Method of mounting a plurality of electronic parts on a circuit board

1. A method of mounting a plurality of electronic parts on a circuit board, comprising: forming a film-like thermosetting adhesive layer on an electrode surface of each of the electronic parts, wherein the electrode surface has electrodes formed thereon and the adhesive layer has an area substantially equal to an area of the electrode surface of each of the electronic parts; arranging the electronic parts on the circuit board relative to each other, each of the electronic parts being placed on the circuit board such that the electrodes of the electrode surface having the adhesive layer formed thereon face corresponding electrodes on the circuit board; and bonding the electrodes of the electrode surface of each of the electronic parts to the corresponding electrodes of the circuit board by applying heat and pressure so as to fix the electrodes to each other after arranging the electronic parts on the circuit board, whereby each of the electronic parts is electrically connected to the circuit board.

2. The method of claim 1, wherein the adhesive layer formed on each of the electronic parts has an areas within a range of +30% to -30% of the area of the electrode surface of a corresponding one of the electronic parts.

3. The method of claim 1, wherein said arranging of the electronic parts includes holding each of the electronic parts by a heating head, and said bonding of the electrodes includes applying heat and pressure from the heating head.

4. The method of claim 1, wherein said bonding of the electrodes includes inspecting an electrical connection between the electrodes of the electrode surface of the electronic parts and the electrodes of the circuit board while the cohesive strength of the adhesive layer is being increased to a level whereat the electrical connection of the electrodes can be maintained.

5. A method of mounting a plurality of electronic parts on a circuit board, comprising: forming a film-like thermosetting adhesive layer on an electrode surface of each of the electronic parts, wherein the electrode surface has electrodes formed thereon and the adhesive layer has an area substantially equal to an area of the electrode surface of each of the electronic parts; temporarily arranging the electronic parts on the circuit board, each of the electronic parts being placed on the circuit board such that the electrodes of the electrode surface having the adhesive layer formed thereon face corresponding electrodes on the circuit board whereby temporarily-fixed electrodes are obtained, and increasing a cohesive strength of the adhesive layer to a level whereat a connection of the electrodes can be maintained; and bonding the temporarily-fixed electrodes of the electrode surface of each of the electronic parts to the corresponding electrodes of the circuit board by applying heat and pressure so as to fix the electrodes to each other, whereby each of the electronic parts is electrically connected to the circuit board, said bonding including simultaneously heating a plurality of electronic parts in an autoclave with a static pressure applied thereto.

6. The method of claim 5, wherein the adhesive layer formed on each of the electronic parts has an area within a range of +30% to -30% of the area of the electrode surface of a corresponding one of the electronic parts.

7. The method of claim 5, further comprising inspecting an electrical connection between the electrodes of the electrode surface of the electronic parts and the electrodes of the circuit board after said temporary arranging of the electronic parts and before said bonding of the temporarily-fixed electrodes.