion DC can be calculated as in Equations 11 to 13 below.

2 1 2 Here, l′is the distance between the fixed points G and H at both ends of the support portion GH, and can be a value obtained by subtracting the horizontal thickness bof the beam portion from the length lof the support portion.

210 Additionally, E is the Elastic Modulus of the spring structure (), and G is the Shear Modulus.

1 1 2 2 2 In addition, Sdenotes the cross-sectional area bh of the beam portion, Sdenotes the cross-sectional area bh of the support portion, and k is the Shear Coefficient calculated as 10/(12+bh).

12 1 22 2 3 3 Additionally, Iis the z-axis second moment of area (Moment of Inertia) of the beam portion, calculated as bh/12, and Iis the z-axis second moment of area (Moment of Inertia) of the support portion, calculated as bh/12.

z D E F z 210 In addition, according to the z-axis component Fof the external force, the vertical force Fapplied to point D, the vertical force Fapplied to point E, and the vertical force Fapplied to point F are identical due to the symmetry of the spring structure (). Accordingly, the z-axis component Fof the external force can be calculated as shown in Equation 14 below.

z F z z D D E E F F 210 Accordingly, the vertical displacements of points D, E, and F due to the z-axis component Fof the external force all occur identically as Δd. That is, the central portion of the spring structure () moves in the vertical direction without a change in inclination due to the z-axis component Fof the external force, and accordingly, the inclination angles of points D, E, and F become 0. In this regard, the following Equation 15 shows a conditional expression in which the inclination angle θof point D due to the vertical force Fis 0. In addition, the conditional expression of Equation 15 is applied in the same manner to the inclination angle θof point E due to the vertical force Fand the inclination angle θof point F due to the vertical force F.

z F z In addition, the relationship between the z-axis component Fof the external force and the corresponding vertical displacement Δdat point D can be defined as in Equation 16 below.

In addition, the displacement distribution function

z in the x-axis direction due to the z-axis component Fof the external force can be defined as in Equation 17 below.

Here, if

F z D z becomes Δd, and since F=F/3, Equation 18 below can be derived through Equations 16 and 17.

F z 210 Here, kis the reciprocal of the spring constant of the spring structure (), which is the spring stiffness coefficient in the z-axis direction.

1 D D z D D 1 D 1 In addition, ais the effective distance from point D to the axis of the rotational moment M, and the relationship between the vertical force Fat point D due to the z-axis component Fof the external force and the rotational moment Msatisfies M=a*F. Here, acan be defined as

M x x 11 111 FIGS.A andB Hereinafter, a method for obtaining the torsional spring stiffness coefficient kwith respect to the x-axis based on the x-axis rotational moment Mof an external force will be described with reference to.

11 11 FIGS.A andB x 210 are diagrams schematically illustrating that a torsional response, i.e., a rotational angular displacement w, occurs in the spring structure () due to a rotational moment Mx.

11 111 FIGS.A andB Mx Referring to, the rotational angular displacement Δrcan be calculated as in Equation 19 below.

E Mx x D Mx x Here, Δris the rotational angular displacement by which point E rotates about the x-axis due to the rotational moment M, and Δris the rotational angular displacement by which point D rotates about the x-axis due to the rotational moment M.

D Mx D Mx x 212 210 212 210 8 FIG.A In addition, by using the rotational angular displacement Δrof point D and the radius r of the center portion () of the spring structure (), the linear displacement Δdof point D due to the rotational moment Mcan be calculated as in Equation 20 below. Here, the radius r of the central portion () of the spring structure () can be confirmed with reference to.

z D D x D Mx x F z D Mx x D x Also, as in the case of the z-axis component Fof the external force, a vertical force Fand a rotational moment Mare applied to point D by the rotational moment M, and the linear displacement Δdof point D by the rotational moment Mcan be calculated in the same manner as Δd. In this regard, Equation 21 below shows a calculation formula for obtaining the linear displacement Δdof point D due to the rotational moment M, and Equation 22 below shows a calculation formula for obtaining the inclination angle θof point D due to the rotational moment M.

D x D E x E In addition, the relationship between the vertical force Fapplied to point D by the rotational moment Mand the rotational moment Mcan be defined as in Equation 23 below, and the relationship between the vertical force Fapplied to point E by the rotational moment Mand the rotational moment Mcan be defined as in Equation 24 below.

Here,

E x D x In addition, through static equilibrium, the relationship between the vertical force Fapplied to point E by the rotational moment Mand the vertical force Fapplied to point D is defined as in Equation 25 below, and the rotational moment Mcan be defined as in Equation 26 below.

Mx x In addition, the relationship between the rotational angular displacements Δrdue to the rotational moment Mcan be defined as in Equation 27 below.

M x x Additionally, the displacement distribution function δ(x) in the x-axis direction due to the rotational moment Mcan be defined as in Equation 28 below.

1 x Mx Here, if x=l′, δM(x) becomes Δr, and Equation 29 can be derived through Equations 27 and 28.

Mx Mx x Here, kis the torsional spring stiffness coefficient kdue to the external force's rotational moment Mwith respect to the x-axis.

y z z x y z Meanwhile, in the same manner as above, calculation formulas for the y-axis directional force Fand the Z-axis-based rotational moment Mof the external force can also be derived, and accordingly, the response to F, M, F, and Mapplied at a position with a distance r from the center can be comprehensively modeled.

12 12 FIGS.A andB F z y F z y 210 210 In this regard,are diagrams schematically showing that a vertical displacement Δdoccurs in the spring structure () due to an external force Fin the y-axis direction. In addition, Equations 30 to 46 show a series of equations for obtaining the linear spring stiffness coefficient kdue to the force Fin the y-axis direction of the external force of the spring structure ().

13 13 FIGS.A andB M z M z z 210 In addition,are diagrams schematically showing that a rotational angular displacement Δroccurs in the spring structure () due to a rotational moment $Mz$ with respect to the z-axis of an external force. In this regard, Equations 47 to 55 show a series of equations for obtaining the torsional spring stiffness coefficient kdue to the rotational moment Mwith respect to the z-axis of the external force.

1 2 3 4 5 6 x y z x y z 213 1 214 1 215 1 213 2 214 2 215 2 Meanwhile, the relationship between the displacement Δdof the first vertical displacement portion (-), the displacement Δdof the second vertical displacement portion (-), the displacement Δdof the third vertical displacement portion (-), the displacement Δdof the first horizontal displacement portion (-), the displacement Δdof the second horizontal displacement portion (-), and the displacement Δdof the third horizontal displacement portion (-), calculated through Equations 3 to 8, and the x-axis component F, y-axis component F, and z-axis component Fof the external force, and the x-axis-based rotational moment M, y-axis-based rotational moment M, and z-axis-based rotational moment Mgenerated by the external force can be defined as in Equation 56 below.

rMxv s1 M x x 320 330 340 210 Here, kmay be derived by applying the position radius rof the vertical displacement photocouplers (,,) to the reciprocal of the x-axis-based torsional spring stiffness coefficient kof the spring structure () due to the x-axis-based rotational moment Mof the external force, as defined by Equation 29.

dFzv s1 M x z 320 330 340 210 In addition, Kmay be derived by applying the position radius rof the vertical displacement photocouplers (,,) to the reciprocal of the z-axis linear spring stiffness coefficient kof the spring structure () due to the z-axis component Fof the external force, as defined by Equation 18.

s1 320 330 340 Specifically, by defining a radius variable u using the position radius rof the vertical displacement photocouplers (,,) as in Equation 57 below, and applying the radius variable u to the reciprocals of Equations 18, 29, 46, and 55, Equations 58 to 63 below can be derived.

rMxh s2 Mx x 350 360 370 210 In addition, Kmay be derived by applying the position radius rof the horizontal displacement photocouplers (,,) to the reciprocal of the x-axis-based torsional spring stiffness coefficient kof the spring structure () due to the x-axis-based rotational moment Mof the external force, as defined by Equation 29.

dFyh s2 F y y 350 360 370 210 In addition, Kmay be derived by applying the position radius rof the horizontal displacement photocouplers (,,) to the reciprocal of the y-axis linear spring stiffness coefficient kof the spring structure () due to the y-axis component Fof the external force, as defined by Equation 46.

rMzh s2 M z z 350 360 370 210 In addition, Kmay be derived by applying the position radius rof the horizontal displacement photocouplers (,,) to the reciprocal of the z-axis-based torsional spring stiffness coefficient kof the spring structure () due to the z-axis-based rotational moment Mof the external force, as defined by Equation 55.

s2 320 330 340 Specifically, by defining a radius variable u using the position radius rof the vertical displacement photocouplers (,,) as in Equation 64 below, and applying the radius variable u to the reciprocals of Equations 18, 29, 46, and 55, Equations 65 to 70 below can be derived.

Meanwhile, through Equation 56, the calibration matrix G can be defined as in Equation 71 below.

G Additionally, the Regulated Calibration Matrixcan be defined as in Equation 72 below.

S S 320 330 340 350 360 370 Here, Ris a Sensitivity Regulation Matrix that corrects the sensitivity of each axis and can be derived based on the displacement of each axis measured by the photocouplers (,,,,,). For example, a sensitivity regulation matrix Rcan be derived as in Equation 73 below.

Here, R is a Regulation Matrix, which can be derived as in Equation 74 below.

R Fx Fy Fz Mx My Mz =diag[100%/_max 100%/_max 100%/_max,  Equation 74) 100%/_max 100%/_max 100%/_max]

G G G G G In addition, by maximizing the regulated calibration matrixand minimizing the Condition Number Con() of the regulated calibration matrix, thereby minimizing the value Con()/||, a 6-axis force-torque sensing apparatus having high sensitivity and stability can be provided.

210 In addition, the design of the spring structure () as described above must satisfy the constraints of Equations 75 to 79 below.

210 1 2 1 2 s2 1 2 1 2 s2 1 2 1 2 Here, Equations 75 to 76 are conditions for calculating an accurate spring constant, and Equation 77 is a structural dimensional constraint of the spring structure (). For example, the parameters can be set as 1 mm≤l≤20 mm, 11 mm≤l≤30 mm, 1 mm≤b≤10 mm, 0.5 mm≤b≤1 mm, 1 mm≤h≤15 mm, 1 mm≤r≤8 mm, 2 mm≤r≤15 mm. Specifically, lmay be set to 14.24 mm, lto 11.00, bto 3.039 mm, bto 0.5535 mm, h to 6.690 mm, r to 4.437 mm, and rto 8.800 mm. Also, as another example, lmay be set to 14.03 mm, lto 14.50, bto 3.00 mm, bto 0.60 mm, h to 6.00 mm, and r to 4.00 mm.

210 210 210 210 allowable bend torsion In addition, Equations 78 and 79 are allowable external force limit conditions that the spring structure () can withstand. Here, σis the maximum allowable stress of the spring structure (), σis the bending stress caused by the force or rotational torque acting on the spring structure (), and σis the torsional stress caused by the force or rotational torque acting on the spring structure ().

1 Table 2 shows the results of comparing the force-torque measurement ranges of a 6-axis force-torque sensing apparatus () according to one embodiment of the present disclosure and a commercial 6-axis force-torque sensing apparatus, RFT40, according to the prior art.

TABLE 2 Measurement range of the 6- axis force-torque apparatus (1) Measurement range of Force/Moment of the present disclosure RFT40 x F −620 N~+620 N −100 N~+100 N y F −590 N~+590 N −100 N~+100 N z F −1650 N~+1650 N −150 N~+150 N x M −13.7 N · m~+13.7N · m −2.5 N · m~+2.5 N · m y M −13.6 N · m~+13.6 N · m −2.5 N · m~+2.5 N · m z M −19.6 N · m~+19.6 N · m −2.5 N · m~+2.5 N · m

1 1 1 Referring to Table 2, it can be confirmed that the 6-axis force-torque sensing apparatus () according to the present disclosure has a wider measurement range compared to the RFT40, which is a commercial 6-axis force-torque sensing apparatus according to the prior art. In addition, the 6-axis force-torque sensing apparatus () designed as described above can be manufactured in a miniaturized size, leading to high utility, and can minimize weight when manufactured with lightweight metal. For example, the 6-axis force-torque sensing apparatus () according to the present disclosure can be manufactured using AL7075-T6 as a material, and can be manufactured as a small, lightweight apparatus with a diameter of 40 mm, a height of 17.47 mm, and a weight of 38 g.

14 FIG. 1 In addition,shows experimental results comparing the force-torque measurement results of the 6-axis force-torque sensing apparatus () according to the present disclosure and the ATI-MINI85, a commercial 6-axis force-torque sensing apparatus according to the prior art.

1 Here, the force-torque measurement result of the 6-axis force-torque sensing apparatus () according to the present disclosure is shown as a graph in the form of a thick dotted line, and the force-torque measurement result of ATI-MINI85 is shown as a graph in the form of a thin solid line.

1 14 FIG. In addition, Table 3 shows the physical characteristics of the 6-axis force-torque sensing apparatus () according to the present disclosure applied to the experiment from which the graph ofwas derived.

TABLE 3 Value Unit Input Force Range X ±1,050 N Input Force Range Y ±1,200 N Input Force Range Z ±1,850 N Input Moment Range X, Y ±25 N · m Input Moment Range Z ±36 N · m Resonance Frequency X 12006 N · m Resonance Frequency Y 12039 Hz Resonance Frequency Z 14154 Hz Sampling Frequency 5 Hz

1 14 FIG. In addition, Table 4 shows the results of Error Analysis for evaluating the force-torque sensing performance of the 6-axis force-torque sensing apparatus () according to the present disclosure applied to the experiment from which the graph ofwas derived, and Table 5 shows the results of Nonlinearity and Hysteresis analysis using the data of Table 4.

TABLE 4 Percentage Error (%) RMS Mean Std Max Error(N, N · m) x F 0.046 0.0742 0.36 0.5703 y F −0.0343 0.0706 0.3008 2.25 z F 0.0172 0.0416 0.1316 0.6757 x M 0.0627 0.2669 0.8802 0.0172 y M 0.057 0.241 0.8672 0.0155 z M 0.0161 0.0852 0.3879 0.0063

TABLE 5 Nonlinearity and Hysteresis x F 0.607% y F 0.521% z F 0.240% x M 1.543% y M 1.699% z M 0.681%

14 FIG. 15 16 FIGS.and 1 2 Referring toand Tables 3 to 5, it can be confirmed that the 6-axis force-torque sensing apparatus () according to the present disclosure has a lower error rate and is more stable compared to the ATI-MINI85. In addition, the maximum value of nonlinearity is 1.699%, which is lower than the 3.0% standard for existing commercial sensors, confirming that it is a sensor with excellent accuracy and reliability, suitable for high-precision measurements. Hereinafter, a force-torque sensing apparatus () according to a second embodiment of the present disclosure will be described with reference to.

15 FIG. 16 FIG. 15 FIG. 2 2 is an exploded perspective view of a 6-axis force-torque sensing apparatus () according to a second embodiment of the present disclosure, viewed from above, andis a perspective view of the 6-axis force-torque sensing apparatus () with the components shown inassembled.

2 1 210 200 216 217 218 100 220 A 6-axis force-torque sensing apparatus () according to the second embodiment follows the 6-axis force-torque sensing apparatus () according to the first embodiment but differs from the first embodiment in that the spring structure (′) of the deformable structure (′) includes spring protrusions (,,) that serve as vertical displacement portions, and the cover (′) is disposed on the upper side of the frame structure ().

15 FIG. 216 217 218 212 210 213 214 215 216 217 218 212 Referring to, the spring protrusions (,,) are configured to extend radially in a horizontal direction from the central portion (′), and the spring structure (′) can be provided in a configuration in which at least three beam portions (′,′,′) and at least three spring protrusions (,,) are alternately arranged at regular intervals around the central portion (′).

210 213 214 215 216 217 218 212 For example, the spring structure (′) may be configured with three beam portions (′,′,′) and three spring protrusions (,,) arranged alternately at 60-degree intervals centered on the central portion (′).

216 217 218 216 2 217 2 218 2 212 216 1 217 1 218 1 216 2 217 2 218 2 216 1 217 1 218 1 216 2 217 2 218 2 In addition, the spring protrusions (,,) may be configured to include linear extension portions (-,-,-) extending from the central portion (′) with a predetermined width and thickness, and vertical displacement portions (-,-,-) formed at the ends of the extension portions (-,-,-). Here, the vertical displacement portions (-,-,-) can be designed to be wider and thicker than the extension portions (-,-,-).

320 330 340 216 1 217 1 218 1 310 321 331 341 322 332 342 320 330 340 216 1 217 1 218 1 216 1 217 1 218 1 320 330 340 321 331 341 320 330 340 216 1 217 1 218 1 322 332 342 320 330 340 216 1 217 1 218 1 In this case, vertical displacement photocouplers (,,) may be disposed below the vertical displacement portions (-,-,-) on the substrate (). Specifically, the light-emitting element (,,) and the light-receiving element (,,) of each vertical displacement photocoupler (,,) can be arranged parallel to the bottom surface of each vertical displacement portion (-,-,-). In addition, the vertical reference gap between the vertical displacement portions (-,-,-) and the vertical displacement photocouplers (,,) can be designed to have a constant, predetermined value. Accordingly, by analyzing the light emitted from the light-emitting element (,,) of the vertical displacement photocoupler (,,), reflected from the bottom surface of the vertical displacement portion (-,-,-), and then collected by the light-receiving element (,,) of the vertical displacement photocoupler (,,), the vertical displacement of the vertical displacement portions (-,-,-) can be measured.

213 214 215 350 360 370 213 214 215 351 361 371 352 362 372 350 360 370 213 214 215 351 361 371 350 360 370 213 214 215 352 362 372 350 360 370 213 214 215 Additionally, in this case, the beam portions (′,′,′) serve as horizontal displacement portions, and horizontal displacement photocouplers (,,) can be disposed horizontally outward of the beam portions (′,′,′). Specifically, the light-emitting element (,,) and the light-receiving element (,,) of each horizontal displacement photocoupler (,,) can be arranged parallel to the side surface of each beam portion (′,′,′). Here, the side surface refers to a surface that is arranged in a vertical direction. Accordingly, by analyzing the light emitted from the light-emitting element (,,) of the horizontal displacement photocoupler (,,), reflected from the side surface (B′) of the beam portion (′,′,′), and then collected by the light-receiving element (,,) of the horizontal displacement photocoupler (,,), the horizontal displacement of the beam portion (′,′,′) can be measured.

213 214 215 210 Additionally, in this case, the vertical length of the beam portions (′,′,′) can be designed to be longer than the vertical deformation range of the spring structure (′) due to external force.

15 16 FIGS.and 100 220 220 100 100 In addition, referring to, the cover (′) is disposed on the upper side of the frame structure () and is designed so that a predetermined gap exists between the top of the frame structure () and the bottom of the cover (′), so that the cover (′) can be configured to move vertically or in an inclined direction by an external force.

1 2 3 100 210 101 100 4 5 6 7 8 9 102 1 2 3 4 5 6 7 8 9 Here, vertical deformable structure coupling screw holes (h′, h′, h′) for screw coupling of the cover (′) and the spring structure () may be formed in the central portion () of the cover (′), and vertical external force apparatus coupling screw holes (h′, h′, h′, h′, h′, h′) for screw coupling with an external force apparatus may be formed in the edge portion (). In addition, the deformable structure coupling screw holes (h′, h′, h′) can be formed at 120-degree intervals with a constant gap, and the external force apparatus coupling screw holes (h′, h′, h′, h′, h′, h′) can be formed at 60-degree intervals with a constant gap.

11 12 13 100 212 210 11 12 13 1 2 3 100 100 210 In addition, vertical cover coupling screw holes (h′, h′, h′) for screw coupling with the cover (′) may be formed in the central portion (′) of the spring structure (′). In addition, the cover coupling screw holes (h′, h′, h′) may be formed in the same number as and at positions corresponding to the deformable structure coupling screw holes (h′, h′, h′) of the cover (′), and screws may be fastened into each pair of corresponding screw holes to couple the cover (′) and the spring structure (′).

1 2 1 17 FIG. Hereinafter, a photocoupler-based 6-axis force-torque sensing method using a 6-axis force-torque sensing apparatus () according to the first embodiment of the present disclosure will be described with reference to. In addition, even when using the 6-axis force-torque sensing apparatus () according to the second embodiment, the same 6-axis force-torque sensing method as the 6-axis force-torque sensing method using the 6-axis force-torque sensing apparatus () according to the first embodiment is applied.

10 1 200 Step Sis a step in which an external force is applied to a photocoupler-based 6-axis force-torque sensing apparatus () according to the present disclosure and the external force is transmitted to a deformable structure ().

20 210 200 Step Sis a step in which the spring structure () of the deformable structure () is deformed by an external force and its position changes.

30 210 321 331 341 351 361 371 320 330 340 350 360 370 210 322 332 342 352 362 372 Step Sis a step in which position information of the spring structure () is collected as light emitted from light-emitting elements (,,,,,) of at least 6 photocouplers (,,,,,) arranged at different positions is reflected by the spring structure () and then collected by the light-receiving elements (,,,,,).

40 210 210 320 330 340 350 360 370 393 Step Sis a step of calculating the displacement of the spring structure () using the position information of the spring structure () respectively sensed through the photocouplers (,,,,,) in the data processing unit ().

50 210 210 393 Step Sis a step of calculating a 6-axis force-torque by calculating the magnitude and direction of an external force applied to the spring structure () using the displacement of the spring structure () in the data processing unit ().

320 330 340 350 360 370 As described above, according to the 6-axis force-torque sensing apparatus and 6-axis force-torque sensing method of the present disclosure, the magnitude and direction of an external force can be measured in a non-contact manner using photocouplers (,,,,,). Therefore, a 6-axis force-torque sensing apparatus and a 6-axis force-torque sensing method having improved durability against impact and thus improved stability and reliability can be provided.

In addition, by providing a method for measuring the magnitude and direction of an external force using a photocoupler, the influence of external static electricity and electromagnetic fields can be minimized.

In addition, by integrating the reflector of the photocoupler and the spring structure into a single structure, the number of components can be reduced, and the sensor structure can be simplified into two structures—an upper structure to which force is transmitted and a lower structure that measures the force—thereby reducing manufacturing costs and providing a more compact 6-axis force-torque sensing apparatus.

The foregoing description of the present disclosure is for illustrative purposes only, and one of ordinary skill in the art to which the present disclosure pertains will understand that it can be easily modified into other specific forms without changing the technical spirit or essential characteristics thereof. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not limiting. For example, each component described as a single entity may be implemented in a distributed manner, and likewise, components described as distributed may be implemented in a combined form.

Therefore, the spirit of the present disclosure should not be limited to the embodiments described above, and all modifications that are equivalent or equivalently transformed from the following claims, as well as the claims themselves, shall be considered to fall within the scope of the spirit of the present disclosure.

1 : 6-axis force-torque sensing apparatus according to the first embodiment 100 : Cover 200 : Deformable structure 210 : Spring structure 213 214 215 ,,: Beam portion 213 1 214 1 215 1 -,-,-: Vertical displacement portion 213 2 214 2 215 2 -,-,-: Horizontal displacement portion 220 : Frame structure 300 : Sensing substrate 310 : Substrate 320 330 340 ,,: Vertical Displacement Photocoupler 350 360 370 ,,: Horizontal Displacement Photocoupler 391 : Communication Unit 393 : Data Processing Unit 394 : Temperature Sensor 395 : Voltage Regulator 396 : Data Processing Unit Debugger 397 : CAN/PW Connector 400 : Sensing Substrate Support

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Patent Metadata

Filing Date

December 10, 2025

Publication Date

July 2, 2026

Inventors

HyunBin KIM
KyungSoo KIM
KeunHa CHOI

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Analysis on this page is generated by Patentable — an AI-powered patent intelligence platform. AI-generated summaries, explanations, and analysis may be reused with attribution and a visible link back to the canonical URL below. Patent abstracts and claims are USPTO public domain.

Cite as: Patentable. “6-AXIS FORCE TORQUE SENSOR BASED ON PHOTOCOUPLER AND METHOD OF SENSING 6-AXIS FORCE TORQUE BASED ON PHOTOCOUPLER MEASUREMENT” (US-20260185882-A1). https://patentable.app/patents/US-20260185882-A1

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