Arrangement for reducing bending stress in an electronics package

1. A package for electronic components comprising a ceramic substrate and a body of molded plastic on a surface of said substrate, wherein said body has at least one electronic component imbedded therein, wherein said body has a pair of substantially planar opposed major surfaces, wherein said body is bonded along one of said body major surfaces to said surface of said substrate during the molding of said body at the molding temperature of said plastic, and wherein said molded plastic body has a coefficient of thermal expansion greater than the coefficient of thermal expansion of said ceramic substrate so that said substrate is subject to bending stress caused by thermal expansion mismatch with said molded plastic body, wherein the improvement comprises: a surrogate layer bonded to said molded plastic body along the other major surface of said body, wherein said surrogate layer is formed of a ceramic material having a coefficient of thermal expansion less than the coefficient of thermal expansion of said ceramic substrate.

2. The improvement according to claim 1 wherein said ceramic surrogate layer has a negative coefficient of thermal expansion.

3. A method for reducing the bending stress applied to a ceramic substrate when cooled to a steady state temperature below the molding temperature of a molded plastic body bonded to a surface of the ceramic substrate during the molding of the body, comprising the steps of: a) selecting a ceramic surrogate material having a coefficient of thermal expansion which is less than the coefficient of thermal expansion of the ceramic substrate; and b) applying a layer of the ceramic surrogate material to the molded plastic body opposite the ceramic substrate during the molding of the body at the molding temperature.

4. The method according to claim 3 further comprising the step of: c) calculating the thickness of the applied ceramic surrogate material layer so that at the steady state temperature the induced moment applied to the molded plastic body by the ceramic surrogate material layer is equal and opposite to the induced moment applied to the molded plastic body by the ceramic substrate.