Patentable/Patents/US-6051119
US-6051119

Plating structure for a pin grid array package

PublishedApril 18, 2000
Assigneenot available in USPTO data we have
Inventorsnot available in USPTO data we have
Technical Abstract

Patent Claims
18 claims

Legal claims defining the scope of protection, as filed with the USPTO.

1

1. A plating structure comprising: a substrate having a plurality of pins to be plated; and a metallic plating screen having a plurality of apertures, wherein each of the apertures has at least two tabs spaced apart from each other, wherein the metallic plating screen is placed over the pins so that at least two pins penetrate each aperture, each of said pins contacting a tab of said aperture.

2

2. The plating structure of claim 1 wherein each of the apertures is triangular-shaped and has at least one tab proximately located at each vertex of each of the apertures.

3

3. The plating structure of claim 2 wherein the metallic plating screen has a plurality of tabs located proximate to at least one vertex of the apertures.

4

4. The plating structure of claim 2 wherein the metallic plating screen has a plurality of tabs located proximate to each vertex of the apertures.

5

5. The plating structure of claim 1 wherein each of the apertures consists of two aperture portions separated by a smaller aperture portion, each of the two aperture portions having at least one tab.

6

6. The plating structure of claim 5 wherein each of the two aperture portions has a plurality of tabs.

7

7. The plating structure of claim 5 wherein the two aperture portions and smaller aperture portion form an elongated aperture and each elongated aperture is oriented in the same direction to form rows of elongated apertures.

8

8. The plating structure of claim 7 wherein each tab in each elongated aperture is perpendicular to the direction of orientation of the elongated apertures.

9

9. The plating structure of claim 1 wherein the metallic plating screen is thin and flexible.

10

10. A method of electolytically plating a plurality of pins utilizing a metallic plating screen having a plurality of apertures, wherein each of the apertures has at least two tabs spaced apart from each other, comprising the steps of: placing the metallic plating screen over the pins so that the plurality of pins penetrates the plurality of apertures with at least two pins penetrating each aperture, each of the pins contacting at least one tab, the metallic plating screen electrically contacting each of the plurality of pins; placing the metallic plating screen and the pins in a plating solution; and applying an electrical current to the metallic plating screen and to the plurality of pins, thereby causing the plurality of pins to become plated by said plating solution.

11

11. The method of claim 10 wherein each of the apertures is triangular-shaped and has at least one tab proximately located at each vertex of each of the apertures.

12

12. The method of claim 11 wherein the metallic plating screen has a plurality of tabs located proximate to at least one vertex of the apertures.

13

13. The method of claim 11 wherein the metallic plating screen has a plurality of tabs located proximate to each vertex of the apertures.

14

14. The method of claim 10 wherein each of the apertures consists of two aperture portions separated by a smaller aperture portion, each of the two aperture portions having at least one tab.

15

15. The method of claim 14 wherein each of the two aperture portions has a plurality of tabs.

16

16. The method of claim 14 wherein the two aperture portions and smaller aperture portion form an elongated aperture and each elongated aperture is oriented in the same direction to form rows of elongated apertures.

17

17. The method of claim 16 wherein each tab in each elongated aperture is perpendicular to the direction of orientation of the elongated apertures.

18

18. The method of claim 10 wherein the metallic plating screen is thin and flexible.

Detailed Description

Complete technical specification and implementation details from the patent document.

DETAILED DESCRIPTION OF THE INVENTION

Classification Codes (CPC)

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Patent Metadata

Filing Date

Unknown

Publication Date

April 18, 2000

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Cite as: Patentable. “Plating structure for a pin grid array package” (US-6051119). https://patentable.app/patents/US-6051119

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