Acoustic microscopy die crack inspection for plastic encapsulated integrated circuits

1. A method of non-destructive crack inspection of a plastic encapsulated integrated circuit (PEIC), the method comprising the steps of: placing the PEIC in a sample chamber of a scanning acoustic microscope, setting width of a data gate of the microscope to scan only a surface of a die in the PEIC, and generating scan of the die surface to detect cracks on the surface of the die.

2. The method of claim 1 , further comprising the steps of: setting the data gate to cover only a die subsurface reflection area on a screen of the microscope, and generating scan of a die subsurface to detect cracks in the die undetectable during the scan of the die surface.

3. The method of claim 2 , wherein the scan of the die surface is performed with the same resolution as the scan of the die subsurface.

4. The method of claim 2 , wherein if the die subsurface has cracks, an image of the die subsurface having the cracks is produced after the step of generating the scan of the die subsurface, to provide visual die crack inspection.

5. The method of claim 1 , wherein the scan of the die surface is performed using resolution in the range from 700 to 900 data points.

6. The method of claim 1 , wherein a C-mode scanning acoustic microscope is used for die crack inspection.

7. The method of claim 1 , wherein if the die surface has cracks, an image of the die surface having the cracks is produced after the step of generating the scan of the die surface, to provide visual die crack inspection.