The invention is a device for fast taking out and putting in, especially the device can fast take out a chip from a wafer to put in another chip receptacle, wherein, the invention includes a gear set, which consists of a first big gear, a second big gear and a small gear; at least two driving device, which consists a first driving device and a second driving device; a link mechanism, which cooperates with the gear set to proceed that the link mechanism moves forth toward a non-horizontal direction and back toward the reverse direction, and moves down toward a non-vertical direction and up toward the reverse direction as well; a lift mechanism, which is driven by the first driving device, and a mold plate with gear set and link mechanism is then driven either to complete the actions of moving down toward a non-vertical direction and up toward the reverse direction as mentioned above. The second driving device drives gear set, which utilizes the rotation of gear set to complete the actions of moving forth toward a non-horizontal direction and back toward the reverse direction as mentioned above.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A device for fast taking out and putting in, which includes: a gear set, which consists of at least a first big gear, a second big gear and a small gear; at least two driving devices, which consists of a first driving device and a second driving device; a link mechanism, which one end connects to the first big gear, and middle part of the link mechanism connects to the second big gear, a small gear is in between the two big gears and connects to the two big gears separately, the arrangement for the two big gears and the small gear is that the centers of the three gears are arranged in and imaginary line, after the connection of link mechanism and gear set, the link mechanism is parallel to the imaginary line in space, and both of them are with an angle to level; the second driving device drives the two big gears to rotate for moving another end of the link mechanism back and forth, the link mechanism fixes on a mold plate with the gear set; and a lift mechanism, which is driven by the first driving device to move up and down, and then drives the mold plate for moving link mechanism and gear set up and down together.
2. The device for fast taking out and putting in as cited in claim 1 , wherein, the two diameters of the first big gear and the second big gear are same.
3. The device for fast taking out and putting in as cited in claim 1 , wherein, the two driving devices are two servo motors.
4. The device for fast taking out and putting in as cited in claim 1 , wherein, one end of the link mechanism and a first coaxial link pivot and fix on the first big gear.
5. The device for fast taking out and putting in as cited in claim 4 , wherein, the first coaxial link rotates with the first big gear simultaneously.
6. The device for fast taking out and putting in as cited in claim 1 , wherein, middle part of the link mechanism and a second coaxial link pivot and fix on the second big gear.
7. The device for fast taking out and putting in as cited in claim 6 , wherein, the second coaxial link rotates with the second big gear simultaneously.
8. The device for fast taking out and putting in as cited in claim 1 , wherein, the first driving device drives the lift mechanism via at least a driving link device.
9. The device for fast taking out and putting in as cited in claim 8 , wherein, the lift mechanism drives mold plate via at least a driven link device.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
June 15, 2001
January 14, 2003
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