A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.
Legal claims defining the scope of protection, as filed with the USPTO.
1. An electronic component mounting method comprising: pre-bonding electronic components onto a plurality of circuit boards using a first unit, each electronic component being pre-bonded onto one of the circuit boards by a bonding element; and post-bonding the pre-bonded electronic components on the circuit boards using a second unit separate from the first unit, a plurality of the pre-bonded electronic components being post-bonded simultaneously, said post-bonding comprising heating and pressing each of the electronic components, wherein a rate of said pre-bonding is independent of a rate of said post-bonding.
2. The method of claim 1 , wherein said pre-bonding of electronic components and said post-bonding of the pre-bonded electronic components are executed simultaneously on electronic components mounted on different circuit boards.
3. The method of claim 2 , further comprising: storing a group of circuit boards having the electronic components pre-bonded thereon in a storage container after said pre-bonding of the electronic components; transferring the group of circuit boards stored in the storage container to the second unit; and feeding each of the transferred group of circuit boards to the second unit.
4. The method of claim 2 , wherein each circuit board having the electronic components pre-bonded thereon are fed one-by-one to the second unit after said pre-bonding of the electronic components.
5. The method of claim 1 , further comprising: storing a group of circuit boards having the electronic components pre-bonded thereon in a storage container after said pre-bonding of the electronic components; transferring the group of circuit boards stored in the storage container to the second unit; and feeding each of the transferred group of circuit boards to the second unit.
6. The method of claim 1 , wherein each circuit board having the electronic components pre-bonded thereon are fed one-by-one to the second unit after said pre-bonding of the electronic components.
7. The method of claim 1 , further comprising carrying each of the circuit boards having the electronic components pre-bonded thereon from the first unit to the second unit by a carrying unit.
8. The method of claim 1 , wherein the second unit includes a pressing surface for pressing each of the electronic components against a respective one of the circuit boards during said post-bonding, further comprising preventing contamination of the pressing surface by arranging a contamination preventing member between the pressing surface and each of the electronic components during said post-bonding of the pre-bonded electronic components.
9. The method of claim 1 , wherein said pre-bonding of the electronic components comprises pre-bonding the electronic components onto the plurality of circuit boards at a different rate than the rate of post-bonding the electronic components onto the plurality of circuit boards.
10. The method of claim 1 , wherein said post-bonding of the pre-bonded electronic components comprises post-bonding a plurality of the pre-bonded electronic components simultaneously using a second unit including a plurality of heating and pressurizing apparatuses, each of the heating and pressurizing apparatuses being operable to post-bond a pre-bonded electronic component to a circuit board.
11. The method of claim 10 , wherein said post-bonding of the plurality of the pre-bonded electronic components simultaneously comprises post-bonding each electronic component independently of the other simultaneously post-bonded electronic components using one of the heating and pressurizing apparatuses such that post-bonding of a second one of the electronic components commences after post-bonding of a first one of the electronic components has commenced and before the post-bonding of the first one of the electronic components is completed.
12. The method of claim 11 , wherein said post-bonding of the plurality of the pre-bonded electronic components simultaneously is preformed independently such that such that post-bonding of a third one of the electronic components commences after post-bonding of the second one of the electronic components has commenced and before the post-bonding of the first one and second one of the electronic components is completed.
13. The method of claim 1 , wherein said post-bonding of the pre-bonded electronic components comprises post-bonding three of the pre-bonded electronic components simultaneously using a second unit including three heating and pressurizing apparatuses, each of the heating and pressurizing apparatuses being operable to post-bond a pre-bonded electronic component to a circuit board.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
May 18, 2000
April 8, 2003
Browse 5M+ US patents with plain-English claim translations and AI-generated analysis.