Touch Assembly

This application claims priority to Chinese Patent Application 202510014742.8, filed on Jan. 6, 2025, which is incorporated herein by reference.

The present disclosure relates to a touch assembly.

As diversified developments of touch modules progress, touch modules have been maturely implemented in industrial and consumer electronics products. More and more varieties of touch products have been seen embedded in medium and large-scale products.

However, the manufacturing process of the touch modules of the prior art uses indium tin oxide (ITO) as transparent electrodes. To produce ITO, the rare metal indium is required. The reserves of indium are limited, and the mining process thereof creates environmental pollution as well as a vast amount of waste during the ITO manufacturing process of the prior art. This wastes all requires proper treatment to prevent environmental pollution. In addition, the aforementioned prior art requires the vacuum deposition equipment to produce high temperatures and high pressures with high energy consumption.

Therefore, to introduce a touch assembly that can solve the aforementioned problems is what the industry invests its research and development resources in and intends to achieve.

In view of the foregoing statement, the objective of the present disclosure is to provide a touch assembly that can solve the aforementioned problems.

To achieve the aforementioned objective, according to one of the embodiments of the present disclosure, a touch assembly comprises a protective cover, a first adhesive layer, a wire layer, a second adhesive layer, and a flexible circuit board. The protective cover comprises a visible zone and a peripheral zone. The first adhesive layer is disposed on the visible zone of the protective cover. The wire layer comprises a plurality of curved wires disposed on the first adhesive layer. The curved wires comprise a first group of wires extending along a first direction and a second group of wires extending along a second direction and overlapping the first group of wires. Each of the plurality of curved wires comprises a conductive inner core and an outer covering. The wire layer is configured for touch sensing. The second adhesive layer covers the plurality of curved wires and the first adhesive layer. The flexible circuit board comprises a plurality of bonding pads. Each of the plurality of curved wires extends from the visible zone to the peripheral zone to form a signal transmission path. The signal transmission path comprises a trace section and a bonding section. The trace section extends in a lengthwise direction. The bonding section bends back and forth within a range in a widthwise direction, and is bonded to a corresponding one of the plurality of bonding pads.

In one or several embodiments of the present disclosure, the bonding section bends back and forth in a sawtooth shape.

In one or several embodiments of the present disclosure, the bonding section comprises a plurality of tooth portions sequentially connected. An included angle between two adjacent tooth portions is 10 degrees to 16 degrees.

In one or several embodiments of the present disclosure, the bonding section comprises a plurality of tooth portions sequentially connected. The number of tooth portions is 4 to 6.

In one or several embodiments of the present disclosure, the bonding section comprises a plurality of tooth portions sequentially connected. Each of the plurality of tooth portions are inclined toward a same side relative to the widthwise direction. Each of the tooth portions comprises two inclined edges connected to each other. A longest one of the two inclined edges of each of the plurality of tooth portions has a length of 0.5 mm to 1.1 mm.

In one or several embodiments of the present disclosure, the bonding sections of two adjacent signal transmission paths are staggered in the lengthwise direction.

In one or several embodiments of the present disclosure, the plurality of bonding pads are arranged in at least one row.

In one or several embodiments of the present disclosure, each of the plurality of bonding pads has a pointed tip.

In one or several embodiments of the present disclosure, each of the plurality of bonding pads has a width of 0.3 mm to 0.7 mm and a length of 0.1 mm to 6 mm. The spacing between two adjacent bonding pads is 0.3 mm to 1.1 mm.

In one or several embodiments of the present disclosure, a metal layer on the bonding pads has a thickness of 3 μm to 11 μm.

In summary, in the touch assembly of the present disclosure, through a trace design of curved wires bending back and forth within a range in a widthwise direction on the bonding section of the peripheral zone, the conductive area between the bonding section and the bonding pads of the flexible circuit board increases. This will not only improve the manufacturing process rate of welding the bonding sections and the bonding pads (especially bonding pads in medium/small sizes) of curved wires using the laser welding process, but also effectively solves the delamination problem that easily occurs while using the chip on film (COF) technology.

The aforementioned statements are only used for explaining the problems that can be solved by the present disclosure, the technical means for solving the problems, and the effect thereof. The present disclosure will become more comprehensively understood through the following detailed descriptions of the way of embodiments with reference to the accompanying diagrams.

A plurality of embodiments of the present disclosure will be disclosed below with reference to diagrams. For the purpose of clear explanations, many details in practice will be provided together with the following descriptions. However, these detailed descriptions in practice are for illustration only and shall not be interpreted as limitations to the scope, applicability, or configuration of the present disclosure in any way. That is, in some embodiments of the present disclosure, these details in practice are not required. Furthermore, for the purpose of simplifying diagrams, some structures and components of the prior art shown in the diagrams will be illustrated schematically.

1 FIG. 2 FIG. 1 FIG. 2 FIG. 1 FIG. 1 FIG. 2 FIG. 100 100 110 120 13 140 150 120 110 13 130 120 130 120 1 2 1 2 1 13 140 130 120 150 130 Please refer toand.is a schematic diagram illustrating the touch assemblyaccording to an embodiment of the present disclosure.is a partial cross-sectional schematic diagram illustrating some of the components of. In the embodiment, as illustrated inand, a touch assemblycomprises a protective cover, a first adhesive layer, a wire layerL, a second adhesive layer, and a flexible circuit board. The first adhesive layeris disposed on the protective cover. The wire layerL comprises a plurality of curved wiresdisposed on the first adhesive layer. The curved wiresare disposed on the first adhesive layerand comprise a first group of wires Gand a second group of wires G. The first group of wires Gextends along the first direction and is arranged with intervals. The second group of wires Gextends along the second direction, overlaps with the first group of wires G, and is arranged with intervals. In some embodiments, the first direction and the second direction are perpendicular to each other, for example, in the directions of the X-axis and Y-axis, respectively. The wire layerL is configured for touch sensing. The second adhesive layercovers the curved wiresand the first adhesive layer. The flexible circuit boardand the curved wiresare electrically connected.

2 FIG. 130 131 132 132 131 1 2 132 1 2 1 2 150 More specifically, as shown in, each curved wirecomprises a conductive inner coreand an outer covering. The outer coveringis composed of insulation materials. Therefore, the conductive inner coresof the two groups, the first group of wires Gand the second group of wires G, can be electrically insulated by means of the outer coveringsof the first group of wires Gand the second group of wires G. Hereby, the touch signals (for example, mutual-capacitance sensing signals) between the first group of wires Gand the second group of wires Gcan be transmitted to the flexible circuit board.

130 130 100 In the embodiment, every curved wireis an enameled wire. Hereby, the curved wirecan be manufactured within the touch assemblyby wire winding technology, thus avoiding problems of high pollution and high energy consumption due to the use of ITO as the transparent electrodes in the complicated manufacture process of the prior art.

130 1 2 130 1 2 During practical implementation, the curved wirescan also be a combination of enameled wire and transparent electrodes of indium tin oxide (ITO). For example, one group among the first group of wires Gand the second group of wires Gof the curved wiresis composed of enameled wires, and the other group among the first group of wires Gand the second group of wires Gis composed of transparent electrodes of ITO.

131 130 In several embodiments, the material of the conductive inner coreof the curved wireis composed of silver, copper, aluminum, tungsten, or similar metals.

131 130 In several embodiments, the material of the conductive inner coreof the curved wireis composed of palladium copper alloy, silver palladium copper alloy, molybdenum rhenium alloy, aluminum alloy, nickel alloy, or similar alloys.

132 130 In several embodiments, the material of the outer coveringof the curved wireis composed of polyvinyl formal, polyurethane, polyamide, polyester, polyester-polyimide, polyamide-polyimide, or polyimide. However, the present disclosure is not limited thereto.

131 130 131 100 130 132 130 131 132 In several embodiments, the wire diameter of the conductive inner coreof the curved wireis in a range of 2 μm to 20 μm. Preferably, the wire diameter of the conductive inner coreis in a range of 2 μm to 5 μm to increase the visibility of the touch assemblyand, in other words, reduce the visibility of the curved wire. In several embodiments, the thickness of the outer coveringof the curved wireis in a range of 1 μm to 3 μm. For example, in one embodiment, the wire diameter of the conductive inner coreis about 5 μm, whereas the thickness of the outer coveringis about 2 μm (that is, the wire diameter of the curved wire is about 7 μm). However, the present disclosure is not limited thereto.

2 FIG. 120 140 1 2 130 120 140 130 140 In the embodiment, as shown in, the first adhesive layerand the second adhesive layerfill the intervals within the first group of wires Gand the intervals within the second group of wires G. Therefore, the void caused by indentation within the curved wiresto both the first adhesive layerand the second adhesive layercan be eliminated. As a result, the possibility of seeing the curved wiresfrom one side of the second adhesive layercan be reduced effectively (that is, reducing the resulting shadows).

120 140 In several embodiments, at least one of the first adhesive layeror the second adhesive layeris an optical clear adhesive (OCA) layer or a liquid optical clear adhesive (LOCA) layer. However, the present disclosure is not limited thereto.

140 140 140 100 In several embodiments, the thickness of the second adhesive layeris in a range of 25 μm to 150 μm. When the thickness of the second adhesive layeris smaller than the aforementioned lower limit, the aforementioned voids will not be easily removed. When the thickness of the second adhesive layeris larger than the aforementioned upper limit, it will lead to an increase in the overall volume, weight, and cost of the touch assembly.

3 FIG. 3 FIG. 1 FIG. 2 FIG. 110 140 Please refer to, which illustrates a flowchart illustrating the manufacturing method of the touch assembly according to an embodiment of the present disclosure. In the embodiment, as shown inin conjunction withand, the manufacturing method of the touch assembly comprises steps from Step Sto Step S.

110 120 110 Step S: Laminate the first adhesive layeron the protective covertightly.

110 120 110 In several embodiments, Step Sis to continuously laminate the first adhesive layeronto the protective coverat 130 degrees Celsius for a period of 40 minutes. However, the present disclosure is not limited thereto.

110 110 110 120 In several embodiments, before Step S, a process to form a black matrix (BM) layer on the protective covercan be carried out. After Step Sis implemented, the first adhesive layeris in contact with the black matrix layer.

120 130 120 Step S: Dispose a plurality of curved wireson the first adhesive layer.

120 130 120 130 130 5 FIG.C 7 FIG.B In several embodiments, Step Scomprises: winding enameled wireA (in reference toand) onto the first adhesive layer; and cutting enameled wireA to form curved wires.

130 130 In several embodiments, the step of cutting the enameled wireA to form curved wiresis carried out through a laser cutting process. However, the present disclosure is not limited thereto.

130 140 130 120 Step S: Place the second adhesive layerover the curved wiresand the first adhesive layer.

130 140 120 In several embodiments, Step Sis to continuously laminate the second adhesive layeronto the first adhesive layerat 130 degrees Celsius for a period of 40 minutes. However, the present disclosure is not limited thereto.

140 150 130 Step S: Weld the flexible circuit boardto the curved wires.

140 In several embodiments, Step Sis carried out through a laser welding process. However, the present disclosure is not limited thereto.

4 FIG. 4 FIG. 1 FIG. 2 FIG. 210 240 Please refer to, which illustrates a flowchart illustrating the manufacturing method of the touch assembly according to another embodiment of the present disclosure. In the embodiment, as shown inin conjunction withand, the manufacturing method of the touch assembly comprises steps from Step Sto Step S.

210 130 120 Step S: Dispose a plurality of curved wireson the first adhesive layer.

210 130 120 130 130 5 FIG.C 7 FIG.B In several embodiments, Step Scomprises: winding enameled wireA (in reference toand) onto the first adhesive layer; and cutting enameled wireA to form curved wires.

220 140 130 120 Step S: Place the second adhesive layerover the curved wiresand the first adhesive layer.

220 140 120 In several embodiments, Step Sis to continuously laminate the second adhesive layeronto the first adhesive layerat 130 degrees Celsius for a period of 40 minutes. However, the present disclosure is not limited thereto.

230 150 130 Step S: Weld the flexible circuit boardto the curved wires.

230 In several embodiments, Step Sis carried out through a laser welding process. However, the present disclosure is not limited thereto.

240 120 130 140 150 110 Step S: Transfer the assembly of the first adhesive layer, the curved wires, the second adhesive layer, and the flexible circuit boardonto the protective cover.

3 FIG. 4 FIG. 120 130 140 110 140 110 In comparison to the embodiment shown in, the embodiment illustrated inis to transfer the assembly of the first adhesive layer, the curved wires, and the second adhesive layeronto the protective coverafter the laminating process of the second adhesive layer, so that the problem of the black matrix layer disposed on the protective coverbeing damaged by the high temperature during the laminating process can be effectively prevented.

5 FIG.A 5 FIG.J 5 FIG.A 5 FIG.J 4 FIG. Please refer toto.toare schematic diagrams illustrating the intermediate steps of the manufacturing method of the touch assembly, respectively, according to an embodiment of the present disclosure. The embodiment is one specific embodiment of the manufacturing method illustrated in, and the descriptions are provided as follows.

5 FIG.A 120 1 2 In the step, as illustrated in, both the surfaces of the first adhesive layeropposite to each other are pasted with the separation films, RFand RF, respectively.

5 FIG.B 5 FIG.A 5 FIG.B 2 120 2 120 910 As shown in, this step follows the step shown in. In this step, the separation film RFis peeled off, then the pre-embedded wire EW is disposed on the surface of the first adhesive layerthat was originally pasted with the separation film RF. The pre-embedded wire EW can be wound on the first adhesive layerby the winding machine. The pre-embedded wire EW shows a U-shape after the winding process, as shown in. However, the present disclosure is not limited thereto.

5 FIG.C 5 FIG.B 5 FIG.C 130 120 130 120 130 130 120 As shown in, this step follows the step shown in. In this step, the enameled wireA is wound on the first adhesive layer. The winding method is, for example, to wind the enameled wireA back and forth along a route on the first adhesive layer, so that the enameled wireA partially covers the pre-embedded wire EW. Specifically, as shown in, the enameled wireA is disposed on the first adhesive layerin a checkerboard pattern, and three edges of the checkerboard pattern overlap the pre-embedded wire EW.

5 FIG.D 5 FIG.C 5 FIG.B 5 FIG.C 5 FIG.D 130 130 130 130 120 130 130 120 210 As shown in, this step follows the step shown in. In this step, a single enameled wireA is cut to form a plurality of curved wires. Specifically, this step can cause the enameled wireA to break up and form curved wiresthrough the action of peeling the pre-embedded wire EW from the first adhesive layer. The mechanism of peeling the pre-embedded wire EW to cause the enameled wireA to break up is similar to the action of pulling the tear tape on the cellophane wrapper of a cigarette pack. In comparison to the method that uses cutlery to cut the enameled wireA, the present step will not leave tool marks on the first adhesive layer. Therefore, Step Scan be implemented by executing the steps illustrated in,, andin sequence.

130 130 130 130 In several embodiments, the wire diameter of the pre-embedded wire EW is larger than the wire diameter of the enameled wireA. Hereby, the thicker pre-embedded wire EW has higher tensile strength than that of the thinner enameled wireA, so that during the process of peeling the pre-embedded wire EW, which forces the enameled wireA to break up, the pre-embedded wire EW will not also break up. In one embodiment, the wire diameter of the pre-embedded wire EW is about 20 μm, and the wire diameter of the enameled wireA is about 5 μm. However, the present disclosure is not limited thereto.

5 FIG.E 5 FIG.D 140 120 920 140 120 140 140 120 As shown in, this step follows the step shown in. In this step, the hydrogelA is coated on the first adhesive layerusing a glue spreader. Specifically, the hydrogelA is coated on the outer edge of the first adhesive layer. In several embodiments, the hydrogelA is a type of light-curable gel. For example, the light-curable gel is hardened after being exposed to ultraviolet (UV) light. Hereby, when UV light exposure simultaneously occurs during this step, and the hydrogelA coated on the outer edge of the first adhesive layeris hardened and becomes an outer wall.

5 FIG.F 5 FIG.E 140 120 920 130 140 As shown in, this step follows the step shown in. In this step, the hydrogelA is further coated over the first adhesive layerusing the glue spreaderto cover the curved wires. In other words, the hydrogelA is coated over and filled in the space within the aforementioned outer wall in this step. In other embodiments, methods of glue scraping, dispensing, slitting, filling, or similar coating methods can be applied.

5 FIG.G 5 FIG.F 940 140 940 950 140 140 As shown in, this step follows the step shown in. In this step, plateis placed on and covers the hydrogelA, and the plateis rolled and pressed by a roller. Hereby, when light exposure also occurs during this step, the hydrogelA is hardened into the second adhesive layerof uniform thickness.

5 FIG.H 5 FIG.G 5 FIG.E 5 FIG.F 5 FIG.G 5 FIG.H 140 140 940 220 As shown in, this step follows the step shown in. In this step, after the hydrogelA is hardened into the second adhesive layer, the platecan then be removed. Therefore, step Scan be implemented by executing steps illustrated in,,, andin sequence.

5 FIG.I 5 FIG.H 150 130 230 As shown in, this step follows the step shown in. In this step, the flexible circuit boardis welded to the curved wires(that is, step S).

6 FIG. 5 FIG.I 6 FIG. 150 130 930 150 151 151 152 152 930 120 140 130 152 132 130 152 132 131 130 152 131 Please refer to, which illustrates a cross-sectional schematic diagram illustrating. As shown in, the flexible circuit boardis welded to the curved wiresusing a welding machine. The flexible circuit boardhas bonding padsdisposed thereon. The bonding padshave a metal layerdisposed thereon. For example, materials of the metal layerare composed of tin. However, the present disclosure is not limited thereto. For example, the welding machineis a laser welding machine. The laser can penetrate the first adhesive layerand the second adhesive layer, hitting the curved wiresin contact with the metal layer. In several embodiments, the melting point of the outer coveringof the curved wireis lower than the melting point of the metal layer. Therefore, the high temperature created by the laser causes the outer coveringto vaporize so that the conductive inner coreof the curved wireis exposed. Then, the metal layeris melted and welded to the conductive inner core.

5 FIG.J 5 FIG.I 5 FIG.J 120 130 140 150 110 240 1 110 120 3 140 140 As shown in, this step follows the step shown in. In this step, the assembly of the first adhesive layer, the curved wires, the second adhesive layer, and the flexible circuit boardis transferred onto the protective cover(that is, Step S). In the embodiment shown in, the aforementioned assembly has the separation film RFpeeled off and is then laminated to the protective coverthrough the first adhesive layeras a means of transfer. In addition, in this step, the separation film RFis pasted to the second adhesive layerto protect the second adhesive layer.

7 FIG.A 7 FIG.H 7 FIG.A 7 FIG.H 4 FIG. Please refer toto.toare the schematic diagrams illustrating the intermediate steps of the manufacturing method of the touch assembly, respectively, according to an embodiment of the present disclosure. This embodiment is one specific embodiment of the manufacturing method illustrated in, and descriptions are provided as follows.

7 FIG.A 120 1 2 In this step, as shown in, both the surfaces of the first adhesive layeropposite to each other are pasted with the separation films RFand RF, respectively.

7 FIG.B 7 FIG.A 7 FIG.B 2 130 120 120 130 120 As shown in, this step follows the step shown in. In this step, the separation film RFis peeled off, and then the enameled wireA is wound on the first adhesive layer. The winding method is, for example, to wind the wire back and forth and around along a route on the first adhesive layer. Specifically, as shown in, the wound enameled wireA is disposed on the first adhesive layerin a checkerboard pattern.

7 FIG.C 7 FIG.B 5 FIG.H 140 3 120 140 120 3 120 130 120 130 140 1 3 140 140 140 As shown in, this step follows the step shown in. In this step, the second adhesive layerhaving the separation film RFis pasted to the first adhesive layer. More specifically, the second adhesive layeris pasted to the first adhesive layeron the side away from the separation film RFto cover the first adhesive layerand the enameled wireA. In other words, the assembly of the first adhesive layer, the enameled wireA, and the second adhesive layeris stacked between the separation film RFand the separation film RF. In comparison with the second adhesive layershown in, which is formed by hardening the hydrogelA, the second adhesive layerin this step is formed by a sheet of gel.

7 FIG.D 7 FIG.C 7 FIG.B 7 FIG.C 7 FIG.D 130 130 960 960 130 130 120 140 1 3 130 1 3 210 220 As shown in, this step follows the step shown in. In this step, the enameled wireA is cut to form a plurality of curved wiresusing a slitter. For example, the slitteris a laser slitter. When the enameled wireA is cut by laser to form curved wires(that is, loop cutting), the first adhesive layer, the second adhesive layer, and the separation films RFand RFare also cut by laser simultaneously (that is, shape cutting). In comparison with the method of cutting the enameled wireA using cutlery, this step will not lead to the problem of pulling gel at the edge of the cutting area of the separation films RFand RF. Therefore, both step Sand step Scan be implemented simultaneously by executing the steps illustrated in,, andin sequence.

960 2 In several embodiments, the laser used in the slitteris a picosecond laser, femtosecond laser, COlaser, or similar light source. However, the present disclosure is not limited thereto.

7 FIG.E 7 FIG.D 150 140 3 150 140 As shown in, this step follows the step shown in. In this step, the flexible circuit boardand an area of the second adhesive layerexposed from the separation film RFundergo alignment so that the flexible circuit boardis in contact with the second adhesive layer.

7 FIG.F 7 FIG.E 6 FIG. 7 FIG.E 7 FIG.F 150 130 930 230 As shown in, this step follows the step shown in. In this step, the flexible circuit boardis welded to the curved wiresby the welding machine. As relevant explanations of the welding process can be found in, the aforementioned descriptions will not be repeated here. Therefore, step Scan be implemented by executing the steps illustrated inandin sequence.

7 FIG.G 7 FIG.F 5 FIG.I 150 As shown in, this step follows the step shown in. In this step, the flexible circuit boardcan be coated with protection paint after welding. Protection paint is, for example, three anti-glue. However, the present disclosure is not limited thereto. In several embodiments, the step shown inis followed by this step.

7 FIG.H 7 FIG.G 7 FIG.H 120 130 140 150 110 240 1 110 120 3 140 140 As shown in, this step follows the step shown in. In this step, the assembly of the first adhesive layer, the curved wires, the second adhesive layer, and the flexible circuit boardis transferred onto the protective cover(that is, step S). In the embodiment shown in, the aforementioned assembly has the separation film RFpeeled off and is then replaced onto the protective coverby having the first adhesive layerlaminated thereto as a means of transfer. The separation film RFis still pasted to the second adhesive layerto protect the second adhesive layer.

8 FIG. 1 FIG. 8 FIG. 8 FIG. 110 13 100 110 111 112 130 111 112 133 133 133 133 133 133 133 133 151 113 151 150 133 151 151 130 130 130 111 112 100 a b a b a b b b Please refer to, which illustrates a partial schematic diagram illustrating parts of the components in. Specifically,illustrates the protective coveringand the wire layerL of the touch assembly. As shown in, the protective coveringcomprises a visible zoneand a peripheral zone. Each of the curved wiresextends from the visible zoneto the peripheral zoneto form a signal transmission path. The signal transmission pathcomprises a trace sectionand a bonding section. One end of the trace sectionis connected with one end of the bonding section. The trace sectionextends in a lengthwise direction DL. The bonding sectionbends back and forth within a range in a widthwise direction DW and is bonded to the corresponding bonding pads. Hereby, the conductive area between the bonding sectionand the bonding padsof the flexible circuit boardincreases. This will not only improve the manufacturing process rate of welding the bonding sectionsand the bonding pads(especially the bonding padsin medium/small size) of curved wiresusing the laser welding process, but also effectively solves the delamination problem that easily occurs while using the chip on film (COF) technology. Additionally, due to the curved wiresbeing enameled wires, the curved wirescan overlap in a vertical direction (for example, the z-axis direction) when extending from the visible zoneto the peripheral zone, which helps reduce the width of the frame border of the touch assembly.

9 FIG. 9 FIG. 151 133 133 151 133 b b Please refer to, which illustrates a partial schematic diagram illustrating the bonding padsand the signal transmission pathsaccording to an embodiment of the present disclosure. As shown in, the bonding sectionbends back and forth in a sawtooth shape. Hereby, the overlapping area between the bonding padsof a specific size and the bonding sectioncan increase.

133 1 2 1 2 1 2 133 133 b b b 9 FIG. 9 FIG. 9 FIG. More specifically, the bonding sectioncomprises a plurality of tooth portions P sequentially connected. Each tooth portion P has two adjacent inclined edges, Pand P, as well as a tooth tip formed by the two inclined edges Pand P. The inclined edges Pof each tooth portion P are parallel to one another and close to the lower side of, whereas the inclined edges Pare parallel to one another and close to the upper side of. In several embodiments, as shown in, the tips on the left side of the bonding sectioncan be unitarily considered as the tooth tips of the tooth portions P. However, the present disclosure is not limited thereto. In other embodiments, the tips on the right side of the bonding sectioncan be unitarily considered as the tooth tips of the tooth portions P.

1 1 133 151 1 133 151 1 b b In several embodiments, an included angle θbetween two adjacent tooth portions P is 10 degrees to 16 degrees. Please note that, when the included angle θis larger, although the pitch stability increases during winding, the conductive area between the bonding sectionand the bonding padswill decrease. On the contrary, when the included angle θis smaller, although the conductive area between the bonding sectionand the bonding padswill increase, the pitch stability reduces during winding. Therefore, by setting the included angle θwithin the aforementioned range, a better balance between “pitch stability” and “conductive area”can be achieved.

133 1 2 1 133 133 2 2 b a b 9 FIG. 9 FIG. In several embodiments, the tooth portion P of every bonding sectionis inclined toward the same side relative to the widthwise direction DW. For example, in, the tooth portions P are inclined upward relative to the widthwise direction DW. Therefore, the two inclined edges Pand Pof each tooth portion P, are not equal in length, wherein the longest one of the inclined edges, P, has a length of 0.5 mm to 1.1 mm. Furthermore, as shown in, the trace sectionand the adjacent bonding sectionhave another included angle θ. The included angle θis 134 degrees to 156 degrees. Under the conditions of the aforementioned configuration, this is another method to achieve a better balance between “pitch stability” and “conductive area”.

151 2 151 151 151 150 150 In several embodiments, each of the bonding padshas a width W of 0.3 mm to 0.7 mm in the widthwise direction DW and a length Lof 0.1 mm to 6 mm in the lengthwise direction DL. A spacing S between two adjacent bonding padsis 0.3 mm to 1.1 mm. The bonding padsthat meet the aforementioned dimensions belong to a configuration of a smaller size and compact arrangement, therefore reducing the occupied area of the bonding padson the flexible circuit board. As a result, the size of the flexible circuit boardcan be reduced.

133 151 151 133 151 133 151 151 b b b In several embodiments, the number of the tooth portions P of each bonding sectionis 4 to 6, so that all tooth portions P have a better overlay with the bonding padsof aforementioned dimensions. To elaborate, although the pitch stability increases during winding when there are fewer tooth portions P of the bonding padscorresponding to the aforementioned dimensions, the conductive area between the bonding sectionand the bonding padswill also decrease. On the contrary, although the conductive area between the bonding sectionand the bonding padswill increase when there are more tooth portions P of the bonding padscorresponding to the aforementioned dimensions, the pitch stability reduces during winding. Therefore, by having the number of tooth portions P within the aforementioned range, this is another method to achieve a better balance between “pitch stability” and “conductive area”.

8 FIG. 133 133 133 133 133 b b In several embodiments, as shown in, the bonding sectionsof two adjacent signal transmission pathsare respectively staggered in the lengthwise direction DL. In other words, the bonding sectionsof two adjacent signal transmission pathsdo not correspond in the widthwise direction DW. Hereby, the space can be effectively utilized and prevent the overall occupied area of the signal transmission pathsfrom being overly large.

10 FIG. 10 FIG. 8 FIG. 151 151 133 151 b Please refer to, which illustrates a schematic diagram illustrating some bonding pads′ according to an embodiment of the present disclosure. As shown in, the bonding pads′ are arranged in three rows to correspond to the layout of the bonding sectionin. However, the present disclosure is not limited thereto. In actual applications, the bonding pads′ can be arranged in different numbers of rows (for example, a single row) according to the actual design requirement.

10 FIG. 151 151 151 151 a a In several embodiments, as shown in, every bonding pad′ has a pointed tip. Hereby, during the laser welding process, the pointed tipof the bonding pad′ can be used as an alignment mark when the image recognition device undergoes alignment.

6 FIG. 152 151 151 133 152 b As shown inagain, in several embodiments, the metal layeron the bonding padsis a solder paste with a thickness T of 3 μm to 11 μm. Please note that when the thickness T thereof is thinner than 3 μm, the welding yield rate of welding the bonding padsand the bonding sectionmay decrease. On the contrary, when the thickness T thereof is thicker than 11 μm, a spatter problem may occur in the metal layerduring the laser welding process, which also may affect the welding yield rate.

According to the aforementioned descriptions of specific embodiments of the present disclosure, it is apparent that, in the touch assembly of the present disclosure, through a trace design of curved wires bending back and forth within a range in a widthwise direction on the bonding section of the peripheral zone, the conductive area between the bonding section and the bonding pads of the flexible circuit board increases. This will not only improve the manufacturing process rate of welding the bonding sections and the bonding pads (especially bonding pads in medium/small size) of curved wires using the laser welding process, but also effectively solves the delamination problem that easily occurs while using the chip on film (COF) technology.

The above preferred embodiments are presented to disclose the present disclosure and shall not be interpreted to limit the scope, applicability, or configuration of the present disclosure in any way. Those skilled in the art may use any alternative embodiments that are modified or changed without departing from the spirit and scope of the present disclosure and shall be included in the appended claims.

100 200 ,: Touch assembly 110 : Protective cover 111 : Visible zone 112 : Peripheral zone 120 : First adhesive layer 13 L: Wire layer 130 : Curved wire 130 A: Enameled wire 131 : Conductive inner core 132 : Outer covering 133 : Signal transmission path 133 a: Trace section 133 b : Bonding section 140 : Second adhesive layer 140 A: Hydrogel 150 : Flexible circuit board 151 151 ,′: Bonding pads 151 a: Pointed tip 152 : Metal layer 910 : Winding machine 920 : Glue spreader 930 : Welding machine 940 : Plate 950 : Roller 960 : Slitter DL: Lengthwise direction DW: Widthwise direction EW: Pre-embedded wire 1 G: First group of wires 2 G: Second group of wires 1 2 L, L: Length P: Tooth portion 1 2 P, P: Incline edge 1 2 3 RF, RF, RF: Separation film S: Spacing 110 120 130 140 210 220 230 240 S, S, S, S, S, S, S, S: Steps T: Thickness W: Width 1 2 θ, θ: Included angle