Underfill coating for LOC package

1. A method of assembling a semiconductor die to a lead frame, said method comprising the steps of: providing a lead frame having a plurality of lead members, at least one lead member of said plurality of lead members having a plurality of longitudinal edges, having a top surface, having a bottom surface, having a lead end portion connected to a portion of the lead frame, having a length, having a thickness, and having a free end portion; providing a die having an active surface, having at least one bond pad thereon, and having at least one outer edge; superimposing a portion of one of the top surface and the bottom surface of the at least one lead member of the plurality of lead members of said lead frame on said die, the portion of the one of the top surface and bottom surface of the at least one lead member of the plurality of lead members extending over a portion of the active surface of said die forming a gap therebetween; and applying an underfill material around at least a portion of said at least one lead member of said plurality of lead members, the underfill material flowing by capillary action into the gap between the portion of one of the top surface and the bottom surface of said at least one lead member of said plurality of lead members and the portion of the active surface of said die.

2. The method of claim 1, further comprising the step of: curing said underfill material.

3. The method of claim 1, further comprising the step of: drying said underfill material.

4. The method of claim 1, further comprising the step of: adhering said at least one lead member of said plurality of lead members to said active surface of said die.

5. The method of claim 1, further comprising the step of: adhering each lead member of said plurality of lead members to said active surface of said die.

6. The method of claim 1, wherein the step of applying an underfill material includes: applying said underfill material substantially between each lead member of said plurality of lead members and said active surface of said die.

7. The method of claim 1, wherein the step of applying an underfill material includes: applying said underfill material at a location substantially adjacent to at least one edge of said plurality of longitudinal edges of said at least one lead member of said plurality of lead members.

8. The method of claim 1, wherein the step of applying an underfill material includes: applying said underfill material substantially over said top surface of said at least one lead member.

9. The method of claim 1, wherein the step of applying an underfill material includes: applying said underfill material substantially on a portion of said active surface of said die.

10. The method of claim 9, wherein a sufficient quantity of the underfill material is applied to substantially cover said active surface of said die.

11. The method of claim 1, wherein said underfill material is applied with an underfill dispenser.

12. The method of claim 11, wherein said underfill dispenser is a syringe.

13. The method of claim 1, wherein said underfill material is sprinkled on said die.

14. The method of claim 1, wherein said underfill material is dripped on said die.

15. The method of claim 1, wherein said underfill material is sprayed on said die.

16. The method of claim 1, wherein said underfill material is write dispensed on said die.

17. The method of claim 1, wherein the step of applying an underfill material includes: applying said underfill material substantially over a portion of said top surface of said at least one lead member and over a portion of said active surface of said die.

18. The method of claim 1, wherein the method further comprising the step of: bonding at least one wire to a portion of said at least one lead member and said at least one bond pad on said active surface of said die.

19. The method of claim 18, wherein the step of applying an underfill material includes: applying said underfill material substantially on a portion of said at least one lead member, a portion of said active surface of said die, and a portion of said at least one wire.

20. The method of claim 18, wherein a sufficient quantity of underfill material is applied to substantially cover a portion of said active surface of said die and a portion of said at least one wire.

21. A method of transfer molding a plastic package about a die assembly using a molding compound including filler particles, said method of transfer molding comprising the steps of: providing a lead frame having a plurality of lead members, at least one lead member of said plurality of lead members having longitudinal edges, having a top surface, having a bottom surface, having a lead end portion connected to a portion of the lead frame, having a length, having a thickness, and having a free end portion; providing a die having an active surface having at least one bond pad thereon and having at least one outer edge; superimposing said lead frame on said die with said active surface lying adjacent said lead frame and a portion of the free end portion of said at least one lead member of the plurality of lead members extending over the at least one outer edge of said die and over a portion of the active surface of said die forming a gap therebetween; applying an underfill material between the portion of the free end portion of said at least one lead member of said plurality of lead members and said active surface of said die; disposing the lead frame having the underfill material disposed between the portion of the free end portion of the at least one lead member of the plurality of lead members and the active surface of the die, said die being secured by its active surface to the portion of the free end portion of said at least one lead member of the plurality of lead members, in a lead over chip configuration in a mold cavity; introducing a softened molding compound including filler particles therein into said mold cavity to form a plastic package around a portion of the lead frame and said die; and preventing flow of the softened molding compound into the gap between the portion of the free end portion of the at least one lead member of the plurality of lead members and the active surface of said die, thereby preventing the filler particles in the softened molding compound from flowing between said active surface of said die and said at least one lead member of the plurality of lead members during said transfer molding.

22. The method of claim 21, wherein said filler particles are prevented from flowing between said active surface of said die and said at least one lead member of the plurality of lead members by underfill material.

23. The method of claim 22, wherein said underfill material is substantially located between said active surface of said die and said at least one lead member of the plurality of lead members.

24. The method of claim 23, wherein said underfill material is substantially located between said active surface of said die and said plurality of lead members.