A BGA semiconductor package including: a semiconductor chip on which a chip pad is formed; a flexible member formed on the semiconductor chip; a metal pattern formed on one surface of the flexible member; a connection member for electrically connecting the pad and the metal pattern; and an external terminal electrically connected to the metal pattern. A method for fabricating the BGA semiconductor package including the steps of: fabricating a flexible member; forming a metal pattern on one surface of the flexible member; forming a pad on one surface of the semiconductor chip; attaching the flexible member onto the semiconductor chip in a manner that the pad is exposed; electrically connecting the pad and the metal pattern; and attaching an external terminal onto a predetermined region of the metal pattern.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method for fabricating a BGA semiconductor package comprising the steps of: fabricating a flexible member by preparing a first substrate having grooves formed at one side, filling metal powder in the grooves, and attaching a second substrate onto one side of the first substrate so as to cover the grooves; forming a metal pattern on one surface of the flexible member; forming a pad on the upper surface of the semiconductor chip; attaching the flexible member onto the semiconductor chip in a manner that the pad is exposed; electrically connecting the pad and the metal pattern; and attaching an external terminal onto a predetermined region of the metal pattern.
2. The method according to claim 1 , wherein the step of filling the metal powder in the grooves is performed by using an instrument for vibrating the first substrate.
3. The method according to claim 1 , wherein the step of filling the metal powder in the grooves is performed by using an instrument for applying a magnetic field so as to fix the metal powder.
4. The method according to claim 1 , wherein the step of filling the metal powder in the grooves is performed by using a squeeze.
5. The method according to claim 1 , wherein the step of forming the metal pattern on the upper surface of the flexible member is performed in a manner that after the metal pattern is formed on the side, of the first substrate, where there is no grooves formed, the flexible member is attached on the semiconductor chip so as for the metal pattern to be positioned on the upper surface of the flexible member.
6. The method according to claim 1 , further includes a step of forming an insulation film on the upper surface of the semiconductor chip except for the pad between the step of forming the pad on the upper surface of the semiconductor chip and the step of attaching the flexible member on the semiconductor chip in a manner that the pad is exposed.
7. The method according to claim 1 , wherein the external terminal is a solder ball.
8. The method according to claim 7 , wherein the step of attaching the solder ball is performed in a manner that the solder ball is attached by using a flux and then a reflow process is performed thereon.
9. The method according to claim 7 , wherein the step of attaching the solder ball is performed by using a screen-printing method.
10. A method for fabricating a BGA semiconductor package comprising the steps of: preparing a first substrate having grooves formed at one side; filling metal powder in the grooves; attaching a second substrate onto a first side of the first substrate so as to cover the grooves; forming a metal pattern on a second side of the first substrate; forming a pad on the upper surface of the semiconductor chip; attaching the first and second substrates onto the semiconductor chip in a manner that the pad is exposed; electrically connecting the pad and the metal pattern; and attaching an external terminal onto a predetermined region of the metal pattern.
11. The method according to claim 10 , wherein the step of filling the metal powder in the grooves is performed by using an instrument for applying a magnetic field so as to fix the metal powder.
12. The method according to claim 10 , wherein the step of filling the metal powder in the grooves is performed by using a squeeze.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
July 10, 2000
May 28, 2002
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