The invention relates to a low inductance multilayer chip and a method for fabricating the same, the multilayer chip including a plurality of internal electrode layers where the internal electrodes of the predetermined layers are electrically connected to reverse the current directions flowing in the internal electrodes of neighboring layers to thereby offset inductance and performing stable operations at high frequency.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A low inductance multilayer chip, comprising: a plurality of stacked layer with internal electrodes formed thereon; and an external positive electrode and an external negative electrode, each of said internal electrodes being electrically connected to only said external positive electrode or said external negative electrode; wherein for at least some adjacent stacked layers, an end of said internal electrode on a first of said adjacent stacked layer is positive, and said end of said internal electrode on a second of said adjacent stacked layers is negative; such that a direction of a current flow in said internal electrode of said first of said adjacent stacked layers is opposite to a direction, of a current flow in said internal electrode of said second of said adjacent stack layers.
2. The multilayer chip according to claim 1 , wherein said stacked layers define through holes therein, with conductive material in said through holes, at least some of said internal electrodes of said stacked layers being electrically connected together by said conductive material in said through holes.
3. A low inductance multilayer chip, comprising: a stacked structure comprising a plurality of green sheets stacked together, said green sheets defining at least two through holes therein; internal electrodes formed on said greed sheets; external positive and negative electrodes formed at both ends of said stacked structure, each of said internal electrodes being electrically connected to only said external positive electrode or said negative electrode; end conductive material in said through holes, at least some of said internal electrodes being electrically connected together by said conductive material in said through holes; wherein for at least some adjacent green sheets, an end of said internal electrode on a first of said adjacent green sheets is positive, and said end of said internal electrode on a second of said adjacent green sheets is negative; such that a direction of a current flow in said internal electrode of said first of said adjacent green sheets is opposite to a direction of a current flow in said internal electrode of said second of said adjacent green sheets.
4. The multilayer chip according to claim 3 , wherein said through holes are defined at both ends of said stack structure in alternating green sheets.
5. A low inductance multilayer chip, comprising: a plurality of stacked layers a with internal electrodes formed thereon; and an external positive electrode and an external negative electrode, each of said internal electrodes being electrically connected to only said external positive electrode or said external negative electrode; and at least some of said internal electrodes being electrically connected together by resistive material; wherein for at least some adjacent stacked layers, an end of said internal electrode on a first of said adjacent stacked layer is positive, and said end of said internal electrode on a second of said adjacent stacked layers is negative; such that a direction of a current flow in said internal electrode of said first of said adjacent stacked layers is opposite to a direction of a current flow in said internal electrode of said second of said adjacent stack layers.
6. The multilayer chip according to claim 5 , wherein at least some of said stacked layers define through hale therein, said resistive material being in said through holes.
7. A low inductance multilayer chip, comprising; a stacked structure comprising a plurality of green sheets stacked together said green sheets defining at least two through holes therein; internal electrodes formed on said green sheets; external positive and negative electrodes formed at both ends of said stacked structure, each of said internal electrodes being electrically connected to only said external positive electrode or said negative electrode; and resistive material in said through holes, at least some of said internal electrodes being electrically connected together by said resistive material in said through holes; wherein for at least some adjacent green sheets, an end of said internal electrode on a first of said adjacent green sheets is positive, and said end of said internal electrode on a second of said adjacent green sheets is negative; such that a direction of a current flow in said internal electrode of said first of said adjacent green sheets is opposite a direction of a current flow in said internal electrode of said second of said adjacent green sheets.
8. A low inductance multilayer chip comprising: resistor layers; capacitor layers, said capacitor layers comprising internal electrodes thereon; and an external positive electrode and an external negative electrode, each of said resistor layers being electrically connect to at least one of said external positive and negative electrodes, and each of said internal electrodes being electrically connected to only said external positive electrode or said external negative electrode; wherein for at least some adjacent stacked layers, an end of said internal electrode on a first of said adjacent stacked layers is positive, and said end of said internal electrode on a second of said adjacent stacked layers is negative; such that a direction of a current flow in said internal electrode of said first said adjacent stacked layers is opposite to a direction of a current flow in said internal electrode of said second of said adjacent stacked layers.
9. The multilayer chip according to claim 8 , wherein said external electrodes are formed at both ends of said stacked structure for electrical connection with said resistor layers and said internal electrode of said capacitor layers.
10. The multilayer chip according to claim 8 , wherein said resistor layers comprise: a plurality of green sheets stacked together, each of said green sheets defining at least two through holes therein; internal electrodes formed on said green sheets; and resistive material in said through holes, said resistive material electrically connecting at least some of said internal electrodes of said resistor layers.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
May 2, 2001
May 27, 2003
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