Cooling unit for an integrated circuit package

1. A cooling unit for an integrated circuit, comprising: a peltier device that is thermally coupled to the integrated circuit; a first channel adjacent to said peltier device; a plurality of fins that are thermally coupled to said peltier device and which are separated by a second channel; and, a fan that can generate a flow of fluid through said first channel adjacent to said peltier device is thermally coupled to the integrated circuit.

2. The cooling unit of claim 1, further comprising a base plate that is thermally coupled to said peltier device.

3. The cooling unit of claim 1, further comprising a heat pipe that is thermally coupled to the integrated circuit.

4. The cooling unit of claim 2, further comprising a heat pipe that is thermally coupled to said base plate.

5. The cooling unit of claim 1, wherein said fan introduces the flow of fluid in a direction that is essentially perpendicular to a longitudinal axis of said fin.

6. The cooling unit of claim 1, wherein said channel is in fluid communication with a main duct and said fan is oriented at an angle within said main duct.

7. The cooling unit of claim 1, further comprising a control circuit that is connected to said peltier device and said fan.

8. The cooling unit of claim 7, further comprising a temperature sensor that is connected to said control circuit and which senses a temperature.

9. The cooling unit of claim 8, wherein said control circuit can switch said peltier device and said fan between an on state and an off state, said control circuit operates said peltier device and said fan in the off state when the temperature is below a first threshold, operates said fan in the on state when the temperature is no less than the first threshold, and operates said fan and said peltier device in the on state when the temperature is no less than a second threshold.

10. An integrated circuit package assembly, comprising: an integrated circuit; a peltier device that is thermally coupled to said integrated circuit package; a first channel adjacent to said peltier device; a plurality of fins that are thermally coupled to said peltier device and which are separated by a second channel; and, a fan that can generate a flow of fluid through said first channel adjacent to said peltier device that is thermally coupled to said integrated circuit package.

11. The assembly of claim 10, further comprising a base plate that is thermally coupled to said peltier device and said integrated circuit.

12. The assembly of claim 10, further comprising a heat pipe that can be thermally coupled to said integrated circuit.

13. The assembly of claim 11, further comprising a heat pipe that is thermally coupled to said base plate.

14. The assembly of claim 10, wherein said fan introduces the flow of fluid in a direction that is essentially perpendicular to a longitudinal axis of said fin.

15. The cooling unit of claim 10, wherein said channel is in fluid communication with a main duct and said fan is oriented at an angle within said main duct.

16. The assembly of claim 10, further comprising a control circuit that is connected to said peltier device and said fan.

17. The assembly of claim 16, further comprising a temperature sensor that is connected to said control circuit and senses a temperature.

18. The assembly of claim 17, wherein said control circuit can switch said peltier device and said fan between an on state and an off state, said control circuit operates said peltier device and said fan in the off state when the first temperature is below a first threshold, operates said fan in the on state when the temperature is no less than the first threshold and operates said fan and said peltier device in the on state when the temperature is not less than a second threshold.

19. A method for cooling an integrated circuit, comprising: sensing a temperature; placing a peltier device that is thermally coupled to said integrated circuit and a fan in an off state if the temperature is below a first threshold; generating a flow of fluid adjacent to the peltier device that is thermally coupled to said integrated circuit if the temperature is not less than the first threshold; generating said flow of fluid and operating the peltier device in an on state if the temperature is not less than a second threshold.