Load actuating semiconductor circuit having a thermally resistive member

1. A load actuating circuit comprising: a semiconductor relay that controls a load current supplied to a load; said semiconductor relay having a current shutoff function working at a predetermined sensitive temperature (T.sub.SD) at which supply of said load current to said load is stopped, thereby acting as a heat-damage protecting device; and a thermally resistive member interposed between said semiconductor relay and a heat radiation member to adjust a thermal resistive value (R.sub.TEMP) of an entire heat radiation system of said semiconductor relay by setting a thermal resistive value of said thermally resistive member, thereby setting a shutoff current value of said semiconductor relay.

2. The load actuation circuit according to claim 1, wherein said sensitive temperature is set in a temperature range of 70.degree. C. to 140.degree. C.

3. The load actuation circuit according to claim 1, wherein said sensitive temperature is set to a value corresponding to a predetermined allowable load current value.

4. The load actuation circuit according to claim 1, wherein said semiconductor relay comprises an adjusting device that is used to adjust said sensitive temperature.

5. The load actuation circuit in accordance with claim 1, wherein said semiconductor relay is on a printed board; and said heat radiation member is a radiation plate attached to a reverse surface of said printed board to release heat from said semiconductor relay.

6. The load actuation circuit in accordance with claim 1, wherein said semiconductor relay is electrically connected to a printed board via a rigid lead; and said heat radiation member is a radiation plate spaced from said printed board and attached to said semiconductor relay via said heat radiative member.

7. A load actuating semiconductor circuit comprising: a semiconductor package, without a separate thermostat, connected to a load for controlling a load current supplied to said load, said semiconductor package including a temperature sensing circuit, a reference voltage generating circuit, and a shutoff circuit all integrated in said semiconductor package, wherein said temperature sensing circuit is connected to detect a junction temperature and to generate an output voltage representing a detected function temperature; said reference voltage generating circuit is connected to generate a reference voltage corresponding to a predetermined sensitive temperature, said shutoff circuit is connected to stop supply of said load current to said load based on a comparison between said output voltage and said reference voltage, wherein said reference voltage generating circuit comprises an adjusting device for adjusting said sensitive temperature.

8. The load actuating semiconductor circuit in accordance with claim 7, wherein said sensitive temperature is set in a temperature range of 70.degree. C. to 140.degree. C.

9. The load actuating semiconductor circuit in accordance with claim 7, wherein said sensitive temperature is set to a value corresponding to a predetermined allowable load current value.

10. A load actuation circuit comprising: a semiconductor relay connected between a power supply and a load for controlling supply of load current to said load; a heat radiation member releasing heat from said semiconductor relay; and a thermally resistive member serving as a heat radiation path between said semiconductor relay and said heat radiation member so that said thermally resistive member is included in an entire heat radiation system of said semiconductor relay; wherein a thermal resistive value of the entire heat radiation system of said semiconductor relay is substantially controlled by dimensions and material properties of said thermally resistive member, thereby setting a shutoff current value of said semiconductor relay.

11. The load actuation circuit in accordance with claim 10, wherein said semiconductor relay is on a printed board; and said heat radiation member is a radiation plate attached to a reverse surface of said printed board.

12. The load actuation circuit in accordance with claim 10, wherein said semiconductor relay is electrically connected to a printed board via a rigid lead; and said heat radiation member is a radiation plate spaced from said printed board and fastened to said semiconductor relay via said heat radiative member.

13. The load actuation circuit in accordance with claim 10, wherein said semiconductor relay stops the supply of said load current at a predetermined sensitive temperature.

14. The load actuation circuit in accordance with claim 13, wherein said sensitive temperature is in a range of 70.degree. C. to 140.degree. C.

15. The load actuation circuit in accordance with claim 13, wherein said sensitive temperature corresponds to a predetermined allowable load current value.

16. The load actuation circuit in accordance with claim 13, wherein said semiconductor relay comprises a device for adjusting said sensitive temperature.