Legal claims defining the scope of protection, as filed with the USPTO.
1. A semiconductor device assembly comprising: a semiconductor device component of said semiconductor device assembly bearing an atomized adhesive on at least one surface thereof; and another semiconductor device component of said semiconductor device assembly adhered to said semiconductor device component by said atomized adhesive.
2. The semiconductor device assembly of claim 1, wherein said atomized adhesive comprises a layer of substantially uniform thickness.
3. The semiconductor device assembly of claim 1, wherein said atomized adhesive comprises a substantially confluent layer.
4. The semiconductor device assembly of claim 1, wherein said atomized adhesive comprises adhesive particles of about 50 .mu.m to about 100 .mu.m size.
5. The semiconductor device assembly of claim 1, wherein said atomized adhesive resides on a single surface of said semiconductor device component.
6. A semiconductor device assembly comprising: a semiconductor device component of said semiconductor device assembly; and an a tomized adhesive comprising adhesive particles of about 50 .mu.m to about 100 .mu.m size disposed on at least one surface of said semiconductor device component.
7. The semiconductor device assembly of claim 6, further comprising another semiconductor device component of said semiconductor device assembly adhered to said semiconductor device component by said atomized adhesive.
8. The semiconductor device assembly of claim 6, wherein said atomized adhesive comprises a layer of substantially uniform thickness.
9. The semiconductor device assembly of claim 6, wherein said atomized adhesive comprises a substantially confluent layer.
10. The semiconductor device assembly of claim 6, wherein said at least one surface comprises a single surface of said semiconductor device component.
11. A semiconductor device assembly comprising: a semiconductor device component of said semiconductor device assembly; and an atomized adhesive confluently disposed on at least one surface of said semiconductor device component.
12. The semiconductor device assembly of claim 11, wherein said atomized adhesive comprises adhesive particles of about 50 .mu.m to about 100 .mu.m size.
13. The semiconductor device assembly of claim 11, further comprising another semiconductor device component of said semiconductor device assembly adhered to said semiconductor device component by said atomized adhesive.
14. The semiconductor device assembly of claim 11, wherein said atomized adhesive comprises a layer of substantially uniform thickness.
15. A semiconductor device assembly comprising: a first semiconductor device component of said semiconductor device assembly bearing an atomized adhesive on one surface thereof; and a second semiconductor device component of said semiconductor assembly adhered to said first semiconductor device component by said atomized adhesive on one surface of said first semiconductor device component.
16. The semiconductor device assembly of claim 15, wherein said atomized adhesive comprises a layer of substantially uniform thickness.
17. The semiconductor device assembly of claim 15, wherein said atomized adhesive comprises a substantially confluent layer.
18. The semiconductor device assembly of claim 15, wherein said atomized adhesive comprises adhesive particles of about 50 .mu.m to about 100 .mu.m size.
19. A semiconductor device assembly comprising: a semiconductor device component of said semiconductor device assembly; and an atomized adhesive comprising adhesive particles of about 50 .mu.m to about 100 .mu.m size disposed on one surface of said semiconductor device component of said semiconductor device assembly.
20. The semiconductor device assembly of claim 19, further comprising another semiconductor device component adhered to said semiconductor device component by said atomized adhesive.
21. The semiconductor device assembly of claim 19, wherein said atomized adhesive comprises a layer of substantially uniform thickness.
22. The semiconductor device assembly of claim 19, wherein said atomized adhesive comprises a substantially confluent layer.
23. A semiconductor device assembly comprising: a plurality of semiconductor device components of said semiconductor device assembly; and an atomized adhesive confluently disposed on at least one surface of each semiconductor device component of said plurality of semiconductor device components.
24. The semiconductor device assembly of claim 23, wherein said atomized adhesive comprises adhesive particles of about 50 .mu.m to about 100 .mu.m size.
25. The semiconductor device assembly of claim 23, further comprising another plurality of semiconductor device components of said semiconductor device assembly adhered to said plurality of semiconductor device components by said atomized adhesive.
26. The semiconductor device assembly of claim 23, wherein said atomized adhesive comprises a layer of substantially uniform thickness.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
Unknown
December 12, 2000
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