Method for fabricating ferroelectric integrated circuits

1. A method for fabricating an integrated circuit comprising the steps of: forming an integrated circuit portion including a thin film of metal oxide material; and heating said integrated circuit portion in an atmosphere including hydrogen for a time period less than 30 minutes.

2. A method according to claim 1 and further comprising the step of conducting an oxygen recovery anneal after said step of heating in an atmosphere of hydrogen, said oxygen recovery anneal being performed at a temperature range from 625.degree. C. to 1000.degree. C. for a time period from 20 minutes to 2 hours.

3. A method according to claim 1 and further comprising the step of forming a hydrogen barrier layer directly over at least a portion of said thin film of ferroelectric metal oxide material before said step of heating.

4. A method according to claim 1 wherein said ferroelectric metal oxide material comprises an oxide compound containing at least two metals and wherein at least one of said metals is present in said material in an excess amount.

5. A method for fabricating an integrated circuit having a plurality of layers, comprising the steps of: forming an integrated circuit portion including a thin film of ferroelectric metal oxide material; and heating said integrated circuit portion in an atmosphere including hydrogen at a temperature less than 350.degree. C. for a time period not exceeding 30 minutes, wherein said heating does not result in depositing one of said layers.

6. A method according to claim 5 wherein said step of heating is provided for a time period less than 30 minutes.

7. A method according to claim 6 wherein said hydrogen comprises from 0.01 to 50 percent in volume of said atmosphere.

8. A method according to claim 6 and further comprising the step of forming a hydrogen barrier layer directly over at least a portion of said ferroelectric metal oxide material before said step of heating.

9. A method according to claim 8 wherein said hydrogen barrier layer comprises a nitride of titanium or silicon.

10. A method according to claim 5 wherein said ferroelectric metal oxide material comprises an oxide compound containing at least two metals and wherein at least one of said metals is present in said material in an excess amount.

11. A method according to claim 10 wherein said ferroelectric metal oxide material comprises a layered superlattice compound.

12. A method according to claim 11 wherein said metal present in an excess amount is either niobium or bismuth.

13. A method according to claim 12 wherein said layered superlattice compound comprises strontium bismuth tantalum niobate.

14. A method according to claim 13 wherein said metal present in an excess amount is niobium.

15. A method according to claim 5 wherein said step of forming comprises providing a substrate and a precursor liquid for said ferroelectric metal oxide material, applying said precursor to said substrate and treating it to form said ferroelectric metal oxide material, and further wherein said ferroelectric metal oxide material comprises an oxide compound containing at least two metals and wherein one of said metals is present in said precursor in an excess amount.

16. A method according to claim 15 wherein said metal present in an excess amount is a metal that does not form volatile compounds that dissipate during said fabrication process.

17. A method according to claim 5 wherein said step of forming comprises providing a substrate and a precursor liquid for said ferroelectric metal oxide material; applying said precursor to said substrate; and treating said precursor to form said ferroelectric metal oxide material, and further wherein said ferroelectric metal oxide material comprises strontium bismuth tantalum niobate and said precursor contains the chemical elements strontium, bismuth, tantalum and niobium having relative molar proportions corresponding approximately to the stoichiometric formula SrBi.sub.2.18 Ta.sub.2-x Nb.sub.x O.sub.9, where 0.ltoreq..times..ltoreq.2.

18. A method according to claim 17 wherein said precursor contains an additional amount of bismuth corresponding to between zero percent and 40 percent above the stoichiometric amount represented by the formula SrBi.sub.2.18 Ta.sub.2-x Nb.sub.x O.sub.9, where 0.ltoreq..times..ltoreq.2.

19. A method according to claim 17, wherein said precursor contains relative molar proportions of the elements strontium, bismuth, tantalum and niobium corresponding approximately to the formula SrBi.sub.2.18 Ta.sub.1.44 Nb.sub.0.56 O.sub.9.

20. A method according to claim 19 wherein said precursor contains an additional amount of niobium corresponding to between zero percent and 40 percent above the stoichiometric amount represented by the formula SrB.sub.2.18 Ta.sub.1.44 Nb.sub.0.50 O.sub.9.

21. A method according to claim 5 and further comprising the step of performing an oxygen recovery anneal after said step of heating in an atmosphere of hydrogen, said oxygen recovery anneal being performed at a temperature range from 625.degree. C. to 1000.degree. C. for a time period from 20 minutes to 2 hours.

22. A method of fabricating an integrated circuit that includes a thin film of ferroelectric metal oxide material, said method comprising the steps of: forming a portion of said integrated circuit including said thin film of ferroelectric metal oxide material, said metal oxide material comprising a layered superlattice compound having an excess amount of a B-site element; exposing said portion of said integrated circuit to hydrogen; performing an oxygen recovery anneal at a temperature in the range of from 625.degree. C. to 1000.degree. C. for a time period from 20 minutes to 2 hours; and completing said integrated circuit to include said thin film of ferroelectric metal oxide material in a component of said integrated circuit.

23. A method according to claim 22 and further comprising the step of forming a hydrogen barrier layer directly over at least a portion of said ferroelectric metal oxide material before said step of exposing.

24. A method according to claim 23 wherein said hydrogen barrier layer comprises a nitride of titanium or silicon.

25. A method according to claim 22 wherein said layered superlattice compound comprises strontium bismuth tantalum niobate.

26. A method according to claim 25 wherein said metal present in an excess amount is niobium.

27. A method according to claim 26 wherein said layered superlattice compound comprises an excess amount of bismuth.

28. A method according to claim 22 wherein said step of forming comprises providing a substrate and a precursor liquid for said ferroelectric metal oxide material, applying said precursor to said substrate, and treating it to form said thin film of said ferroelectric metal oxide material.

29. A method for fabricating an integrated circuit comprising the steps of: forming an integrated circuit portion including a thin film of metal oxide material; and heating said integrated circuit portion in an atmosphere including hydrogen at a temperature less than 350.degree. C., wherein said heating is provided for a time period less than 30 minutes and the fraction of hydrogen in the hydrogen atmosphere is from 0.01 percent to 50 percent.

30. A method according to claim 29 and further comprising the step of forming a hydrogen barrier layer directly over at least a portion of said metal oxide material before said step of heating.

31. A method according to claim 30 wherein said hydrogen barrier layer comprises a nitride of titanium or silicon.

32. A method for fabricating an integrated circuit comprising the steps of: forming an integrated circuit portion including a thin film of metal oxide material; and heating said integrated circuit portion in an atmosphere including hydrogen at a temperature less than 350.degree. C., wherein said step of forming comprises providing a substrate and a precursor liquid for said metal oxide material; applying said precursor to said substrate; and treating said precursor to form said metal oxide material, and further wherein said metal oxide material comprises strontium bismuth tantalum niobate and said precursor contains the chemical elements strontium, bismuth, tantalum and niobium having relative molar proportions corresponding approximately to the stoichiometric formula SrB.sub.2.18 Ta.sub.2-x Nb.sub.x O.sub.9, where 0<.times.<2.

33. A method according to claim 32 wherein said precursor contains an additional amount of bismuth corresponding to between zero percent and 40 percent above the stoichiometric amount represented by the formula SrBi.sub.2.18 Ta.sub.2-x Nb.sub.x O.sub.9, where 0.ltoreq..times..ltoreq.2.

34. A method according to claim 32 wherein said precursor contains relative molar proportions of the elements strontium, bismuth, tantalum and niobium corresponding approximately to the formula SrBi.sub.2.18 Ta.sub.1.44 Nb.sub.0.56 O.sub.9.

35. A method according to claim 34 wherein said precursor contains an additional amount of niobium corresponding to between zero percent and 40 percent above the stoichiometric amount represented by the formula SrBi.sub.2.18 Ta.sub.1.44 Nb.sub.0.56 O.sub.9.