A dry particulate solids composition is provided which may be reconstituted into a chemical-mechanical polishing slurry.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method for chemical-mechanical polishing comprising: a) providing a polishing pad; b) introducing a polishing fluid comprising submicron abrasive particles between said pad and a workpiece; c) producing relative motion between said pad and said workpiece; wherein said polishing fluid has been reconstituted from a dry particulate solids composition comprised of a chemical-mechanical polishing slurry comprising submicron abrasive particles which has had substantially all water removed therefrom.
2. A method for chemical-mechanical polishing according to claim 1 wherein said submicron abrasive particles are from the group comprised of alumina, silica, ceria, titania, and mixtures thereof.
3. A method for chemical-mechanical polishing according to claim 2 wherein said submicron abrasive particles are titania.
4. A method for chemical-mechanical polishing according to claim 1 wherein said composition further comprises an oxidizing agent.
5. A method for chemical-mechanical polishing according to claim 1 wherein said composition further comprises a chemical etchant.
6. A method for chemical-mechanical polishing according to claim 1 wherein said composition further comprises a dispersing agent.
7. A method for chemical-mechanical polishing according to claim 1 wherein said composition further comprises a complexing agent.
8. A method for chemical-mechanical polishing according to claim 1 wherein said composition further comprises a corrosion inhibitor.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
October 6, 1999
June 5, 2001
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