Electronic Device Comprising Speaker Unit

This application is a continuation application, claiming priority under 35 U.S.C. § 365 (c), of an International application No. PCT/KR2024/016011, filed on Oct. 21, 2024, which is based on and claims the benefit of a Korean patent application number 10-2023-0141236, filed on Oct. 20, 2023, in the Ministry of Intellectual Property (MOIP), the disclosure of which is incorporated by reference herein in its entirety.

Various embodiments disclosed in this document relate to an electronic device including a speaker unit.

A sound output module for reproducing a sound may be included in an electronic device. As more contents are gradually reproduced through electronic devices, users' interest in a sound performance is gradually increasing. That is, as electronic devices are used to output more content, users are becoming increasingly interested in the sound performance of the electronic device.

A sound hole for radiating a sound output from a speaker module to the outside of the electronic device may be designed at an aligned position at the center of the electronic device in consideration of design factors.

The above information may be provided as the related art for the purpose of aiding understanding of the disclosure. No claim or determination is made as to whether any of the foregoing contents may be applied as the prior art related to the disclosure.

Various types of speakers for sound output may be disposed in electronic devices. The electronic device may include a sound channel for radiating a sound output from a front surface of the speaker to a sound hole communicated with the outside thereof. Further, the electronic device may include a resonance space in which a sound output from the speaker may resonate by sealing a rear surface of the speaker. The above-described sound channel, resonance space, and speaker may be modularized and disposed in the electronic device. For example, a speaker module in which a device object formed with the speaker, the sound channel, and the resonance space is formed as a set may be disposed in the electronic device. The sound channel and the resonance space may be formed through a step between the speaker and the device object.

Sound channel and resonance space conditions required according to a type of the electronic device may be different. That is, different types of electronic devices may have different sound channel and resonance space condition requirements. In this case, as a speaker module is newly produced based on the type of the electronic device, a production cost of the electronic device may increase.

Further, as slim-shaped electronic devices are preferred recently, it may be necessary to reduce the size, quantity or thickness of electronic components disposed inside the electronic device. Therefore, a method may be required in which only a speaker of speaker modules is disposed in the electronic device and in which a resonance space and a sound channel are formed through essential components disposed inside the electronic device.

According to an embodiment of the disclosure, only a speaker unit that performs a sound output function, rather than a speaker module type, may be disposed in the electronic device. That is, rather than containing an entire speaker module, the electronic device may contain just the speaker component which outputs sound. The other components within the electronic device may be arranged or configured to perform one or more of the functions which are typically performed by the other components of a traditional or typical speaker module. A sound output from the speaker unit may be transmitted to a sound hole through a sound channel formed through a housing and a device object disposed adjacent to the speaker unit. Further, the speaker unit may be positioned in a sealed resonance space formed through a printed circuit board and a bracket (e.g., shield can).

Technical problems to be achieved in this document are not limited to the above-described technical problems, and other technical problems not described will be clearly understood by those of ordinary skill in the art to which the disclosure belongs from the description below.

According to an embodiment of the disclosure, an electronic device may include a housing positioned at a front surface thereof and including a first part made of a non-metallic material; a first support member disposed in the housing and including a first opening having at least a portion facing the first part; a speaker unit disposed in the housing and configured to face the first opening of the first support member; a sound hole formed in the housing to emit a sound output to the speaker unit; a first sealing member disposed between the first support member and the speaker unit and configured to enclose a sound emission port of the speaker unit and the first opening of the first support member; a first sound channel formed by being enclosed by the first sealing member and configured to connect the first opening and the speaker unit; and a second sound channel positioned between the first support member and the first part and configured to connect the first opening and the sound hole.

According to an embodiment of the disclosure, a speaker structure disposed in a housing of an electronic device may include a first support member positioned at a front surface of the electronic device and including a first opening facing a first part of the housing made of a non-metallic material; a speaker unit configured to face the first opening of the first support member; a first sealing member disposed between the first support member and the speaker unit and configured to enclose a sound emission port of the speaker unit and the first opening of the first support member; a first sound channel formed by being enclosed by the first sealing member and configured to connect the first opening and the speaker unit; and a second sound channel positioned between the first support member and the first part and configured to connect the first opening and a sound hole formed in the housing.

450 According to an embodiment of the disclosure, the speaker unit can be positioned in an injection area of the housing. In the case that the speaker unit is disposed in the injection area of the housing, a first support memberand a separate support member is disposed between the injection area and the speaker unit, thereby securing a sound channel that transmits a sound output from the speaker unit to the sound hole communicated with the outside of the electronic device. For example, the sound channel may be a space formed as the support members are spaced apart from each other at regular intervals with respect to the injection area of the housing.

Further, in an embodiment, the speaker unit can be disposed inside a sealed resonance space through the printed circuit board and the bracket (e.g., shield can). The speaker unit may improve sound flatness and sound quality in a low range by securing a resonance space. Further, as the resonance space is secured through components disposed inside the electronic device, as in the printed circuit board and the bracket, a separate device object (e.g., speaker housing) for forming the resonance space is not required; thus, a production cost of the electronic device may be saved.

Further, in an embodiment, the electronic device can secure a stereo performance and a predetermined level of sound performance by disposing speaker units at the upper end and lower end, respectively.

Effects that can be obtained from the disclosure are not limited to the above-described effects, and other effects not described will be clearly understood by those of ordinary skill in the art to which the disclosure belongs from the description below.

In the following description, various embodiments of this document are described with reference to the attached drawings. It should be appreciated that various embodiments of the present disclosure and the terms used therein are not intended to limit the technological features set forth herein to particular embodiments and include various changes, equivalents, or replacements for a corresponding embodiment.

With regard to the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It is to be understood that a singular form of a noun corresponding to an item may include one or more of the things, unless the relevant context clearly indicates otherwise.

As used herein, each of such phrases as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C,” may include any one of, or all possible combinations of the items enumerated together in a corresponding one of the phrases. As used herein, such terms as “1st” and “2nd,” or “first” and “second” may be used to simply distinguish a corresponding component from another, and does not limit the components in other aspect (e.g., importance or order). It is to be understood that if an element (e.g., a first element) is referred to, with or without the term “operatively” or “communicatively”, as “coupled with,” “coupled to,” “connected with,” or “connected to” another element (e.g., a second element), it means that the element may be coupled with the other element directly (e.g., wiredly), wirelessly, or via a third element.

1 FIG. 101 100 is a block diagram illustrating an electronic devicein a network environmentaccording to various embodiments.

1 FIG. 101 100 102 198 104 108 199 101 104 108 101 120 130 150 155 160 170 176 177 178 179 180 188 189 190 196 197 178 101 101 176 180 197 160 Referring to, the electronic devicein the network environmentmay communicate with an electronic devicevia a first network(e.g., a short-range wireless communication network), or at least one of an electronic deviceor a servervia a second network(e.g., a long-range wireless communication network). According to an embodiment, the electronic devicemay communicate with the electronic devicevia the server. According to an embodiment, the electronic devicemay include a processor, memory, an input module, a sound output module, a display module, an audio module, a sensor module, an interface, a connecting terminal, a haptic module, a camera module, a power management module, a battery, a communication module, a subscriber identification module (SIM), or an antenna module. In some embodiments, at least one of the components (e.g., the connecting terminal) may be omitted from the electronic device, or one or more other components may be added in the electronic device. In some embodiments, some of the components (e.g., the sensor module, the camera module, or the antenna module) may be implemented as a single component (e.g., the display module).

120 140 101 120 120 176 190 132 132 134 120 121 123 121 101 121 123 123 121 123 121 The processormay execute, for example, software (e.g., a program) to control at least one other component (e.g., a hardware or software component) of the electronic devicecoupled with the processor, and may perform various data processing or computation. According to one embodiment, as at least part of the data processing or computation, the processormay store a command or data received from another component (e.g., the sensor moduleor the communication module) in volatile memory, process the command or the data stored in the volatile memory, and store resulting data in non-volatile memory. According to an embodiment, the processormay include a main processor(e.g., a central processing unit (CPU) or an application processor (AP)), or an auxiliary processor(e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor. For example, when the electronic deviceincludes the main processorand the auxiliary processor, the auxiliary processormay be adapted to consume less power than the main processor, or to be specific to a specified function. The auxiliary processormay be implemented as separate from, or as part of the main processor.

123 160 176 190 101 121 121 121 121 123 180 190 123 123 101 108 The auxiliary processormay control at least some of functions or states related to at least one component (e.g., the display module, the sensor module, or the communication module) among the components of the electronic device, instead of the main processorwhile the main processoris in an inactive (e.g., sleep) state, or together with the main processorwhile the main processoris in an active state (e.g., executing an application). According to an embodiment, the auxiliary processor(e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera moduleor the communication module) functionally related to the auxiliary processor. According to an embodiment, the auxiliary processor(e.g., the neural processing unit) may include a hardware structure specified for artificial intelligence model processing. An artificial intelligence model may be generated by machine learning. Such learning may be performed, e.g., by the electronic devicewhere the artificial intelligence is performed or via a separate server (e.g., the server). Learning algorithms may include, but are not limited to, e.g., supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include a plurality of artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-network or a combination of two or more thereof but is not limited thereto. The artificial intelligence model may, additionally or alternatively, include a software structure other than the hardware structure.

130 120 176 101 140 130 132 134 The memorymay store various data used by at least one component (e.g., the processoror the sensor module) of the electronic device. The various data may include, for example, software (e.g., the program) and input data or output data for a command related thereto. The memorymay include the volatile memoryor the non-volatile memory.

140 130 142 144 146 The programmay be stored in the memoryas software, and may include, for example, an operating system (OS), middleware, or an application.

150 120 101 101 150 The input modulemay receive a command or data to be used by another component (e.g., the processor) of the electronic device, from the outside (e.g., a user) of the electronic device. The input modulemay include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

155 101 155 The sound output modulemay output sound signals to the outside of the electronic device. The sound output modulemay include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing record. The receiver may be used for receiving incoming calls. According to an embodiment, the receiver may be implemented as separate from, or as part of the speaker.

160 101 160 160 The display modulemay visually provide information to the outside (e.g., a user) of the electronic device. The display modulemay include, for example, a display, a hologram device, or a projector and control circuitry to control a corresponding one of the display, hologram device, and projector. According to an embodiment, the display modulemay include a touch sensor adapted to detect a touch, or a pressure sensor adapted to measure the intensity of force incurred by the touch.

170 170 150 155 102 101 The audio modulemay convert a sound into an electrical signal and vice versa. According to an embodiment, the audio modulemay obtain the sound via the input module, or output the sound via the sound output moduleor a headphone of an external electronic device (e.g., an electronic device) directly (e.g., wiredly) or wirelessly coupled with the electronic device.

176 101 101 176 The sensor modulemay detect an operational state (e.g., power or temperature) of the electronic deviceor an environmental state (e.g., a state of a user) external to the electronic device, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor modulemay include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

177 101 102 177 The interfacemay support one or more specified protocols to be used for the electronic deviceto be coupled with the external electronic device (e.g., the electronic device) directly (e.g., wiredly) or wirelessly. According to an embodiment, the interfacemay include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

178 101 102 178 A connecting terminalmay include a connector via which the electronic devicemay be physically connected with the external electronic device (e.g., the electronic device). According to an embodiment, the connecting terminalmay include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector).

179 179 The haptic modulemay convert an electrical signal into a mechanical stimulus (e.g., a vibration or a movement) or electrical stimulus which may be recognized by a user via his tactile sensation or kinesthetic sensation. According to an embodiment, the haptic modulemay include, for example, a motor, a piezoelectric element, or an electric stimulator.

180 180 The camera modulemay capture a still image or moving images. According to an embodiment, the camera modulemay include one or more lenses, image sensors, image signal processors, or flashes.

188 101 188 The power management modulemay manage power supplied to the electronic device. According to one embodiment, the power management modulemay be implemented as at least part of, for example, a power management integrated circuit (PMIC).

189 101 189 The batterymay supply power to at least one component of the electronic device. According to an embodiment, the batterymay include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell.

190 101 102 104 108 190 120 190 192 194 198 199 192 101 198 199 196 The communication modulemay support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic deviceand the external electronic device (e.g., the electronic device, the electronic device, or the server) and performing communication via the established communication channel. The communication modulemay include one or more communication processors that are operable independently from the processor(e.g., the application processor (AP)) and supports a direct (e.g., wired) communication or a wireless communication. According to an embodiment, the communication modulemay include a wireless communication module(e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module(e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate with the external electronic device via the first network(e.g., a short-range communication network, such as Bluetooth™ wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or the second network(e.g., a long-range communication network, such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or wide area network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multi components (e.g., multi chips) separate from each other. The wireless communication modulemay identify and authenticate the electronic devicein a communication network, such as the first networkor the second network, using subscriber information (e.g., international mobile subscriber identity (IMSI)) stored in the subscriber identification module.

192 192 192 192 101 104 199 192 The wireless communication modulemay support a 5G network, after a 4G network, and next-generation communication technology, e.g., new radio (NR) access technology. The NR access technology may support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable and low-latency communications (URLLC). The wireless communication modulemay support a high-frequency band (e.g., the mm Wave band) to achieve, e.g., a high data transmission rate. The wireless communication modulemay support various technologies for securing performance on a high-frequency band, such as, e.g., beamforming, massive multiple-input and multiple-output (massive MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication modulemay support various requirements specified in the electronic device, an external electronic device (e.g., the electronic device), or a network system (e.g., the second network). According to an embodiment, the wireless communication modulemay support a peak data rate (e.g., 20 Gbps or more) for implementing eMBB, loss coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of downlink (DL) and uplink (UL), or a round trip of Ims or less) for implementing URLLC.

197 101 197 197 198 199 190 192 190 197 The antenna modulemay transmit or receive a signal or power to or from the outside (e.g., the external electronic device) of the electronic device. According to an embodiment, the antenna modulemay include an antenna including a radiating element composed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna modulemay include a plurality of antennas (e.g., array antennas). In such a case, at least one antenna appropriate for a communication scheme used in the communication network, such as the first networkor the second network, may be selected, for example, by the communication module(e.g., the wireless communication module) from the plurality of antennas. The signal or the power may then be transmitted or received between the communication moduleand the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module.

197 According to various embodiments, the antenna modulemay form a mm Wave antenna module. According to an embodiment, the mm Wave antenna module may include a printed circuit board, a RFIC disposed on a first surface (e.g., the bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a designated high-frequency band (e.g., the mmWave band), and a plurality of antennas (e.g., array antennas) disposed on a second surface (e.g., the top or a side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the designated high-frequency band.

At least some of the above-described components may be coupled mutually and communicate signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)).

101 104 108 199 102 104 101 101 102 104 108 101 101 101 101 101 104 108 104 108 199 101 According to an embodiment, commands or data may be transmitted or received between the electronic deviceand the external electronic devicevia the servercoupled with the second network. Each of the electronic devicesormay be a device of a same type as, or a different type, from the electronic device. According to an embodiment, all or some of operations to be executed at the electronic devicemay be executed at one or more of the external electronic devices,, or. For example, if the electronic deviceshould perform a function or a service automatically, or in response to a request from a user or another device, the electronic device, instead of, or in addition to, executing the function or the service, may request the one or more external electronic devices to perform at least part of the function or the service. The one or more external electronic devices receiving the request may perform the at least part of the function or the service requested, or an additional function or an additional service related to the request, and transfer an outcome of the performing to the electronic device. The electronic devicemay provide the outcome, with or without further processing of the outcome, as at least part of a reply to the request. To that end, a cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic devicemay provide ultra low-latency services using, e.g., distributed computing or mobile edge computing. In another embodiment, the external electronic devicemay include an internet-of-things (IoT) device. The servermay be an intelligent server using machine learning and/or a neural network. According to an embodiment, the external electronic deviceor the servermay be included in the second network. The electronic devicemay be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology or IoT-related technology.

2 FIG.A 2 FIG.B 2 FIG.A is a front perspective view of an electronic device according to various embodiments of the disclosure.is a rear perspective view of the electronic device ofaccording to various embodiments of the disclosure.

200 101 1 FIG. The electronic deviceto be described below may include at least one of the components of the electronic devicedescribed above with reference to.

2 FIG.A 2 FIG.B 2 FIG.A 200 210 210 210 210 210 210 210 210 210 210 210 202 210 211 211 210 218 202 211 211 218 With reference toand, the electronic deviceaccording to an embodiment may include a housingthat includes a first surface (or front surface)A, a second surface (or rear surface)B, and a side surfaceC surrounding a space between the first surfaceA and the second surfaceB. According to an embodiment (not shown), the housingmay refer to a structure forming a part of the first surfaceA, the second surfaceB, and the side surfaceC in. According to an embodiment, the first surfaceA may be formed by a front plate(e.g., glass plate or polymer plate including various coating layers) where at least a portion of the front plate is substantially transparent. The second surfaceB may be formed by a rear platethat is substantially opaque. The rear platemay be formed by, for example, coated or tinted glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two thereof. The side surfaceC may be formed by a side bezel structure (or “side member”)coupled to the front plateand the rear plateand including a metal and/or a polymer. In a certain embodiment, the rear plateand side bezel structuremay be integrally formed and include (i.e. be made from, comprise etc) the same material (e.g., metal material such as aluminum).

202 210 210 202 211 210 210 202 202 211 210 210 202 210 218 210 210 210 210 2 FIG.B In the illustrated embodiment, the front platemay include a first regionD that is curved and seamlessly extended from the first surfaceA toward the rear plate at opposite ends of the longer edge of the front plate. In the illustrated embodiment (see), the rear platemay include a second regionE that is curved and seamlessly extended from the second surfaceB toward the front platerespectively at opposite ends of the longer edge. In a certain embodiment, the front plateor the rear platemay include only one of the first regionD and the second regionE. In a certain embodiment, the front platemay not include the first region and the second region, but may include only a flat surface disposed parallel to the second surfaceB. In the above embodiments, when the electronic device is viewed from the side thereof, the side bezel structuremay have a first thickness (or width) on a side where the first regionD or the second regionE is not included, and may have a second thickness thinner than the first thickness on a side where the first regionD or the second regionE is included.

200 201 203 207 214 204 219 205 212 217 208 217 200 200 According to an embodiment, the electronic devicemay include at least one or more of a display, input device, sound output devicesand, sensor modulesand, camera modulesand, key input device, indicator (not shown), or connector. In certain embodiments, at least one of the elements (e.g., key input deviceor indicator) may be omitted from the electronic device, or another element may be added to the electronic device.

201 202 201 202 210 210 210 201 204 219 217 210 210 The displaymay be exposed, for example, through a significant portion of the front plate. In a certain embodiment, at least a portion of the displaymay be exposed through the front plateforming the first surfaceA and the first regionD of the side surfaceC. The displaymay be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen. In a certain embodiment, at least some of the sensor modulesand, and/or at least some of the key input devicesmay be disposed on the first regionD and/or the second regionE.

203 203 203 203 207 214 207 214 207 214 207 214 203 207 214 208 200 210 210 203 207 214 207 214 210 The input devicemay include a microphone. In a certain embodiment, the input devicemay include a plurality of microphonesarranged to detect the direction of a sound. The sound output devicesandmay include speakersand. The speakersandmay include an external speakerand a call receiver. In a certain embodiment, the microphone, the speakersand, and the connectormay be at least partially disposed in the internal space of the electronic device, and may be exposed to the external environment through at least one hole formed in the housing. In a certain embodiment, the hole formed in the housingmay be commonly used for the microphoneand the speakersand. In a certain embodiment, the sound output devicesandmay include a speaker (e.g., piezo speaker) that operates in isolation from the hole formed in the housing.

204 219 200 204 219 204 210 210 219 210 210 210 210 210 201 200 The sensor modulesandmay generate an electrical signal or a data value corresponding to an internal operating state of the electronic deviceor an external environmental state. The sensor modulesandmay include, for example, a first sensor module(e.g., proximity sensor) and/or a second sensor module (not shown) (e.g., fingerprint sensor) disposed on the first surfaceA of the housing, and/or a third sensor module(e.g., heart rate monitor (HRM) sensor) disposed on the second surfaceB of the housing. The fingerprint sensor may be disposed on the first surfaceA (e.g., home key button) of the housing, on a portion of the second surfaceB, and/or under the display. The electronic devicemay further include a sensor module which is not shown, for example, at least one of a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, a proximity sensor, or an illuminance sensor.

205 212 205 210 200 212 210 213 205 212 213 200 The camera modulesandmay include a first camera moduledisposed on the first surfaceA of the electronic device, a second camera moduledisposed on the second surfaceB, and/or a flash. The camera modulesandmay include one or plural lenses, an image sensor, and/or an image signal processor. The flashmay include, for example, a light emitting diode or a xenon lamp. In a certain embodiment, two or more lenses (wide-angle lens, ultra-wide-angle lens, or telephoto lens) and image sensors may be arranged in one surface of the electronic device.

217 210 210 200 217 217 201 217 201 The key input devicesmay be arranged in the side surfaceC of the housing. According to an embodiment, the electronic devicemay not include some or all of the above-mentioned key input devices, and a key input devicenot included may be implemented on the displayin a different form such as a soft key. According to an embodiment, the key input devicesmay be implemented using a pressure sensor included in the display.

210 210 200 205 The indicator may be disposed on, for example, the first surfaceA of the housing. The indicator may provide, for example, state information of the electronic devicein a light form (e.g., light emitting element). According to an embodiment, the light emitting element may provide a light source interacting with, for example, the operation of the camera module. The indicator may include, for example, an LED (light emitting diode), an IR (infrared) LED, and/or a xenon lamp.

208 208 The connector holesmay include a first connector holecapable of accepting a connector (e.g., universal serial bus (USB) connector) for transmitting and receiving power and/or data to and from an external electronic device, and/or a second connector hole (e.g., earphone jack) (not shown) capable of accepting a connector for transmitting and receiving an audio signal to and from an external electronic device.

205 212 204 219 201 205 204 200 201 202 201 205 205 201 205 204 202 201 Some of the camera modulesand, some of the sensor modulesand, or the indicator may be disposed to be exposed through the display. For example, the camera module, the sensor module, or the indicator may be arranged in the internal space of the electronic deviceso as to be in contact with the external environment through an opening of the displayperforated up to the front plateor a transmissive region. According to an embodiment, the region in which the displayand the camera moduleface each other may be formed as a transmissive region having a preset transmittance as a part of the content display area. According to an embodiment, the transmissive region may be formed to have a transmittance in a range of about 5 percent to about 20 percent. This transmissive region may include a region overlapping an effective area (e.g., angle-of-view area) of the camera modulethrough which light passes for image generation with an image formed by an image sensor. For example, the transmissive region of the displaymay include a region having a lower pixel density than surrounding regions. For example, the transmissive region may replace the opening. For example, the camera modulemay include an under display camera (UDC). According to an embodiment, a certain sensor modulemay be disposed in the internal space of the electronic device so as to perform its function without being visually exposed through the front plate. For example, in this case, the region of the displayfacing the sensor module may not need a perforated opening.

200 200 210 330 2 2 FIGS.A andB 3 FIG. According to an embodiment, an electronic devicehas a bar type or plate type appearance, but the disclosure is not limited thereto. For example, the illustrated electronic devicemay be part of a foldable electronic device, a slideable electronic device, a stretchable electronic device, and/or a rollable electronic device. The “foldable electronic device”, the “slidable electronic device”, the “stretchable electronic device” and/or the “rollable electronic device” may mean an electronic device in which at least a portion of the display is folded, wound or rolled, in which an area of the display is at least partially expanded, and/or in which the display may be received inside the housing (e.g., the housingof) because the display (e.g., a displayof) may be bent. The foldable electronic device, the slideable electronic device, the stretchable electronic device, and/or the rollable electronic device may expand and use a screen display area by unfolding the display or exposing a larger area of the display to the outside according to the user's needs.

3 FIG. 2 FIG.A 200 is an exploded perspective view of the electronic deviceofaccording to various embodiments of the disclosure.

300 200 3 FIG. 2 2 FIGS.A andB The electronic deviceofmay be at least partially similar to the electronic deviceof, or may include other embodiments of an electronic device.

3 FIG. 2 2 FIG.A orB 2 FIG.A 2 FIG.A 2 FIG.B 2 2 FIG.A orB 300 200 310 311 320 202 330 201 340 350 360 370 380 211 311 360 300 300 200 With reference to, the electronic device(e.g., electronic devicein) may include a side member(e.g., side bezel structure), a first support member(e.g., bracket or support structure), a front plate(e.g., front cover) (e.g., front platein), a display(e.g., displayin), a board(e.g., printed circuit board (PCB), flexible PCB (FPCB), or rigid-flexible PCB (RFPCB)), a battery, a second support member(e.g., rear case), an antenna, and a rear plate(e.g., rear cover) (e.g., rear platein). In a certain embodiment, at least one of the components (e.g., first support memberor second support member) may be omitted from the electronic deviceor other components may be additionally included therein. At least one of the components of the electronic devicemay be the same as or similar to at least one of the components of the electronic deviceof, and repeated descriptions will be omitted below.

311 300 310 310 311 311 330 340 120 130 177 340 1 FIG. 1 FIG. 1 FIG. The first support membermay be disposed inside the electronic deviceand may be connected to the side memberor may be integrally formed with the side member. The first support membermay be made of, for example, a metal material and/or a non-metal (e.g., polymer) material. The first support membermay have one surface coupled to the displayand the other surface coupled to the board. A processor (e.g., processorin), a memory (e.g., memoryin), and/or an interface (e.g., interfacein) may be mounted on the board. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, and a communication processor.

The memory may include, for example, a volatile memory or a non-volatile memory.

300 The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an secure digital (SD) card interface, and/or an audio interface. The interface may, for example, electrically or physically connect the electronic deviceto an external electronic device, and may include a USB connector, an SD card/MMC (multimedia card) connector, or an audio connector.

350 300 350 340 350 300 350 300 The batteryis a device for supplying power to at least one component of the electronic device, and may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell. At least a portion of the batterymay be disposed substantially coplanar with the board, for example. The batterymay be integrally disposed inside the electronic device. According to an embodiment, the batterymay be disposed attachably and detachably with the electronic device(i.e. fixed or removable).

370 380 350 370 370 310 311 The antennamay be disposed between the rear plateand the battery. The antennamay include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antennamay, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. According to an embodiment, an antenna structure may be formed by a part of the side bezel structureand/or the first support memberor a combination thereof.

4 FIG. 5 FIG.A 5 FIG.B 6 FIG. 2 FIG.A 7 FIG.A 7 FIG.B 7 FIG.C 7 FIG.A 8 FIG.A 8 FIG.B 7 FIG.C 9 FIG.A 9 FIG.B 8 FIG.B 9 FIG.C 9 FIG.B is a diagram illustrating a portion of an electronic device according to an embodiment disclosed in this document.is a diagram illustrating a housing of an electronic device viewed from a front surface of the electronic device according to an embodiment disclosed in this document.is a diagram illustrating a housing of an electronic device viewed from a rear surface of the electronic device according to an embodiment disclosed in this document.is a cross-sectional view taken along line A-A ofaccording to an embodiment of the disclosure.is a diagram illustrating a seating groove in which a first part, a second part, and a first support member of a housing are seated and viewed from a rear surface of the electronic device according to an embodiment of the disclosure.is a top plan view illustrating a first support member according to an embodiment of the disclosure.is a diagram illustrating a first support member disposed in a seating groove of.is a top plan view illustrating a second support member according to an embodiment of the disclosure.is a diagram illustrating a second support member disposed in a portion of the first support member illustrated in.is a top plan view illustrating a second sealing member according to an embodiment of the disclosure.is a diagram illustrating a second sealing member disposed in a portion of the second support member illustrated in.is a diagram illustrating a speaker unit disposed in a housing so as to face a first opening of a first support member illustrated in.

400 101 200 300 400 400 4 FIG. 1 FIG. 2 2 FIGS.A andB 3 FIG. 2 2 3 FIGS.A,B, and 1 2 2 3 FIGS.,A,B, and In an embodiment disclosed in this document, an electronic deviceillustrated inmay be an example of the electronic deviceillustrated in, the electronic deviceillustrated in, and/or the electronic deviceillustrated in. The electronic devicedescribed below is described based on a bar-shaped electronic device illustrated in, but in some embodiments, the electronic devicemay be part of a foldable electronic device, a slideable electronic device, a stretchable electronic device, and/or a rollable electronic device. Further, the same member numbers are used for all components that are the same or similar to those described in, except for the case of being indicated separately.

400 410 210 410 218 400 410 410 412 411 2 FIG.A 2 FIG.A According to an embodiment, the electronic device may support various device objects and electrical objects constituting the electronic device, and include a housing(e.g., the housingof) wherein at least a portion of the housingconstitutes (i.e. forms part of) an appearance (e.g., the side bezel structureof) of the electronic device. Here, the electrical objects may be understood as a general term for components that transmit or receive electrical signals. The housingmay be composed of a single component or may be composed by coupling a plurality of components. For example, the housingmay include a device object (e.g., a second part) made of a metal material and a non-metallic device object (e.g., a first part) coupled with the device object made of a metal material through an injection process.

410 410 411 412 411 410 412 410 411 412 In an embodiment, the housingmay be made of various materials. For example, the housingmay include a first partmade of a non-metallic material and/or a second partmade of a metallic material. In an embodiment, the first partis made of a non-metallic material and may be a concept referring to a device object constituting the housing. The second partis made of a metal material and may be a concept referring to a device object constituting the housing. In an embodiment, the first partmay be coupled to the second partmade of a metal material through an injection process. In an embodiment, the metal material may include an alloy of aluminum, stainless steel (STS, SUS), iron, magnesium, and/or titanium. The non-metallic material may include a synthetic resin, ceramic, and/or engineering plastic.

4 5 FIGS.andA 1 FIG. 5 FIG.A 4 FIG. 1 FIG. 2 FIG.A 3 FIG. 403 4031 403 180 410 401 160 201 330 403 4031 403 403 403 4031 403 403 In an embodiment, with reference to, a camera modulemay be disposed so that a lens unitof the camera module(e.g., the camera moduleof) is aligned with the center of a width direction (e.g., the X-axis direction of) of the housing. With reference to, the display(e.g., the display moduleof, the displayof, and the displayof) may include a camera holefacing the lens unitof the camera module. The camera holemay be a portion in which external light passes through the camera moduleand enters the lens unitof the camera module. At least a portion of a portion corresponding to the camera holemay be transparent.

5 5 FIGS.A andB 1 FIG. 2 FIG.A 5 5 FIGS.A andB 5 FIG.A 410 400 430 155 214 430 410 430 120 430 430 According to an embodiment, as illustrated in, in the housingof the electronic device, a speaker unit(e.g., the sound output moduleofand/or the sound output deviceof) may be disposed. In an embodiment, with reference to, the speaker unitmay be disposed at an upper end (e.g., a portion positioned in the +Y direction based on) of a housing. In an embodiment, a speaker unitmay mean a component that outputs a sound according to a command from the processorwhen an application is executed. In an embodiment, the speaker unitmay include a speaker that outputs a sound and/or a receiver that outputs a call sound when an application is running. In an embodiment, the speaker unitmay output a receiver sound, which is a call sound, when making a call, and output a speaker sound when operating an application such as a video or a game.

207 410 400 430 2 FIG.A 2 FIG.A In an embodiment, another speaker unit (e.g., the sound output deviceof) may be disposed at a lower end (e.g., a portion positioned in the −Y direction based on) of the housing. The electronic deviceof the disclosure may provide a synesthetic sound to a user by securing a stereo performance through speaker unitsdisposed at the upper end and lower end, respectively.

5 FIG.B 5 6 FIGS.B andA 430 400 403 4031 403 410 430 410 With reference to, in various embodiments disclosed in this document, the speaker unitof the electronic devicemay be disposed in a first direction (e.g., −X direction in) with respect to the camera module. In the case that the lens unitof the camera moduleis disposed to be aligned with the center in a width direction of the housing, the speaker unitmay be disposed eccentrically (i.e. offset) with respect to the center in the width direction of the housing.

4 6 FIGS.and 2 FIG.A 3 FIG. 4 FIG. 6 FIG. 400 420 214 420 410 401 420 401 310 410 471 470 360 420 420 400 410 401 420 420 410 401 420 411 410 400 420 401 420 401 430 400 In an embodiment, with reference to, the electronic devicemay include a sound hole(e.g., the sound holeof) for connecting the outside thereof and an inner space thereof. The sound holemay include a slit-shaped groove positioned between the housingand the display. For example, the sound holemay be a slit-shaped hole positioned between the displayand a side memberof the housingor a side wall partof a rear case(e.g., a second support memberof). In an embodiment, the slit-shaped sound holemay be formed to extend in a predetermined direction (e.g., the X-axis direction in). For example, a plurality of holes constituting the sound holemay be arranged in a direction parallel to the width direction of the electronic device. In an embodiment, at least a portion of the housingand the displaymay be concave to form the slit-shaped sound hole. In some cases, the slit-shaped sound holemay be provided by a step formed between the housingand the display. In an embodiment, the sound holemay be formed in the first partof the housingand face a front surface (e.g., a surface facing the +Z direction based on) of the electronic device. In an embodiment, the sound holemay be formed in the display. For example, the sound holemay be formed at the upper end of the displayso that a sound output from the speaker unitmay be emitted to the outside of the electronic device.

420 403 420 403 403 410 420 403 410 4 FIG. In an embodiment, the center of the sound holein the width direction (e.g., the X-axis direction in) may be positioned to be aligned with the camera hole. In other words, the sound holemay be formed symmetrically with respect to the camera hole. Because the camera holemay be aligned with the center of the housing, the sound holealigned with the camera holemay be aligned with the center of the housing.

420 420 420 420 In an embodiment, in order to prevent an external foreign matter from entering through the sound hole, a foreign matter prevention member (not illustrated) including a mesh may be disposed in the sound hole. The foreign matter prevention member may be disposed at an entrance portion of the sound holeor inside the sound hole.

430 400 1 2 3 410 450 460 510 520 440 340 530 410 3 FIG. According to an embodiment disclosed in this document, a sound radiated from the speaker unitmay be emitted to the outside of the electronic devicethrough a sound space (e.g., a first sound channel P, a second sound channel P, and a rear sound space P) formed through the housingand/or a device object (e.g., a first support member, a second support member, a first sealing member, a second sealing member, and a printed circuit board(e.g., a substrateand/or a bracketof) disposed within the housing. Here, the “sound channel” or the “sound space” may mean a passage that guides transmission of a sound (sound wave, sound). For example, the sound channel or the sound space may mean a physical space (area, region, volume, or gap). The sound channel or the sound space may include a space filled with a medium (e.g., air) capable of transmitting a sound wave. Hereinafter, a sound being transmitted through a sound channel or a sound space may mean that a sound is transmitted through a specific space.

430 1 2 3 430 430 420 430 420 3 430 430 6 FIG. 6 FIG. Hereinafter, the sound space connected to the speaker unitwill be described by dividing it into a front sound space (e.g., the first sound channel P, the second sound channel P), and the rear sound space P. In an embodiment, the front sound space may be positioned at the front surface (e.g., +Z direction based on) of the speaker unit, and may be a channel connecting the speaker unitand the sound holein order to transmit the sound output from the speaker unitto the sound hole. In an embodiment, the rear sound space Pmay be partially positioned at a rear surface (e.g., −Z direction based on) of the speaker unitand be a space that induces resonance of a sound (e.g., low range sound) output to the speaker unit.

6 FIG. 6 7 7 7 FIGS.,A,B, andC 430 420 430 420 410 450 510 430 510 450 411 410 1 2 430 400 1 2 420 1 2 According to an embodiment, as illustrated in, a sound output from the speaker unitmay be emitted to the sound holethrough the front sound space. In an embodiment, the front sound space connecting the speaker unitand the sound holemay be a space formed through the housing, the first support member, and the first sealing member. In an embodiment, with reference to, the front sound space may be a space formed by stacking in order of the speaker unit, the first sealing member, the first support member, and the first partof the housing. In an embodiment, the front sound space may include a first sound channel Pand a second sound channel Pto be described later. The sound output from the speaker unitmay be emitted to the outside of the electronic devicethrough the first sound channel P, the second sound channel P, and the sound hole. A detailed description of the first sound channel Pand the second sound channel Pwill be described below.

6 7 7 7 FIGS.,A,B, andC 6 FIG. 450 411 410 411 410 450 411 410 450 411 410 2 430 420 450 451 430 420 2 451 450 411 410 In an embodiment, with reference to, at least a portion of the first support membermay be positioned in the first partof the housing. As described above, the first partmay be an injection part of the housingmade of a non-metallic material. In an embodiment, the first support membermay be spaced apart from the first partof the housingby a predetermined distance in the −Z direction of. A space between the first support memberand the first partof the housingmay be used as a channel (e.g., the second sound channel P) for transmitting a sound output from the speaker unitto the sound hole. In an embodiment, the first support membermay include a first opening. The sound output from the speaker unitmay be transmitted to the sound holeby passing through a space (e.g., the second sound channel P) between the first opening—the first support memberand the first partof the housing.

450 450 450 In an embodiment, the first support membermay be made of various materials. For example, the first support membermay be made of a metal material or a non-metallic material. In an embodiment, the metal material may include an alloy of aluminum, stainless steel (STS, SUS), iron, magnesium, and/or titanium. The non-metallic material may include a synthetic resin, ceramic, and/or engineering plastic. Further, the first support membermay be made of various materials within the range available to those skilled in the art.

430 450 430 410 451 450 6 FIG. In an embodiment, the speaker unitmay be positioned in the −Z direction with respect to the first support memberbased on. The speaker unitmay be disposed in the housingso that a sound emission port (not illustrated) is positioned in the first openingof the first support member.

6 FIG. 510 430 450 510 430 451 450 510 510 510 430 450 430 451 450 510 510 1 430 451 450 1 510 510 430 450 430 430 450 430 451 450 1 In an embodiment, with reference to, a first sealing membermay be disposed between the speaker unitand the first support member. In an embodiment, the first sealing membermay be in the form of a closed loop enclosing the sound emission port of the speaker unitand the first openingof the first support member. In an embodiment, the first sealing membermay be made of an elastic material such as rubber, urethane and/or rubber, or a soundproofing material. In an embodiment, as an adhesive material is applied to at least one surface of the first sealing member, the first sealing membermay be adhered to the speaker unitand the first support member. In an embodiment, the sound emission port of the speaker unitand the first openingof the first support membermay be positioned inside the first sealing member. An internal space of the first sealing membermay be a first sound channel Pconnecting the sound emission port of the speaker unitand the first openingof the first support member. For example, the first sound channel Pmay be a space enclosed by the first sealing member. As the first sealing memberis in close contact with the speaker unitand the first support member, the sound radiated from the sound emission port of the speaker unitmay be prevented from being leaked to a space between the speaker unitand the first support member. Accordingly, the sound output from the speaker unitmay be transmitted to the first openingof the first support memberthrough the first sound channel P.

6 FIG. 6 FIG. 450 411 410 450 411 450 410 2 2 451 450 420 410 420 411 410 400 430 400 1 451 450 2 420 In an embodiment, with reference to, as the first support memberis spaced apart from the first partof the housingat a predetermined distance, a space may be formed between the first support memberand the first part. Hereinafter, the space enclosed by the first support memberand the housingwill be referred to as a second sound channel P. In an embodiment, the second sound channel Pmay connect the first openingof the first support memberand the sound holeformed in the housing. In an embodiment, the sound holemay be formed in the first partof the housingso as to face the front surface (e.g., a surface facing the +Z direction based on) of the electronic device. Therefore, a sound output from the speaker unitmay be emitted to the outside of the electronic devicethrough the first sound channel P—the first openingof the first support member—the second sound channel P—the sound hole.

6 7 7 7 FIGS.,A,B, andC 413 450 411 410 413 450 411 2 411 410 450 413 In an embodiment, with reference to, a seating groovein which the first support memberis seated (supported, attached, contacted to) may be formed in the first partof the housing. In an embodiment, the seating groovemay be a concave groove formed to seat the first support memberin the first part. In an embodiment, a second sound channel Ppositioned between the first partof the housingand the first support membermay be a part of a seating groove.

450 411 410 450 412 410 450 415 410 450 414 410 415 520 3 414 415 414 411 412 410 In an embodiment, a portion of the first support membermay be disposed in the first partof the housing, and another portion of the first support membermay be disposed in the second partof the housing. In an embodiment, at least a portion of the first support membermay be disposed in a latch jawformed in the housing. In an embodiment, the first support membermay be guided through a short jawformed in the housingto be seated on the latch jaw. As will be described later, a portion of the second sealing memberconstituting the rear sound space Pmay be disposed in the short jaw. In an embodiment, the latch jawand the short jawmay be part of the first partand/or the second partof the housing.

450 411 410 450 414 411 415 411 In an embodiment, the first support membermay be disposed only in the first partof the housing. In this case, a portion of the first support membermay be guided through the short jawpositioned in the first partto be seated on the latch jawpositioned in the first part.

6 FIG. 6 FIG. 6 FIG. 400 440 430 440 4401 450 4402 470 440 430 440 441 430 430 441 440 According to an embodiment, as illustrated in, the electronic devicemay include a printed circuit boardelectrically connected to the speaker unit. In an embodiment, the printed circuit boardmay be disposed so that a first surface(e.g., a surface facing the +Z direction based on) faces the first support memberand that a second surface(e.g., a surface facing the −Z direction based on) faces the rear case. In an embodiment, the printed circuit boardmay enclose a portion of the speaker unit. In an embodiment, the printed circuit boardmay include a second openingthat receives the speaker unit. The speaker unitmay be disposed in the second opening; thus, a side area thereof may be enclosed by the printed circuit board.

530 441 4402 440 430 3 530 441 530 430 440 530 6 FIG. In an embodiment, a bracketcovering the second openingmay be disposed at the second surface(e.g., a surface facing the −Z direction based on) of the printed circuit board. In an embodiment, the speaker unitmay be positioned in a space (e.g., the rear sound space P, resonance space) formed as the bracketcloses the second opening. In an embodiment, the bracketmay be a shield can (i.e. a shield) made of a metal material. The shield can may shield, reduce or prevent the transmission of electromagnetic waves and/or noise generated in electronic components so that at least some of the electromagnetic waves and/or noise cannot penetrate the shield can. For example, the shield can may shield, reduce or prevent electromagnetic waves and/or noise generated in electronic components disposed in the speaker unitand the printed circuit boardso that at least some of the electromagnetic waves and/or noise cannot penetrate the shield can. The shield can shields, prevents or reduces electromagnetic waves and/or noise generated by the speaker unit and the printed circuit board from being transmitted to other components in the electronic device, or to the outside of the electronic device. The shield can also shields, prevents or reduces electromagnetic waves and/or noise generated by components other than the speaker unit and the printed circuit board from being transmitted to the speaker unit and printed circuit board. In an embodiment, the bracketmay be made of a non-metallic material such as a synthetic resin, ceramic, and/or engineering plastic.

6 9 9 9 FIGS.,A,B, andC 6 FIG. 4401 440 520 520 520 520 440 410 520 440 410 510 510 520 412 410 520 414 450 413 According to an embodiment, as illustrated in, at the first surface(e.g., a surface facing the +Z direction based on) of the printed circuit board, a second sealing membermay be disposed. In an embodiment, the second sealing membermay have a closed loop shape. In an embodiment, the second sealing membermay be made of an elastic material such as rubber, urethane, a soundproofing material, or a combination thereof. In an embodiment, the second sealing membermay be adhered to the printed circuit boardand the housingby applying an adhesive material to at least one surface thereof. In an embodiment, the second sealing membermay be adhered between the printed circuit boardand the housingso as to enclose the first sealing memberat the outside of the first sealing member. In an embodiment, at least a portion of the second sealing membermay be positioned in the second partof the housing. Another part of the second sealing membermay be positioned at the short jawthat guides the first support memberto be seated in the seating groove.

6 FIG. 6 8 8 FIGS.,A, andB 6 8 9 FIGS.andA toB 6 FIG. 413 410 413 414 410 1 450 440 2 414 440 520 4401 440 520 450 520 414 410 520 450 1 2 400 460 1 2 460 450 440 460 450 460 450 1 2 According to an embodiment, as illustrated in, as the seating grooveis formed in the housing, a step may occur between the seating grooveand another area (e.g., the short jaw) of the housing. In an embodiment, a first gap Lbetween the first support memberand the printed circuit boardmay be wider than a second gap Lbetween the short jawand the printed circuit board. As described above, the second sealing membermay be disposed in the first surfaceof the printed circuit board, a portion of the second sealing membermay face the first support member, and another portion of the second sealing membermay be positioned at the short jawof the housing. In this case, a portion of the second sealing memberfacing the first support membermay not be supported by a space corresponding to the difference between the first gap Land the second gap L. According to an embodiment of the disclosure, as illustrated in, the electronic devicemay include a second support memberthat compensates for the difference between the first gap Land the second gap L. In an embodiment, with reference to, the second support membermay be disposed between the first support memberand the printed circuit board. In an embodiment, the second support membermay be disposed in the first support member. In an embodiment, a thickness of a portion of the second support memberdisposed in the first support member(e.g., a length in the Z-axis direction based on) may have a thickness equal to the difference between the first gap Land the second gap L.

460 460 460 In an embodiment, the second support membermay be made of various materials. For example, the second support membermay be made of a metal material or a non-metallic material. In an embodiment, the metal material may include an alloy of aluminum, stainless steel (STS, SUS), iron, magnesium, and/or titanium. The non-metallic material may include a synthetic resin, ceramic, and/or engineering plastic. Further, the second support membermay be made of various materials within the range available to those skilled in the art.

6 FIG. 400 3 410 440 530 510 520 520 430 450 440 410 440 3 430 3 430 430 430 3 430 According to an embodiment, as illustrated in, the electronic devicemay include a rear sound space Penclosed by the housing, the printed circuit board, the bracket, the first sealing member, and the second sealing member. In an embodiment, the second sealing membermay block a sound output from the speaker unitfrom being emitted to the space between the first support memberand the printed circuit boardand between the housingand the printed circuit board. In an embodiment, the rear sound space Pmay be a space in which a sound output from the speaker unitis transmitted. In an embodiment, the rear sound space Pmay improve a sound performance of the speaker unitby inducing resonance of the sound output from the speaker unitwithin a closed area. For example, a low range sound output from the speaker unitis radiated to a resonance space (e.g., the rear sound space P) formed in a rear direction of the speaker unit, thereby inducing resonance within the closed space and improving a low range sound performance.

400 3 400 430 3 440 530 510 520 430 According to an embodiment of the disclosure, the electronic devicemay design the rear sound space Pthrough components disposed in the electronic devicewithout a separate space design. In an embodiment, resonance of a sound generated in the speaker unitmay be induced through the rear sound space Pformed by the printed circuit board, the bracket, the first sealing member, and the second sealing member. Accordingly, a sound performance of the speaker unitin the low range may be improved.

6 FIG. 6 FIG. 3 FIG. 400 470 480 380 470 470 471 400 460 471 According to an embodiment, as illustrated in, the electronic devicemay include a rear casedisposed at the rear surface (e.g., the surface facing the −Z direction based on) thereof and a rear cover(e.g., the rear plateof) for covering the rear caseat the rear surface thereof and constituting an appearance thereof. In an embodiment, the rear casemay include a side wall partpositioned at the side surface of the electronic device. In an embodiment, at least a portion of the second support membermay be disposed in the side wall part.

530 440 441 530 530 470 530 470 440 441 440 3 470 440 510 520 In the above description, it has been described that the bracketis disposed in the printed circuit boardto cover the second opening, but the disclosure may not be limited thereto. In an embodiment, the bracketmay be formed in various shapes. In an embodiment, the bracketmay be part of the rear case. For example, the bracketmay be extended from one surface of the rear casetoward the printed circuit boardto enclose the second openingof the printed circuit board. In this structure, the rear sound space Pmay be formed by being enclosed by the rear case, the support part, the printed circuit board, the first sealing member, and the second sealing member.

460 410 1 440 2 414 410 440 460 1 2 520 4401 440 410 450 441 440 510 400 460 3 400 3 530 440 450 510 520 Further, in the above description, the description was made on the assumption that the second support memberis disposed in the housing. However, in the case that the first gap Lbetween the first support member and the printed circuit boardand the second gap Lbetween the short jawof the housingand the printed circuit boardare the same, a second support memberthat compensates for the difference between the first gap Land the second gap Lmay not be separately required. In this case, the second sealing membermay be adhered to the first surfaceof the printed circuit board, the housing, and the first support memberso as to enclose the second openingof the printed circuit boardat the outside of the first sealing member. In this case, the electronic devicemay not include the second support memberbut may form a rear sound space P. For example, the electronic devicemay form a rear sound space Pthrough the bracket, the printed circuit board, the first support member, the first sealing member, and the second sealing member.

430 411 410 430 411 410 450 510 411 430 1 430 420 400 430 440 530 430 400 440 530 410 400 400 430 According to an embodiment of the disclosure, the speaker unitmay be positioned at the first partmade of a non-metallic material of the housing. In the case that the speaker unitis disposed in the first partof the housing, the first support memberand the first sealing memberare disposed between the first partand the speaker unit, thereby forming a first sound channel Pthat transmits a sound output from the speaker unitto the sound holecommunicated with the outside of the electronic device. Further, in an embodiment, the speaker unitmay be disposed inside a sealed resonance space through the printed circuit boardand the bracket(e.g., shield can). The speaker unitmay improve sound flatness and sound quality in a low range by securing a resonance space. Further, as the resonance space is secured through components disposed inside the electronic device, as in the printed circuit boardand the bracket, a separate device object (e.g., the speaker housing) for forming the resonance space is not required; thus, a production cost of the electronic devicemay be saved. Further, in an embodiment, the electronic devicecan secure a stereo performance and a predetermined level of sound performance by disposing the speaker unitsat the upper end and the lower end, respectively.

400 101 200 410 210 411 450 451 440 155 214 420 510 1 2 1 FIG. 2 FIG.A 2 FIG.A 1 FIG. 2 FIG.A According to an embodiment of the disclosure, the electronic device(e.g., the electronic deviceofand/or the electronic deviceof) may include a housing(e.g., the housingof) positioned at a front surface thereof and including a first partmade of a non-metallic material; a first support memberdisposed in the housing and including a first openinghaving at least a portion facing the first part; a speaker unit(e.g., the sound output moduleofand/or the sound output deviceof) disposed in the housing and configured to face the first opening of the first support member; a sound holeformed in the housing to emit a sound output to the speaker unit; a first sealing memberdisposed between the first support member and the speaker unit and configured to enclose a sound emission port of the speaker unit and the first opening of the first support member; a first sound channel Pformed by being enclosed by the first sealing member and configured to connect the first opening and the speaker unit; and a second sound channel Ppositioned between the first support member and the first part and configured to connect the first opening and the sound hole.

440 340 441 520 4401 3 FIG. Further, the electronic device may further include a printed circuit board(e.g., the substrateof) including a second openinginto which at least a portion of the speaker unit is inserted, and electrically connected to the speaker unit; and a second sealing memberpositioned outside the first sealing member and disposed between a first surfaceof the printed circuit board and the housing so as to enclose the second opening of the printed circuit board.

460 Further, the electronic device may further include a second support memberdisposed in the first support member and adhered to the second sealing member.

1 2 Further, in the second support member, a thickness of a portion positioned between the first support member and the second sealing member may be formed in a length equal to a difference between a first gap Lbetween the printed circuit board and the first support member and a second gap Lbetween a portion of the housing in which the second sealing member is disposed and the printed circuit board.

412 Further, the housing may include a second partadjacent to the first part, and at least a portion of the second sealing member may be adhered to the second part.

530 4402 3 Further, the electronic device may further include a bracketdisposed at a second surfaceof the printed circuit board and configured to cover the speaker unit and to shield the second opening of the printed circuit board; and a rear sound space Penclosed by the printed circuit board, the bracket, the first sealing member, and the second sealing member.

Further, the bracket may be made of a metal material to block electromagnetic waves and noise.

413 Further, the first part may include a seating groovein which the first support member is seated.

Further, the second sound channel may be a part of the seating groove.

412 Further, the housing may include a second partadjacent to the first part, and a part of the second sealing member may be adhered to the first part, and the other part thereof may be adhered to the second part.

Further, the sound hole may be formed in the first part to be positioned at a front surface of the electronic device.

470 471 Further, the electronic device may further include a rear caseincluding a side wall partpositioned toward a side surface thereof and having at least portion positioned at a rear surface thereof.

Further, at least a portion of the second support member may be disposed in the side wall part.

3 Further, the electronic device may further include a support part extended from one surface of the rear case toward the second surface of the printed circuit board to enclose the second opening; and a rear sound space Penclosed by the rear case, the support part, the printed circuit board, the first sealing member, and the second sealing member.

410 210 400 101 200 450 451 411 430 155 214 510 1 2 420 2 FIG.A 1 FIG. 2 FIG.A 1 FIG. 2 FIG.A According to an embodiment of the disclosure, a speaker structure disposed in a housing(e.g., the housingof) of an electronic device(e.g., the electronic deviceof, the electronic deviceof) may include a first support memberpositioned at a front surface of the electronic device and including a first openingfacing a first partof the housing made of a non-metallic material; a speaker unit(e.g., the sound output moduleofand/or the sound output deviceof) configured to face the first opening of the first support member; a first sealing memberdisposed between the first support member and the speaker unit and configured to enclose a sound emission port of the speaker unit and the first opening of the first support member; a first sound channel Pformed by being enclosed by the first sealing member and configured to connect the first opening and the speaker unit; and a second sound channel Ppositioned between the first support member and the first part and configured to connect the first opening and a sound holeformed in the housing.

340 440 441 Further, the speaker structure may further include a printed circuit boardorincluding a second openinginto which at least a portion of the speaker unit is inserted, and electrically connected to the speaker unit; and

520 4401 A second sealing memberpositioned outside the first sealing member and disposed between the first surfaceof the printed circuit board and the housing so as to enclose the second opening of the printed circuit board.

460 Further, the speaker structure may further include a second support memberdisposed in the first support member and adhered to the second sealing member.

1 2 Further, in the second support member, a thickness of a portion positioned between the first support member and the second sealing member may be formed in a length equal to a difference between a first gap Lbetween the printed circuit board and the first support member and a second gap Lbetween a portion of the housing in which the second sealing member is disposed and the printed circuit board.

530 4402 3 Further, the speaker structure may further include a bracketdisposed at a second surfaceof the printed circuit board and configured to cover the speaker unit and to shield a second opening of the printed circuit board; and a rear sound space Penclosed by the printed circuit board, the bracket, the first sealing member, and the second sealing member.

470 4402 3 Further, the speaker structure may further include a rear casehaving at least a portion positioned at a rear surface of the electronic device; a support part extended from one surface of the rear case toward a second surfaceof the printed circuit board to enclose the second opening; and a rear sound space Penclosed by the rear case, the support part, the printed circuit board, the first sealing member, and the second sealing member.

An electronic device according to various embodiments disclosed in this document may be various types of devices. The electronic device may include, for example, a portable communication device (e.g., smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of this document is not limited to the above-described devices.

It should be understood that various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. In this document, each of phrases such as “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B, or C”, “at least one of A, B and C”, and “at least one of A, B, or C” may include any one of or all possible combinations of items listed together in the corresponding one of the phrases. Terms such as “first” or “second” may be simply used for distinguishing a corresponding component from other corresponding components, and do not limit the corresponding components in other aspects (e.g., importance or order). In the case that one (e.g., first) component is referred to as “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively, it means that the one component may be connected to the other component directly (e.g., by wire), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logic block, part, or circuit. The module may be an integrally formed part or a minimum unit or a portion of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

140 136 138 101 120 101 Various embodiments of this document may be implemented into software (e.g., the program) including one or more instructions stored in a storage medium (e.g., the internal memoryor the external memory) readable by a machine (e.g., the electronic device). For example, the processor (e.g., the processor) of the device (e.g., the electronic device) may call and execute at least one command among one or more stored instructions from a storage medium. This makes it possible for the device to be operated to perform at least one function according to the called at least one instruction. The one or more instructions may include a code generated by a compiler or a code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, ‘non-transitory’ only means that the storage medium is a tangible device and does not include a signal (e.g., electromagnetic wave), and this term does not distinguish the case that data is semi-permanently stored in the storage medium and the case that data is temporary stored.

According to an embodiment, a method according to various embodiments disclosed in this document may be provided as included in a computer program product. Computer program products may be traded between sellers and buyers as commodities. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or via an application store (e.g., Play Store™) or may be distributed (e.g., download or upload) online or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a part of the computer program product may be at least temporarily stored or temporarily generated in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.

According to various embodiments, each component (e.g., module or program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., module or program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order, or omitted, or one or more other operations may be added.

It will be understood that the disclosure contemplates and includes, in addition to the above-disclosed embodiments, embodiments based on combinations of any two or more of the above-disclosed embodiments and embodiments including any combination of the above features. That is, the absence of explicit indication that two features may be combined or two embodiments may be combined does not mean that such combinations are not contemplated, but such combinations should be regarded as included herein.