This patent describes ink jet printing device that utilizes a shape memory alloy such as a nickel titanium alloy for ejecting drops. The ejection involves utilization of the transformation of a shape memory alloy from its martensitic phase to its austenitic phase (or vice versa) as an actuator to cause the ejection of ink from chamber. The actuator is normally in its quiescent state and transfers to an ink injection state upon heating thereby causing ink ejection from the chamber. The heating occurs by passing a current through the shape memory alloy. The shape memory alloy can be conductive and arranged in a serpentine form for operation. The actuator being formed above a crystallographically etched nozzle chamber having a nozzle port from which ink is ejected.
Legal claims defining the scope of protection, as filed with the USPTO.
1. An ink jet print head chip that comprises a wafer substrate; a drive circuitry layer positioned on the wafer substrate; and a plurality of micro-elecromechanical nozzles positioned on the wafer substrate, each nozzle comprising a nozzle chamber defined by the wafer substrate, the nozzle chamber being in fluid communication with an ink supply; and an actuator that is positioned in the nozzle chamber, the actuator being displaceable between a quiescent position and an operative position with respect to the wafer substrate to eject ink from the nozzle chamber, the actuator being connected to the drive circuitry layer and at least part of the actuator being of a shape memory alloy that is capable of being heated on receipt of an electrical signal from the drive circuitry layer such that the shape memory alloy undergoes a thermal transition to displace the actuator from the quiescent position to the operative position.
2. An ink jet print head as claimed in claim 1 , in which the shape memory alloy is in the form of a metal that relies on a thermal transition from a martensitic phase to an austenitic phase.
3. An ink jet print head chip as claimed in claim 1 , in which each nozzle chamber is the result of an etching process carried out on the wafer substrate, with the wafer substrate also defining a nozzle opening, from which the ink can be ejected, in fluid communication with each nozzle chamber.
4. An ink jet print head chip as claimed in claim 3 , in which each actuator is in the form of a bend actuator, with one end of the bend actuator being mechanically connected to the wafer substrate and an opposite end being free to move with respect to the wafer substrate.
5. An ink jet print head as claimed in claim 4 , in which each bend actuator includes a heating circuit of the shape memory alloy electrically connected to the drive circuitry layer, the heating circuit being fast with a pre-stressing layer of resiliently flexible material so that the heating circuit and the pre-stressing layer are bent away from the nozzle opening when the shape memory alloy is in a pre-thermal transition phase, such that when the electrical signal heats the shape memory alloy to undergo thermal transition, the shape memory alloy straightens the bend actuator towards the nozzle opening to eject ink from the nozzle opening.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
July 10, 1998
May 6, 2003
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