The present invention relates to a backup module for a standard memory chip, more especially a standard memory chip (for example, DIP, QFJ and PLCC packages) having high-density pins for the backup of a personal computer. If the standard memory chip is out of order, the backup module according to the present invention can take the place of the standard memory chip. By switching between two or more chips, the capacity of the memory can be effectively increased as a whole and the content (program or data) of the memory can be easily optimized.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A memory module having backup function, comprising: a memory connector having a plurality of pins, adapted to be connected to an original memory socket of a printed circuit board; a backup memory having capacity equivalent to that of a source memory, connected to a main system through a plurality of said pins of the memory connector; a switching means for selecting a backup memory or a source memory; and a memory socket for inserting a source memory.
2. The memory module having backup function according to claim 1 , wherein the control pins of the memory connector are lead out from a portion new the control pins of the source memory and are not contacted with the control pin of the source memory.
3. The memory module having backup function according to claim 1 , wherein the through hole for the control pin of the memory connector and the through hole for the control pin of the source memory are as near as possible.
4. The memory module having backup function according to claim 3 , wherein an insulator is provided between the control pin of the memory connector and the control pin of the source memory.
5. The memory module having backup function according to any one of claims 1 to 3 , wherein the backup memory is a DRAM.
6. The memory module having backup function according to any one of claims 1 to 3 , wherein the backup memory is a SRAM.
7. The memory module having backup function according to any one of claims 1 to 3 , wherein the backup memory is a flash ROM.
8. The memory module having backup function according to any one of claims 1 to 3 , wherein the backup memory is a programmable semiconductor chip.
9. The memory module having backup function according to any one of claims 1 to 3 , wherein the switching means is manual.
10. The memory module having backup function according to any one of claims 1 to 3 , wherein the switching means is automatically turned on and off based on the determination of an electrical signal.
11. A memory module having backup function, characterized by comprising: a memory connector consisting of an inner support part and a lead part, the inner support part having a configuration substantially equivalent to that of a source memory, a hollow chip mounting part being provided in the inner support part for mounting a specific chip, the lead part being adapted to be connected to an original memory socket for connecting with the base board of a backup system; a switching means, for selecting a backup memory or a source memory; a backup memory having capacity equivalent to that of the source memory, connected between the switching means and the main system through the pins of the memory connector; a memory socket for inserting a source memory, connected to the main system through the switching means; and a base board on which a specific chip is mounted, having two or more layers of circuits, one layer of circuit being connected to the memory connector, and the other layer of circuit being connected to the backup memory and the memory socket.
12. The memory module having backup function according to claim 11 , wherein the inner support part of the memory connector is made of an insulator having an outer configuration similar to the inner configuration of the original memory socket; a plurality of grooves are provided at the periphery of the inner support part; the conductor part is made of a plurality of conductor posts which are adapted to be inserted into the grooves; and the width and height of the conductor posts are slightly more than those of the inner support part.
13. The memory module having backup function according to claim 12 , wherein the cross section of the grooves provided at the periphery of the inner support part is flask-shaped; the shape of the conductor posts corresponds to that of the grooves; and both ends of the conductor posts are wider than the middle of the conductor posts.
14. The memory module having backup function according to any one of claims 11 to 13 , wherein the backup memory is a DRAM.
15. The memory module having backup function according to any one of claims 11 to 13 , wherein the backup memory is a SRAM.
16. The memory module having backup function according to any one of claims 11 to 13 , wherein the backup memory is a flash ROM.
17. The memory module having backup function according to any one of claims 11 to 13 , wherein the backup memory is a programmable semiconductor chip.
18. The memory module having backup function according to any one of claims 11 to 13 , wherein the switching means is manual.
19. The memory module having backup function according to any one of claims 11 to 13 , wherein the switching means is automatically turned on and off based on the determination of an electrical signal.
20. The memory module having backup function according to any one of claims 11 to 13 , wherein the specific chip is composed of a plurality of chips.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
March 28, 2000
November 5, 2002
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