Fan duct module

1. A cooling assembly comprising: (a) a fan for use to direct cool air onto heat dissipating electronic components; (b) an air guiding duct-housing combination for use to house the fan and to guide cool air to the fan, the air guiding duct-housing combination having a geometric shape and being constituted with material(s) and/or structural supports that allow the cooling assembly to be mounted in a cantilever manner against a chassis wall of a chassis, overhanging the heat dissipating electronic components; and (c) an air hood coupled to the air guiding duct-housing combination to facilitate in-take of the cool air from a direction angular to the linear air guiding duct-housing combination, and the cooling assembly is mounted in said cantilever manner against the chassis wall of the chassis with a vented area of the chassis wall disposed in between the air guiding duct-housing combination and the air hood.

2. The cooling assembly of claim 1, wherein the air guiding duct-housing combination comprises a linear air guiding duct having a linear upper half and a linear lower half, with at least the linear lower half being constituted with materials of sufficient strength to enable said cantilever manner of mounting of the cooling assembly.

3. The cooling assembly of claim 1, wherein the air guiding duct-housing combination comprises a linear air guiding duct having a linear upper half, a linear lower half, and a plurality of support brackets with at least the plurality of support brackets being made of materials of sufficient strength to enable said cantilever manner of mounting of the cooling assembly.

4. The cooling assembly of claim 1, wherein the air guiding duct-housing combination comprises (b.1) a linear air guiding duct having an air in-flow opening disposed at a side end and an air out-flow opening disposed at a bottom surface near an opposite side end; and (b.2) a fan holder for holding the fan and coupling the fan to the air out-flow opening of the linear air guiding duct.

5. The cooling assembly of claim 1, wherein the cooling assembly further comprises (d) a vent plate that also serves as an EMI shield, and disposed between the linear air guiding duct-housing combination and the air hood.

6. A computer system comprising: (a) a processor; (b) a plurality of memory modules; (c) a chassis housing the processor and the plurality of memory modules, the chassis having a chassis wall; and (d) a cooling assembly mounted against the chassis wall in a cantilever manner overhanging over the processor and the memory modules to direct cool air onto the processor and the memory modules to cool the processor and the memory modules, the cooling assembly having (d.1) a fan for use to direct said cool air onto the processor and the memory modules, (d.2) a linear air guiding duct-housing combination for use to house the fan and to guide the cool air to the fan, the linear air guiding duct-housing combination being constituted with material(s) and/or structural supports that allow the assembly to be mounted in said cantilever manner, (d.3) an air hood coupled to the linear air guiding duct-housing combination to facilitate in-take of the cool air from a direction angular to the linear air guiding duct-housing combination; wherein the cooling assembly is mounted in said cantilever manner against the chassis wall of the chassis with a vented area of the chassis wall disposed in between the linear air guiding duct-housing combination and the air hood.

7. The computer system of claim 6, wherein the linear air guiding duct-housing combination comprises a linear air guiding duct having a linear upper half and a linear lower half, with at least the linear lower half being constituted with materials of sufficient strength to enable said cantilever manner of mounting of the cooling assembly.

8. The computer system of claim 6, wherein the linear air guiding duct-housing combination comprises a linear air guiding duct having a linear upper half, a linear lower half, and a plurality of support brackets with at least the plurality of support brackets being made of materials of sufficient strength to enable said cantilever manner of mounting of the cooling assembly.

9. The computer system of claim 6, wherein the linear air guiding duct-housing combination comprises (d.2.1) a linear air guiding duct having an air in-flow opening disposed at a side end and an air out-flow opening disposed at a bottom surface near an opposite side end; and (d.2.2) a fan holder for holding the fan and coupling the fan to the air out-flow opening of the linear air guiding duct.

10. The computer system of claim 6, wherein the cooling assembly further comprises (d.4) a vent plate that also serves as an EMI shield, and disposed between the linear air guiding duct-housing combination and the air hood.

11. The computer system of claim 6, wherein the computer system further comprises one or more chipsets, which are also disposed underneath the overhanging cooling assembly, and the cooling assembly also serves to direct cool air onto the chipsets to cool the chipsets.

12. An apparatus comprising: (a) a plurality of heat dissipating electronic components; (b) a chassis having a plurality of chassis walls to house the electronic components; (c) a cooling assembly mounted against one of the chassis walls in a cantilever manner overhanging over the electronic components to direct cool air onto the electronic components to cool the electronic components, the cooling assembly having (c.1) a fan for use to direct said cool air onto the electronic components, (c.2) a linear air guiding duct-housing combination for use to house the fan and to guide the cool air to the fan, the linear air guiding duct-housing combination being constituted with material(s) and/or structural supports that allow the assembly to be mounted in said cantilever manner, (c.3) an air hood coupled to the linear air guiding duct-housing combination to facilitate in-take of the cool air from a direction angular to the linear air guiding duct-housing combination wherein the cooling assembly is mounted in said cantilever manner against the chassis wall of the chassis with a vented area of the chassis wall disposed in between the linear air guiding duct-housing combination and the air hood.