The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied to objects to be protected such as integrated circuits, or to packages therefor, as well as for protecting animals including humans from unwanted exposure to radiation in outer space or other environments.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method for making a shielding composition comprising: mixing an ionizing radiation shielding powder, a binder, and an extender to create a coating composition; heating the coating composition at a temperature; increasing the temperature to eliminate the extender and create a paste; wherein said ionizing radiation shielding powder is at a concentration sufficient to shield a target from ionizing radiation; determining a thickness of said paste sufficient to shield an integrated circuit device from receiving an amount of radiation greater than a total dose tolerance of the integrated circuit device; and applying said paste to the integrated circuit device.
2. A method according to claim 1, wherein said mixing comprises mixing a high Z ionizing radiation shielding powder to create said coating composition.
3. A method according to claim 1, wherein said mixing comprises mixing a low Z ionizing radiation shielding powder to create said coating composition.
4. A method according to claim 2, wherein said mixing comprises mixing said high Z ionizing radiation shielding powder selected from the group consisting of tungsten, osmium, iridium, platinum, tantalum and gold to create said coating composition.
5. A method according to claim 3, wherein said mixing comprises mixing said low Z ionizing radiation shielding powder selected from the group consisting of copper, nickel, carbon, titanium, chromium, cobalt, boron, silicon, iron and nitrogen to create said coating composition.
6. A method according to claim 2, wherein said mixing comprises mixing said high Z ionizing radiation shielding powder having an atomic number of 50 and above to create said coating composition.
7. A method according to claim 6, wherein said mixing comprises mixing said high Z ionizing radiation shielding powder having an atomic number between 60 and 100 to create said coating composition.
8. A method according to claim 7, wherein said mixing comprises mixing said high Z ionizing radiation shielding powder having an atomic number between 73 and 79 to create said coating composition.
9. A method according to claim 3, wherein said mixing comprises mixing said low Z ionizing radiation shielding powder having an atomic number of 30 and below to create said coating composition.
10. A method according to claim 1, wherein said mixing comprises mixing said ionizing radiation shielding powder of 10 parts by weight, said binder of between 0.10 parts by weight and 0.50 parts by weight, and said extender of up to 0.50 parts by weight to create said coating composition.
11. A method according to claim 1, wherein said mixing comprises mixing said ionizing radiation shielding powder, an epoxy, and said extender to create said coating composition.
12. A method according to claim 1, wherein said mixing comprises mixing said ionizing radiation shielding powder, said binder, and ketone to create said coating composition.
13. A method according to claim 1, wherein said heating comprises heating said coating composition at a temperature of about 60 degrees Celsius for about 16 hours; and said increasing comprises increasing said temperature to about 150 degrees Celsius for about 0.5 hours to eliminate said extender and create said paste.
14. A method according to claim 1, wherein said mixing comprises mixing said ionizing radiation shielding powder, said binder, and an elastomer to create said coating composition.
15. A method according to claim 14, wherein said mixing comprises mixing said ionizing radiation shielding powder, said binder, and latex to create said coating composition.
16. A method according to claim 14, further including impregnating said coating composition with a fabric.
17. A method according to claim 16, further including impregnating said coating composition with a fabric selected from the group consisting of cotton, polyester, Kevlar and Teflon.
18. A method according to claim 1, further including applying said paste to said integrated circuit device using a low pressure injection mold.
19. A method according to claim 1, further including applying said paste to said integrated circuit device inside a mold which encases said integrated circuit device.
20. A method according to claim 1, further including applying said paste on said integrated circuit device by spraying layers of said paste onto said integrated circuit device.
21. A method according to claim 1, further including globbing said paste onto said integrated circuit device.
22. A method according to claim 1, further including painting said paste onto said integrated circuit device.
23. A method for making a shielding composition comprising: mixing a high Z ionizing radiation shielding powder, a binder, and an extender to create a coating composition; heating the coating composition at a temperature; increasing the temperature to eliminate the extender and create a paste; wherein said ionizing radiation shielding powder is at a concentration sufficient to shield a target from ionizing radiation; determining a thickness of said paste sufficient to shield an integrated circuit device from receiving an amount of radiation greater than a total dose tolerance of the integrated circuit device; and applying said paste to the integrated circuit device.
24. A method for making a shielding composition comprising: mixing an ionizing radiation shielding powder, a binder, and an extender to create a coating composition; heating the coating composition at a temperature; increasing the temperature to eliminate the extender and create a paste; determining a thickness of said paste sufficient to shield an integrated circuit device from receiving an amount of radiation greater than a total dose tolerance of the integrated circuit device; and applying said paste to the integrated circuit device; wherein said ionizing radiation shielding powder is at a concentration sufficient to shield a target from ionizing radiation; wherein said heating comprises heating said coating composition at a temperature of about 60 degrees Celsius for about 16 hours; wherein said increasing comprises increasing said temperature to about 150 degrees Celsius for about 0.5 hours to eliminate said extender and create said paste.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
August 17, 1999
July 17, 2001
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