Problems caused by a nonuniform processing profile are avoided by altering the area to be processed so as to compensate for the processing profile. More specifically, with regard to etching, problems caused by a nonuniform etch profile can be avoided by altering the mask employed in specifying the etch area so as to compensate for the etch profile. Nonuniform parameters of interest of structures which result from a nonuniform etch profile during the etching of a mask in which all the structures were identical can be avoided for by altering the mask employed in specifying the etch area so as to compensate for the etch profile. The mask is changed in a manner that is inversely proportional to the etch profile for each particular structure characteristic that determines the parameter of interest for which uniformity is desired.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method for manufacturing an array of structures over a substrate, so that a parameter of interest for each of said structures is substantially identical, the method comprising the steps of: depositing an element defining overlay on said substrate for each structure in an array of structures thereby forming an array of element defining overlays, wherein at least one of said element defining overlays is intentionally not identical to at least one other of said element defining overlays; and processing said substrate with said element defining overlays thereon so that a parameter of interest of each of said elements as formed after said processing is identical for each of said structures on said substrate, said parameter of interest being a function of the attribute of said element defining overlay that makes said at least one element defining overlay intentionally different from said at least one other element defining overlay.
2. The invention as defined in claim 1 wherein said processing is at least one of the group consisting of etching, depositing, ion implantation, heat treatment, and irradiation.
3. The invention as defined in claim 1 wherein said structures are lenses.
4. The invention as defined in claim 1 wherein said structures are lenses and said parameter of interest is the focal distance of said lenses.
5. The invention as defined in claim 1 wherein said element defining overlay is comprised of photoresist.
6. The invention as defined in claim 1 wherein said substrate is silicon.
7. An apparatus comprising a plurality of nonidentical structures, each of said structures being made up of at least one element, said at least one element of each of said plurality of nonidentical structures being intentionally different so as to make said nonidentical structures nonidentical by design, said nonidentical structures having at least one parameter of interest that is identical and is a function of an attribute of said element which makes said elements intentionally different.
8. The invention as defined in claim 7 wherein said structures are lenses.
9. The invention as defined in claim 7 wherein said structures are lenses and said parameter of interest is the focal distance of said lenses.
10. A method for manufacturing an array of structures over a substrate, so that a parameter of interest for each of said structures varies over said substrate in accordance with a prescribed function, said prescribed function being different than any processing profile of materials used in any step of manufacturing said structure, the method comprising the steps of: depositing an element defining overlay on said substrate for each structure in an array of structures thereby forming an array of element defining overlays, wherein at least one of said element defining overlays is intentionally not in accordance with said prescribed function given the position on said substrate of said at least one of said element defining overlays should a uniform etch rate be employed; and processing said substrate with said element defining overlays thereon so that a parameter of interest of each of said elements as formed after said processing varies in accordance with said prescribed function, said parameter of interest being a function of the attribute of said element defining overlay that makes said at least one element defining overlay intentionally not in accordance with said prescribed function.
11. The invention as defined in claim 10 wherein said prescribed function is a uniform function.
12. The invention as defined in claim 10 wherein said processing is at least one of the group consisting of etching, depositing, ion implantation, heat treatment, and irradiation.
13. The invention as defined in claim 10 structures are lenses.
14. The invention as defined in claim 10 structures are lenses and said parameter of interest is the focal distance of said lenses.
15. The invention as defined in claim 10 wherein said structures are lenses of a lens array, said parameter of interest is the focal length of said lenses, and said element defining overlays are photoresist.
16. The invention as defined in claim 10 wherein said element defining overlay is comprised of photoresist.
17. The invention as defined in claim 10 wherein said substrate is silicon.
18. An apparatus comprising a plurality of nonidentical structures on a substrate each having a parameter of interest, said parameter of interest varying over said substrate in accordance with prescribed function which is different than any processing profile of materials used in any step of manufacturing said structure, each of said structures being made up of at least one element, said at least one element of each of said plurality of nonidentical structures being intentionally different so as to make said nonidentical structures nonidentical by design, said at least one parameter of interest being a function of an attribute of said element which makes said structures intentionally different.
19. The invention as defined in claim 18 wherein said prescribed function is a uniform function, so that said parameter of interest of all of said structures are substantially the same.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
November 13, 2001
November 18, 2003
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