Disclosed are compositions and methods useful for the removing polymer stripping compositions from substrates without formations of undesirable precipitate in the rinse solution. The compositions of the present invention are particularly suitable for removing residues of stripping compositions used to remove polymer residues from plasma etch processes.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method for manufacturing an electronic device comprising: a) containing polymeric material disposed on a substrate with a fluoride-based stripping composition for a period of time sufficient to at least partially remove the polymeric material; and b) then contacting the substrate with a rinsing composition including water and two or more solvents, wherein at least one solvent is selected from (C 2 -C 20 )alkanediols, (C 2 -C 20 )alkanetriols, (C 1 -C 6 )alkyl ethers of (C 2 -C 20 )alkanediols, di(C 1 -C 6 )alkyl ethers of (C 2 -C 20 )alkanediols, (C 1 -C 6 )alkyl ethers of (C 2 -C 20 )alkanetriols or di(C 1 -C 6 )alkyl ethers of (C 2 -C 20 )alkanetriols.
2. The method of claim 1 wherein the rinsing composition comprises at least one solvent selected from ethylene glycol monomethyl ether, diethylene glycol monomethyl ether, propylene glycol monomethyl ether, propylene glycol dimethyl ether, propylene glycol mono-n-butyl ether, dipropylene glycol monomethyl ether, dipropylene glycol dimethyl ether, dipropylene glycol mono-n-butyl ether or tripropylene glycol monomethyl ether.
3. The method of claim 1 wherein the rinsing composition comprises at least two solvents selected from ethylene glycol monomethyl ether, diethylene glycol monomethyl ether, propylene glycol monomethyl ether, propylene glycol dimethyl ether, propylene glycol mono-n-butyl ether, dipropylene glycol monomethyl ether, dipropylene glycol dimethyl ether, dipropylene glycol mono-n-butyl ether or tripropylene glycol monomethyl ether.
4. The method of claim 1 wherein the rinsing composition is substantially free of precipitate formation.
5. The method of claim 1 wherein at least one solvent is selected from include C 1 -C 6 )alkyl ethers of (C 2 -C 20 )alkanediols, di(C 1 -C 6 )alkyl ethers of (C 2 -C 20 )alkanediols, (C 1 -C 6 )alkyl ethers of (C 2 -C 20 )alkanetriols or di(C 1 -C 6 )alkyl ethers of (C 2 -C 20 )alkanetriols.
6. The method of claim 1 wherein the water is present in an amount of from about 25 to about 99% wt, based on the total weight of the composition.
7. The method of claim 1 wherein the water is >25% wt, based on the total weight of the composition.
8. The method of claim 1 wherein the rinsing composition further comprises one or more additives selected from corrosion inhibitors, wetting agents, chelating agents or co-solvents.
9. A method of removing polymeric material from a substrate comprising the steps of: a) contacting polymeric material disposed on a substrate with a fluoride-based stripping composition for a period of time sufficient to at least partially remove the polymeric material; and b) then contacting the substrate with a rinsing composition including water and two or more solvents, wherein at least one solvent is selected from (C 2 -C 20 )alkanediols, (C 2 -C 20 )alkanetriols, (C 1 -C 6 )alkyl ethers of (C 2 -C 20 )alkanediols, di(C 1 -C 6 )alkyl ethers of (C 2 -C 20 )alkanediols, (C 1 -C 6 )alkyl ethers of (C 2 -C 20 )alkanetriols or di(C 1 -C 6 )alkyl ethers of (C 2 -C 20 )alkanetriols.
10. The method of claim 9 wherein the rinsing composition further comprises one or more additives selected from corrosion inhibitors, wetting agents, chelating agents or co-solvents.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
August 7, 2000
February 26, 2002
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