A high-frequency module comprising a high-frequency device-mounting package and an external circuit board, wherein said high-frequency device-mounting package includes a dielectric substrate having a first grounding layer contained therein, said dielectric substrate mounting a high-frequency device on one surface thereof and having, formed on one surface thereof, first high-frequency signal transmission lines connected to said high-frequency device, and having, formed on the other surface thereof, second high-frequency signal transmission lines coupled to said first high-frequency signal transmission lines; said external circuit board is constituted by a dielectric board having third high-frequency signal transmission lines and a second grounding layer, said third high-frequency signal transmission lines being formed on one surface of said dielectric board, and said second grounding layer being formed on the other surface of said dielectric board or inside thereof; and said high-frequency device-mounting package and said external circuit board are arranged side by side, and the second high-frequency signal transmission lines of the high-frequency package are electrically connected to the third high-frequency signal transmission lines of the external circuit board through linear electrically conducting members. The patterns of the second high-frequency signal transmission lines on the side of the high-frequency device-mounting package can be easily aligned with the patterns of the third high-frequency signal transmission lines on the side of the external circuit board, effectively reducing the transmission loss at the junction portions of the lines.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A high-frequency module comprising at least one high-frequency device-mounting package and at least one external circuit board, wherein said high-frequency device mounting package comprises: a dielectric substrate having a first grounding layer embedded therein; a high-frequency device mounted on a first surface of the dielectric substrate; a first high-frequency signal transmission line disposed on the first surface of the dielectric substrate and connected to said high-frequency device; a second high-frequency signal transmission line disposed on a second surface of the dielectric substrate, coupled to said first high-frequency signal transmission line; and a pair of first grounding portions which are electrically connected to the first grounding layer and which are disposed on either side of an end of the second high-frequency signal transmission line; wherein said external circuit board comprises a dielectric board having a third high-frequency signal transmission line, a second grounding layer, and a pair of second grounding portions, said third high-frequency signal transmission line being disposed on a first surface of said dielectric board, said second grounding layer being disposed on a second surface of said dielectric board or inside thereof, and said second grounding portions being electrically connected to the second grounding layer and disposed on either side of an end of the third high-frequency signal transmission line, wherein said high-frequency device-mounting package and said external circuit board are arranged side-by-side, the second high-frequency signal transmission line of the high-frequency device-mounting package is electrically connected to the third high-frequency signal transmission line of the external circuit board through a first linear electrically conducting member, and the first grounding portions and the second grounding portions are electrically connected with each other through a second linear electrically conducting member.
2. A high-frequency module according to claim 1 , wherein a slot is disposed in the first grounding layer of said high-frequency device-mounting package, and the first high-frequency signal transmission line is electromagnetically coupled to the second high-frequency signal transmission line through said slot.
3. A high-frequency module according to claim 1 , wherein an opening is disposed through the first grounding layer of said high-frequency device-mounting package, and the first high-frequency signal transmission line and the second high-frequency signal transmission line are coupled together using a through-hole conductor that penetrates the dielectric substrate by passing through said opening.
4. A high-frequency module according to claim 1 , wherein said first and second linear electrically conducting members are selected from the group consisting of wire, ribbon, and electrically conducting tape.
5. A high-frequency module according to claim 1 , wherein a grounded coplanar line is formed by the pair of the first grounding portions and the end of the second high frequency signal transmission line.
6. A high-frequency module according to claim 1 , wherein an electromagnetic wave-shielding member is joined to the surface of said dielectric substrate on the side where the high-frequency device is mounted, and said high-frequency device is air-tightly sealed by the dielectric substrate and the electromagnetic wave-shielding member.
7. A high-frequency module according to claim 6 , wherein said electromagnetic wave-shielding member comprises an electromagnetic wave-shielding plate, and wherein said electromagnetic wave-shielding plate is joined to the dielectric substrate by an electromagnetic wave-shielding frame on the surface of the dielectric substrate that surrounds the high-frequency device to create a cavity in which the high-frequency device is air-tightly sealed between the dielectric substrate and the electromagnetic shielding member.
8. A high-frequency module according to claim 1 , comprising a plural number of the high-frequency device-mounting package, wherein the second high-frequency signal transmission line of each high-frequency device-mounting package is electrically connected together through a linear conducting member, and the second high-frequency signal transmission line of at least one high-frequency device-mounting package is connected to the third high-frequency signal transmission line.
9. A high-frequency module according to claim 8 , wherein a common electromagnetic wave-shielding member is joined to a surface, on which the high-frequency device is mounted, of the dielectric substrate of each package, and the high-frequency device mounted on each package is air-tightly sealed by the electromagnetic wave-shielding member and dielectric substrate.
10. A high-frequency module according to claim 9 , wherein said electromagnetic wave-shielding member is a metallic case which contains the plural number of the high-frequency device-mounting packages and the external circuit board.
11. A high frequency module comprising at least one high-frequency device-mounting package and at least one external circuit board, wherein said high-frequency device-mounting package comprises: a dielectric substrate having a first grounding layer embedded therein; a high-frequency device mounted on a fast surface of the dielectric substrate; a first high-frequency signal transmission line disposed on the first surface of the dielectric substrate and connected to said high-frequency device; and a second high-frequency signal transmission line disposed on a second surface of the dielectric substrate, coupled to said first high-frequency signal transmission line; wherein said external circuit board comprises: a dielectric board; a third high-frequency signal transmission line provided on a first surface of said dielectric board; a second grounding layer provided on a second surface of said dielectric board or inside thereof; and an electromagnetic wave-shielding member provided on said dielectric board; and wherein said high-frequency device-mounting package and said external circuit board are arranged side-by-side, the second high-frequency signal transmission line of the high-frequency device-mounting package is electrically connected to the third high-frequency signal transmission line of the external circuit board through a linear electrically conducting member, the high-frequency device is air-tightly sealed by the electromagnetic wave-shielding member, exposed surfaces are provided on the first grounding layer of said high-frequency device-mounting package and on the second grounding layer of said external circuit board, and said exposed surfaces are attached to said electromagnetic wave-shielding member so that the first grounding layer and the second grounding layer are electrically connected with each other.
12. A high-frequency module comprising at least one high-frequency device-mounting package and at least one external circuit board, wherein said high-frequency device-mounting package comprises: a dielectric substrate having a first grounding layer embedded therein; a high-frequency device mounted on a first surface of the dielectric substrate; a first high-frequency signal transmission line disposed on the first surface of the dielectric substrate and connected to said high-frequency device; and a second high-frequency signal transmission line disposed on a second surface of the dielectric substrate, coupled to said first high-frequency signal transmission line; wherein said external it board comprises: a dielectric board; a third high-frequency signal transmission line provided on a first surface of said dielectric board; and a second grounding layer provided on a second surface of said dielectric board or inside thereof; and wherein said high-frequency device-mounting package and said external circuit board are arranged side-by-side, the second high-frequency signal transmission line of the high-frequency device-mounting package is electrically connected to the third high-frequency signal transmission line of the external circuit board through a linear electrically conducting member, wherein exposed surfaces are provided on the first grounding layer of said high-frequency device-mounting package and on the second grounding layer of said external circuit board, and said exposed surfaces are overlapped one upon the other thereby to electrically connect the first grounding layer and the second grounding layer.
13. A high-frequency module comprising at least one high-frequency device-mounting package and at least one external circuit board, wherein said high-frequency device-mounting package comprises: a dielectric substrate having a first grounding layer embedded therein; a high-frequency device mounted on a first surface of the dielectric substrate; a first high-frequency signal transmission line disposed on the first surface of the dielectric substrate and connected to said high-frequency device; and a second high frequency signal transmission line disposed on a second surface of the dielectric substrate, coupled to said first high-frequency signal transmission line; wherein said external circuit board comprises: a dielectric board; a third high-frequency signal transmission line provided on a first surface of said dielectric board; and a second grounding layer provided on a second surface of said dielectric board or inside thereof; and wherein said high-frequency device-mounting package and said external circuit board are arranged side-by-side, the second high-frequency signal transmission line of the high-frequency device-mounting package is electrically connected to the third high-frequency signal transmission line of the external circuit board through a linear electrically conducting member, wherein exposed surfaces are provided on the first grounding layer of said high-frequency device-mounting package and on the second grounding layer of said external circuit board, and said exposed surfaces are electrically connected together by another linear conducting member.
14. A high-frequency device-mounting package equipped with a dielectric substrate having an embedded grounding layer contained therein, wherein a high-frequency device is mounted on a first surface of the dielectric substrate, a first high-frequency signal transmission line connected to said high-frequency device is disposed on the first surface of the dielectric substrate, a second high-frequency signal transmission line coupled to said first high-frequency signal transmission line is disposed on a second surface of the dielectric substrate, a connection portion is disposed at the end of the second high-frequency signal transmission line for connection to an external circuit board by linear conducting members and said embedded grounding layer is partly exposed at a region corresponding to said connection portion.
15. A high-frequency device-mounting package according to claim 14 , the dielectric substrate is cut away on opposite sides of the end of said second high-frequency signal transmission line so that the embedded grounding layer is partly exposed.
16. A high-frequency device-mounting package equipped with a dielectric substrate having an embedded grounding layer contained therein, wherein: a high-frequency device is mounted on a first surface of the dielectric substrate; a first high-frequency signal transmission line is disposed on the first surface of the dielectric substrate and connected to said high-frequency device; a second high-frequency signal transmission line is disposed on a second surface of the dielectric substrate and coupled to said first high-frequency signal transmission line; a pair of grounding portions are electrically connected to the first grounding layer and disposed on either side of an end of the second high frequency signal transmission line; and at the end of the second high-frequency signal transmission line and at the grounding portions, a connection portion is disposed for connection to an external circuit board by linear conducting members.
17. A high-frequency device-mounting package according to claim 16 , wherein an opening is disposed through the first grounding layer of said high-frequency device-mounting package, and the first high-frequency signal transmission line and the second high-frequency signal transmission line are coupled together using a through-hole conductor that penetrates the dielectric substrate by passing through said opening.
18. A high-frequency device-mounting package according to claim 16 , wherein said high-frequency device-mounting package is adapted for adjacent connection to an external circuit board.
19. A high-frequency device-mounting package according to claim 16 , wherein said high-frequency device-mounting package is adapted for mounting within an inner perimeter of an external circuit board.
20. A high-frequency device-mounting package according to claim 16 , wherein a slot is disposed in the first grounding layer, and the first high-frequency sign transmission line is electromagnetically coupled to the second high-frequency signal transmission line through said slot.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
July 29, 1999
November 19, 2002
Browse 5M+ US patents with plain-English claim translations and AI-generated analysis.