Enhanced lamination process between heatspreader to pressure sensitive adhesive (PSA) interface as a step in the semiconductor assembly process

1. An enhanced method of applying a pressure sensitive adhesive (PSA) to a heatspreader comprising the steps of: (a) providing a pressure sensitive adhesive (PSA) having a top surface and a releasable liner covering a bottom surface; (b) providing a heatspreader having an upper surface and a lower surface; and (c) attaching the top surface of the PSA to the lower surface of the heatspreader with pressure in an air free environment, the pressure originating from outside of the air free environment.

2. The method of claim 1 wherein the air free environment is a vacuum chamber assembly.

3. The method of claim 1 further comprising the steps of: (d) removing the releasable liner on the bottom surface of the PSA; and (e) attaching the heatspreader with PSA to an IC die under pressure in an air free environment.

4. The method of claim 3 wherein the air free environment is a vacuum chamber assembly.

5. An enhanced method of applying a pressure sensitive adhesive (PSA) to a heatspreader comprising the steps of: (a) providing a pressure sensitive adhesive (PSA) having a top surface and a releasable liner covering a bottom surface; (b) providing a heatspreader having an upper surface and a lower surface; (c) providing a vacuum chamber assembly with a pedestal; (d) positioning the bottom surface of the PSA on the pedestal; (e) positioning the lower surface of the heatspreader on the top surface of the PSA; (f) closing the vacuum chamber assembly; (g) drawing a vacuum to remove air inside the vacuum chamber assembly creating an air free environment; (h) applying pressure joining the heatspreader and PSA, the pressure originating from outside of the vacuum chamber assembly; (i) releasing the vacuum in the vacuum chamber assembly; (j) opening the vacuum chamber assembly; and (k) removing the heatspreader with PSA attached from the vacuum chamber assembly.

6. The method of claim 5 further including the step of: (l) removing the releasable liner covering the bottom surface of the PSA; and (m) attaching the PSA to an integrated circuit die.

7. The method of claim 5 further including the step of: (l) removing the releasable liner covering the bottom surface of the PSA; and (m) attaching the PSA to an integrated circuit die under pressure in a vacuum chamber assembly.

8. The method of claim 6 wherein the pressure is applied by way of a lid assembly of the air free environment.

9. The method of claim 5 wherein the pressure is applied by way of a lid assembly of the vacuum chamber assembly.