Patentable/Patents/US-6191946
US-6191946

Heat spreader with excess solder basin

PublishedFebruary 20, 2001
Assigneenot available in USPTO data we have
Inventorsnot available in USPTO data we have
Technical Abstract

Patent Claims
4 claims

Legal claims defining the scope of protection, as filed with the USPTO.

1

1. A heat spreader for removing heat from a device to be cooled comprising: a body with a thermal contact surface on one surface for attachment to a device to be cooled and at least one side adjacent to the thermal contact surface with the side including at least one hole with the hole dimensioned to accept a heat pipe to be soldered into the hole; and a basin formed in a side which has at least one hole for a heat pipe, with the basin defined by continuous walls which surround the holes and the basin having a depth sufficient so that any solder flowing from the holes is retained in the basin.

2

2. The heat spreader of claim 1 wherein the body is formed as a plate with a top surface and a bottom surface joined by sides.

3

3. The heat spreader of claim 1 wherein the thermal contact surface is recessed within a surface on which it is located.

4

4. The heat spreader of claim 1 wherein the holes for heat pipes extend from one side of the heat spreader substantially to the opposite side of the heat spreader.

Classification Codes (CPC)

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Patent Metadata

Filing Date

Unknown

Publication Date

February 20, 2001

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Cite as: Patentable. “Heat spreader with excess solder basin” (US-6191946). https://patentable.app/patents/US-6191946

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