Thermoelectric module and a method of fabricating the same

1. A method of fabricating a thermoelectric module, said module composed of: a plurality of thermoelectric chips of P-type and N-type for subsequently separating the bars into a plurality of thermoelectric chips of P-type and N-type arranged in a matrix between a set of first contacts and a set of second contacts both arranged in said matrix to form a series connected electrical circuit which is adapted to flow an electric current therethrough in a selected direction for heating and cooling one side of the first and second contacts due to the Peltier effect at said chips, a first carrier carrying the set of said first contacts and including first bridges each integrally joining two adjacent first contacts to define first discrete couples for electrical connection of said chips in each of said chip arrays, said first carrier further including at least two inter-array bridges which are solely responsible for electrical connection between the adjacent chip arrays, a second conductive plate carrying the set of said second contacts and including second bridges each integrally joining the two adjacent second contacts to give second discrete couples for electrical connection of the two adjacent chips in each of said chip arrays on opposite side of said first contacts, said second conductive plate further including second beams which integrally connect said second discrete couples in order that all of said second discrete couples are retained to said second conductive plate, said chips being arranged to provide at least three chip arrays each having a limited number of said chips, said method comprising the steps of: placing a plurality of said thermoelectric bars of P-type and N-type along the rows of said matrix in such a manner that P-type bars alternate the N-type bars in a spaced relation along the column of said matrix; bonding said thermoelectric bars to the rows of said first contacts as well as to the rows of said second contacts to form a consolidated structure in which said thermoelectric bars are held between the first and second contacts; and cutting said thermoelectric bars as well as said second beams simultaneously to divide said thermoelectric bars into said chips and to isolate said second discrete couples from each other; wherein both said first contacts and said second contacts are bonded prior to said cutting step, and said second beams are aligned in parallel with the column of said matrix, said cutting being made through the entire length of said second conductive plate along lines in which said second beams are aligned.

2. The method as set forth in claim 1 , wherein said first carrier further comprises a first conductive plate which includes a first beams interconnecting said first couples within a horizontal plane in which said first contacts are arranged, each of said first bridges and said inter-array bridge being offset from said horizontal plane in a direction away from said thermoelectric bars, said method further includes cutting said first beams to isolate said first discrete couples from each other except at said inter-array bridge at the same time of cutting said thermoelectric bars and said second beams.

3. The method as set forth in claim 2 , wherein said first conductive plate is cut at said first beams along the same planes in which said second conductive plate is cut into said second discrete couples.

4. The method as set forth in claim 1 , wherein each of said chip arrays is defined by said chips, said first contacts, said second contacts, all arranged along each column of said matrix; said first bridges being first vertical bridges each integrally joining the two adjacent first contacts in each column of said matrix to give said first discrete couples; said inter-array bridge joining the two adjacent first contacts in the outermost row of said first matrix to form a horizontal couple for electrical interconnection between said adjacent chip arrays each arranged along the column of said matrix, said second bridges being second vertical bridges each integrally joining the two adjacent second contacts in each said column of said matrix to give said second discrete couples; said second beam horizontally interconnecting said second discrete couples within a thickness of said second contacts in such a manner that said second discrete couples arranged along one column of said matrix are uniformly staggered with respect to said second discrete couples arrange along the adjacent column of said matrix.

5. The method as set forth in claim 1 , wherein each of said chip arrays is defined by said chips arranged in a pair of the two adjacent rows of said matrix, said first contacts in a corresponding pair of the two adjacent rows of said matrix, and said second contacts in a corresponding pair of the two adjacent rows of said matrix; said first bridges being first oblique bridges each integrally joining a pair of two obliquely opposed first contacts, one in the one row and the other in the adjacent row of said first matrix to give said first discrete couples; said inter-array bridge joining a pair of two vertically opposed first contacts, one in the row of the chip array and the other in the row of the adjacent chip array for electrical interconnection between the adjacent chip arrays; said second bridges being second vertical bridges each integrally joining the two adjacent second contacts in each column of said matrix to give said second discrete couples; and said second beam comprising second horizontal beams and at least two second vertical beam, said second horizontal beam horizontally interconnecting said second discrete couples within a thickness of said second contacts so that said second discrete couples are aligned along the rows of said matrix, said second vertical beam vertically interconnecting one of said second horizontal beams of one said chip array to corresponding one of said second horizontal beams of the adjacent chip array within a thickness of said second contacts.

6. The method as set forth in claim 1 , wherein said method utilizes a single first sheet in which at least two said first carries are integrally interconnected through a first joint, and a single second sheet in which at least two said second conductive plates are integrally interconnected through a second joint; said first and second sheets bonding to said thermoelectric bars to create at least two said thermoelectric module interconnected by said first and second joints, said method further including a step of separating said at least two thermoelectric module from each other by cutting said first and second joints after cutting said second beams and said thermoelectric bars.

7. The method as set forth in claim 2 , wherein said first beam has a thickness less than that of said first contact and has its one surface flush with the surface of said first contacts receiving said thermoelectric bars, and said first bridge having a thickness equal to that of said first contact and connecting said first contacts within the same plane.

8. The method as set forth in claim 2 , further comprising bending said first conductive plate to form said first contacts.

9. The method as set forth in claim 1 , wherein a plurality of said first conductive plates are connected by first webs to form a first tape for retaining thereon a plurality of said thermoelectric modules which are subsequently separated.

10. The method as set forth in claim 2 , wherein a plurality of said first conductive plates are connected by first webs to form a first tape, and a plurality of said second conductive plates are connected by second webs to form a second tape, said thermoelectric bars being secured between the first and second conductive plates after which said first and second beams of each of said first and second conductive plates are cut out together with said thermoelectric bars to give a plurality of said thermoelectric modules connected by said first and second webs to each other followed by said first and second webs being cut for separating the individual thermoelectric modules from each other.

11. The method as set forth in claim 1 , wherein said first carrier is cut along the same planes in which said second conductive plate is cut into said second discrete couples.