An integrated circuit package is mounted on a socket pedestal. External terminals such as ball electrodes may be provided in an array on a mounting surface. Recessed sections can also be provided in the mounting surface in a peripheral section of a region where the external terminals are arranged. The recessed sections can be used for positioning. When the integrated circuit package is subject to an electrical characteristic test (or a burn-in test), the recessed sections can be coupled to protrusions provided on a side of a socket and positioned. As a result, the external terminals can be securely and accurately connected to socket terminals. Thus, integrated circuit packages are provided which have arrayed electrodes for face-down mounting, and which improves the connection accuracy with respect to a socket for conducting electrical characteristic tests.
Legal claims defining the scope of protection, as filed with the USPTO.
1. An integrated circuit package, comprising: an array of external integrated circuit terminals on a mounting surface of the integrated circuit package, the array of external terminals adapted to be connected to corresponding socket terminals; and a plurality of recessed sections adapted to be coupled to protrusions of a socket pedestal during connection of the external terminals to the corresponding socket terminals, wherein the recessed sections are disposed along the mounting surface in a peripheral region of the external terminals.
2. An integrated circuit package according to claim 1 , wherein the recessed sections are provided diagonally on the mounting surface with respect to each other.
3. An integrated circuit package according to claim 1 , further comprising: a sealing material.
4. An integrated circuit package according to claim 1 , wherein each of the recessed sections is convex-shaped.
5. An integrated circuit package according to claim 1 , wherein the integrated circuit package is a ball-grid-array type integrated circuit package.
6. An integrated circuit package according to claim 1 , wherein the integrated circuit package is a chip-size-package type integrated circuit package.
7. An integrated circuit package, comprising: an array of external integrated circuit terminals on a mounting surface of the integrated circuit package, the array of external terminals adapted to be connected to corresponding socket terminals; and a plurality of recessed sections adapted to be coupled to protrusions of a socket pedestal during connection of the external terminals to the corresponding socket terminals.
8. An integrated circuit package according to claim 7 , wherein the recessed sections are provided diagonally on the mounting surface with respect to each other.
9. An integrated circuit package according to claim 7 , further comprising: a sealing material.
10. An integrated circuit package according to claim 7 , wherein each of the recessed sections is convex-shaped.
11. An integrated circuit package according to claim 7 , wherein the integrated circuit package is a ball-grid-array type integrated circuit package.
12. An integrated circuit package according to claim 7 , wherein the integrated circuit package is a chip-size-package type integrated circuit package.
13. An integrated circuit package according to claim 7 , wherein the recessed sections are disposed along the mounting surface in a peripheral region of the external terminals.
14. An integrated circuit package, comprising: an array of external terminals adapted to be connected to corresponding socket terminals; and a plurality of recessed sections adapted to be coupled to protrusions of a socket pedestal during connection of the external terminals to the corresponding socket terminals.
15. An integrated circuit package according to claim 14 , wherein the array of external integrated circuit terminals are disposed on a mounting surface of the integrated circuit package, and wherein the recessed sections are disposed along the mounting surface in a peripheral region of the external terminals.
16. An integrated circuit package according to claim 15 , wherein the recessed sections are provided diagonally on the mounting surface with respect to each other.
17. An integrated circuit package according to claim 14 , further comprising: a sealing material.
18. An integrated circuit package according to claim 14 , wherein each of the recessed sections is convex-shaped.
19. An integrated circuit package according to claim 14 , wherein the integrated circuit package is a ball-grid-array type integrated circuit package.
20. An integrated circuit package according to claim 14 , wherein the integrated circuit package is a chip-size-package type integrated circuit package.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
December 18, 2001
October 22, 2002
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