A substrate for forming a semiconducting layer is provided to grow the semiconducting layer on a major surface thereof, wherein the substrate comprises a single crystal of a chemical formula of XB2 where X contains one of Ti and Zr and the major surface may preferably be substantially parallel to plane (0001) of the single crystal because the plane (0001) of the boride substrate is highly coherent to the lattices of GaN and AlN layers grown eptaxially on the substrate. The single crystal of the substrate may be a solid solution containing impurities of not more than 5%, wherein at least one of the impurities is one selected from Cr, Hf, V, Ta and Nb. Further, a semiconductor device includes the substrate of a single crystal of a chemical formula of XB2 and at least one semiconducting layer which is grown epitaxially on the substrate, the semiconducting layer including a nitride semiconductor of a chemical formula of ZN where Z is one of gallium, aluminum and indium and boron. The device can be used for a light emission diode in which one or more connection electrodes are attached on the substrate.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A substrate for forming a semiconducting layer to grow the semiconducting layer on a major surface thereof, wherein the substrate comprises a single crystal of a chemical formula of XB 2 where X contains at least one of Ti and Zr.
2. A substrate for forming a semiconducting layer to grow the semiconducting layer on a major surface thereof, wherein the substrate comprises a single crystal of a chemical formula of XB 2 where x contains at least one of Ti and Zr, wherein the major surface is substantially parallel to plane (0001) of the single crystal.
3. A substrate for forming a semiconducting layer to row the semiconducting layer on a major surface thereof; wherein the substrate comprises a single crystal of a chemical formula of XB 2 where x contains at least one of Ti and Zr, wherein the single crystal is a solid solution containing impurities of not more than 5%.
4. The substrate according to claim 3 , wherein at least one of the impurities is one selected from Cr, Hf, V, Ta and Nb.
5. The semiconductor device comprising the substrate according to claim 1 and a semiconducting layer which is grown epitaxially on the substrate.
6. A semiconductor device comprising: a substrate for forming a semiconducting layer to grow the semiconducting layer on a major surface thereof, wherein the substrate comprises a single crystal of a chemical formula of XB 2 where x contains at least one of Ti and Zr; and a semiconducting layer which is grown epitaxially on the substrate, wherein the semiconducting layer comprises a nitride semiconductor of a chemical formula of ZN where Z is at least one of gallium, aluminum and indium and boron.
7. A semiconductor device comprising: a substrate for forming a semiconducting layer to grow the semiconducting layer on a major surface thereof, wherein the substrate comprises a single crystal of a chemical formula of XB 2 where x contains at least one of Ti and Zr; and a semiconducting layer which is grown epitaxially on the substrate, wherein the semiconducting layer is formed on a buffer layer which is formed on the substrate.
8. The semiconductor device according to claim 7 , wherein the buffer layer is an amorphous or crystalline phase of a nitride containing at least one of gallium and aluminum.
9. A semiconductor device comprising: a substrate for forming a semiconducting layer to grow the semiconducting layer on a major surface thereof, wherein the substrate comprises a single crystal of a chemical formula of XB 2 where x contains at least one of Ti and Zr; and a semiconducting layer which is grown epitaxially on the substrate, wherein one or more connection electrodes are attached on the substrate.
10. A semiconductor device comprising: a substrate for forming a semiconducting layer to grow the semiconducting layer on a major surface thereof wherein the substrate comprises a single crystal of a chemical formula of XB 2 where x contains at least one of Ti and Zr; and a semiconducting layer which is grown epitaxially on the substrate, wherein the semiconductor device is a light emission diode including a light emission layer based on gallium nitride therein.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
July 27, 2001
May 20, 2003
Browse 5M+ US patents with plain-English claim translations and AI-generated analysis.