Patentable/Patents/US-6420660
US-6420660

Film used as a substrate for integrated circuits

PublishedJuly 16, 2002
Assigneenot available in USPTO data we have
Inventorsnot available in USPTO data we have
Technical Abstract

The chips for chip cards are customarily provided on a film strip which consists of a synthetic foil and a conductor track pattern and are connected to the conductor track pattern by way of bonding wires. Automatic mounting is made possible by the use of a film strip with periodically arranged conductor track patterns. For chips which can be driven via contacts as well as in a contactless manner, using a coil, conductor tracks are effectively provided on both sides of the synthetic foil forming the film strip. However, the film strip then becomes very inflexible so that it cannot be suitably handled by conventional automatic apparatus. The invention proposes to provide the metal foils wherefrom the conductor tracks are cut out with additional interruptions which reduce the cross-section of the metal foils at short intervals in the direction perpendicular to the longitudinal direction of the film. The film strip thus becomes more flexible so that it can be handled by conventional automatic apparatus.

Patent Claims
4 claims

Legal claims defining the scope of protection, as filed with the USPTO.

1

1. A foil in the form of an elongate film strip with edge perforations and two or more conductor tracks, which serves as a carrier for a plurality of integrated circuits, each of the conductor tracks being cut out from one or more metal foils and glued onto a synthetic foil provided with holes or openings, comprising a metal foil ( 1 , 20 ) with different conductor track patterns glued to each side of the synthetic foil ( 40 ), wherein the metal foils on both sides comprise, in addition to the conductor tracks, interruptions ( 3 , 4 , 6 , 7 , 23 , 24 , 25 , 27 , 28 ) in order to achieve a significant reduction of the overall cross-section of both metal foils ( 1 , 20 ) at short intervals in the longitudinal direction of the elongate film strip.

2

2. A foil as claimed in claim 1 , wherein the synthetic foil ( 40 ) comprises edge perforations ( 42 ) at regular intervals, and wherein both metal foils ( 1 , 20 ) are provided, at corresponding locations of the edge perforations ( 42 ), with an opening ( 3 , 23 ) that extends over a plurality of successive edge perforations ( 42 ).

3

3. A foil as claimed in claim 1 , wherein the synthetic foil ( 40 ) is provided with edge perforations ( 2 , 22 , 42 ) at regular intervals, and wherein at least one metal foil ( 1 ) is provided, at corresponding locations of the edge perforations ( 2 , 22 , 42 ), with at least one opening ( 10 ) that extends each time between two successive edge perforations ( 2 , 22 , 42 ) but does not contact the edge perforations ( 2 , 22 , 42 ).

4

4. A foil as claimed in claim 3 , wherein both metal foils ( 1 , 20 ) are provided, in corresponding locations at the area of the edge perforations ( 2 , 22 , 42 ), with openings ( 10 ) that extend between each time two successive edge perforations ( 2 , 22 , 42 ) but do not contact the edge perforations ( 2 , 22 , 42 ).

Classification Codes (CPC)

Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.

Patent Metadata

Filing Date

December 8, 1999

Publication Date

July 16, 2002

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Cite as: Patentable. “Film used as a substrate for integrated circuits” (US-6420660). https://patentable.app/patents/US-6420660

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