Method and device of inspecting three-dimensional shape defect

1. A method of inspecting a three-dimensional shaped defect comprising the steps of: detecting a first picture signal including providing a two-dimensional picture signal by taking a picture of an inspection object utilizing detection of fluorescence emanating from the inspection object; selecting a three-dimensional shape inspection region of the inspection object based on the two-dimensional picture signal provided by the first picture signal detecting step; detecting a second picture signal including detecting a picture signal by taking an optical picture in accordance with a height of the inspection object utilizing reflected light from the inspection object; and determining a three-dimensional shape including determining the presence or absence of a defect of a three-dimensional shape by calculating the three-dimensional shape by sampling height information with a desired two-dimensional pixel size in respect of the three-dimensional shape inspection region selected with respect to the picture signal detected by the second picture signal detecting step.

2. The three-dimensional shaped defect inspecting method according to claim 1, wherein in the three-dimensional shape inspection region selecting step, a three-dimensional shape inspection region having high accuracy and a three-dimensional shape inspection region having low accuracy are dividedly selected in respect of the inspection object based on the two-dimensional picture signal provided at the first picture signal detecting step; in the three-dimensional shape determining step, height information having a high accuracy is sampled with a desired two- dimensional pixel size in respect of the three-dimensional shape inspection region having high accuracy which has been selected with respect to the picture signal detected by the second picture signal detecting step; and height information having a low accuracy is sampled with the desired two- dimensional pixel size in respect of the three-dimensional shape inspection region having low accuracy which has been selected with respect to the detected picture signal.

3. The three-dimensional shaped defect inspecting method according to claim 1, wherein the desired two-dimensional pixel size in the three-dimensional shape determining step is set to one of a multiplication factor of an integer and one divided by an integer of the pixel size of the two-dimensional picture signal in the three-dimensional shape inspection region selecting step.

4. A method of inspecting a defect of a pattern comprising the steps of: detecting a two-dimensional picture signal including detecting a two-dimensional picture signal by taking a picture of an inspection object utilizing detection of fluorescence emanating from the inspection object; detecting a two-dimensional defect including detecting a two-dimensional defect on the inspection object based on the two-dimensional picture signal detected by the two-dimensional picture signal detecting step; selecting a three-dimensional shape detection region in respect of a pattern formed on the inspection object based on the two-dimensional picture signal detected by the two-dimensional picture signal detecting step; and determining a three-dimensional shape including determining the presence or absence of a defect by calculating a three-dimensional shape in respect of the pattern by detecting the picture signal by taking an optical image in accordance with a height by a reflected light from above the inspection object and sampling height information with a desired two-dimensional pixel size in respect of the selected three-dimensional shape detection region with respect to the detected picture signal.

5. The method of inspecting a defect of a pattern according to claim 3, wherein the desired two-dimensional pixel size in the three-dimensional shape determining step is set to one of a multiplication factor of an integer and one divided by an integer of the pixel size of the two- dimensional picture signal in the two-dimensional picture signal detecting step.

6. A three-dimensional shaped defect inspecting method comprising the steps of: taking a picture including providing a two-dimensional picture signal by taking a picture of an inspection object utilizing detection of fluorescence emanating from the inspection object; selecting a three-dimensional shape inspection region of the inspection object based on the two-dimensional picture signal provided by the picture taking step; calculating a three-dimensional shape in the three-dimensional shape inspection region in respect of the inspection object selected by the three-dimensional shape inspection region selecting step in accordance with height information of the inspection object obtained utilizing reflected light from the inspection object; and a defect detecting step of determining the presence or absence of a defect of the three-dimensional shape calculated by the three-dimensional shape calculating step.

7. A three-dimensional shaped defect inspecting device comprising: picture taking means for providing a two-dimensional picture signal by taking a picture of an inspection object utilizing detection of fluorescence emanating from the inspection object; picture detecting means for detecting a picture signal by taking a picture in correspondence with a height of the inspection object utilizing reflected light from the inspection object, said picture detecting means corresponding to the height; three-dimensional shape inspection region selecting means for selecting a three-dimensional shape inspection region in respect of the inspection object based on the two-dimensional picture signal provided by the picture taking means; three-dimensional shape calculating means for calculating a three-dimensional shape of the three-dimensional shape inspection region selected based on the picture signal detected by the picture detecting means in correspondence with the height; and defect detecting means for determining presence or absence of a defect of the three-dimensional shape calculated by three-dimensional shape calculating means.

8. A three-dimensional shaped defect detecting device comprising: first picture detecting means for providing a two-dimensional picture signal by taking a picture of an inspection object utilizing detection of fluorescence emanating from the inspection object; second picture detecting means for providing a picture signal of the inspection object in accordance with a height of the inspection object obtained from reflected light from the inspection object by taking a picture of the inspection object; three-dimensional shape inspection region selecting means for selecting a three-dimensional shape inspection region of the inspection object based on the two-dimensional picture signal provided by the first picture detecting means; and defect detecting means for calculating a three-dimensional shape of the three-dimensional shape inspection region selected based on the picture signal provided by the second picture detecting means and determining the presence or absence of a defect of the calculated three-dimensional shape.

9. The three-dimensional shaped defect inspecting device according to claim 8, wherein the defect detecting means calculates the three-dimensional shape of the three-dimensional shape inspection region by sampling height information with a desired two-dimensional pixel size in respect of the picture signal in accordance with the height.

10. An inspection method comprising the steps of: relatively scanning a light beam on a sample to be detected; detecting fluorescence emanated from the sample by the scanned light beam; calculating a two-dimensional image of the sample from the detected fluorescence; determining an inspection area to obtain a three-dimensional image from the calculated two-dimensional image of fluorescence; detecting light reflected from the inspection area by the scanning of the light beam to obtain height information of the sample; calculating a three-dimensional image of the inspection area from the information of the two-dimensional image and the height information; detecting a defect in the inspection area from the calculated three dimensional image; and outputting a result of the detection.

11. An inspection method according to claim 10, wherein said sample is a printed circuit board.

12. An inspection method according to claim 10, wherein the light reflected from the inspection area is light reflected from a pattern of the printed circuit board and the three-dimensional image is an image of the pattern.

13. An inspection method comprising the steps of: illuminating a sample to be inspected with a scanning light; detecting fluorescence emanated from the sample by illuminating and obtaining a two-dimensional image of the sample; detecting light reflected from an inspection area determined from the two-dimensional image; calculating a three-dimensional image of the inspection area from the information of the detected fluorescence and the reflected light; detecting a defect in the inspection area from the calculated three-dimensional image; and outputting a result of the detection.

14. An inspection method according to claim 13, wherein the light illuminating the sample is a light beam which relatively scans the sample.

15. An inspection method according to claim 13, wherein the sample is a printed circuit board, which has a circuit pattern formed on a substrate, and the fluorescence is emanated from the substrate and the light reflected from the inspection area is light reflected from the pattern.

16. An inspection method according to claim 13, wherein the three-dimensional image is calculated using an information of the two-dimensional image of the fluorescence and height information of the inspection area obtained in accordance with the reflected light.

17. An inspection method comprising the steps of: illuminating a light on a sample to be detected; detecting a fluorescence emanated from the sample by the illuminating light to obtain a two-dimensional image of the sample; determining a first inspection area to obtain a three-dimensional image with high resolution and determining a second inspection area to obtain a three-dimensional image with low resolution from the calculated two-dimensional image of fluorescence; detecting light reflected from a first inspection area by the illumination and obtaining a three-dimensional image with high resolution; detecting a light reflected from a second inspection area by the illumination and obtaining a three-dimensional image with low resolution; detecting a defect in the first and second inspection areas from the calculated three-dimensional image; and outputting a result of the detection.

18. An inspection apparatus comprising: illuminating means for illuminating a light on a sample to be detected; first detecting means for detecting fluorescence emanated from the sample by the illuminating means and for obtaining a two-dimensional image of the sample; second detecting means for detecting light reflected from an inspection area determined from the two-dimensional image; calculating means for calculating a three-dimensional image of the inspection area from the information of the first and the second detecting means; third detecting means for detecting a defect in the inspection area from the calculated three-dimensional image; and outputting means for outputting a result of the third detecting means.

19. An inspection apparatus according to claim 18, wherein the illuminating means illuminates the sample with light having a wavelength between 200-400 nm.

20. An inspection apparatus according to claim 18, wherein said first detecting means detects a fluorescence having a wavelength between 400-600 nm and the second detecting means detects light reflected from an inspection area having a wavelength between 200-400 nm.