Legal claims defining the scope of protection, as filed with the USPTO.
1. A support including an integrated circuit package electrically connected to a surface through an electrical connection, said support comprising: a first portion arranged to engage said package at a point spaced above said electrical connection to said surface; and a second portion connected directly to said first portion and said surface, said second portion adapted to prevent movement of said package relative to said surface.
2. The support of claim 1, wherein said first portion engages said package on its upper end.
3. The support of claim 1, wherein said first portion includes pair of surfaces to engage said package on two opposed surfaces of said package.
4. The support of claim 3, wherein said first and second portions are made at least in part of conformal material.
5. The support of claim 3, wherein said first portion is adapted to be resiliently biased against the sides of said package.
6. The support of claim 3, wherein said first portion is adapted to contact the side edges of said package.
7. The support of claim 1, wherein said second portion is directly connected to said surface.
8. The support of claim 3, wherein said first and second portions are made at least in part of plastic foam.
9. The support of claim 8, wherein said portions are made of resilient plastic foam with at least one slot formed therein.
10. The support of claim 9, wherein said foam includes adhesive on its bottom to secure said foam to said surface.
11. A method for preventing relative movement between a surface and an integrated circuit package connected to said surface, comprising: engaging said package at a point spaced away from the location where said package is connected to said surface; and bracing said package to said surface to prevent movement of said package relative to the surface at the point of engagement of said package.
12. The method of claim 11, including the step of engaging a plurality of packages, said packages having opposed side surfaces and an upper edge, side edges, and a bottom edge, said bottom edge connected to said surface, said method including the step of engaging the side surfaces of said packages.
13. The method of claim 12, including the step of resiliently engaging said packages.
14. The method of claim 11, including the step of engaging the top edges of said packages.
15. The method of claim 11, including the step of simultaneously engaging a plurality of adjacently positioned packages and bracing said packages against said surface and against each other.
16. The method of claim 11, including the step of telescopically sliding a foam portion over said package into engagement with said surface.
17. A method for stabilizing integrated circuit packages secured to a surface, comprising: sliding an engaging framework over said packages; resiliently engaging said packages; and securing said framework to a structure other than said packages.
18. The method of claim 17, including the step of also securing said framework to said packages.
19. The method of claim 17, including the step of clamping said packages to said surface.
20. A method for stabilizing integrated circuit packages secured to a surface, comprising: arranging a support about a package; and causing said support to expand into engagement with said package.
21. The method of claim 20, including heat expanding said support.
22. The method of claim 20, including securing said support to said surface.
Complete technical specification and implementation details from the patent document.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
Unknown
February 29, 2000
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