A method of manufacturing a hermetic package. In one embodiment, the method includes: (1) forming a plurality of contact-sensitive electronic devices on a device substrate, each of the plurality of devices having an active surface, (2) providing a mounting substrate, (3) forming a grid of dam material between the device substrate and the mounting substrate that is pitched as a function of lateral dimensions of the plurality of devices, (4) bringing the device substrate and the mounting substrate together until the active surface of each of the plurality of devices is proximate, but spaced apart from, the mounting substrate, the mounting substrate and the dam material cooperating to form packages for the plurality of devices and (5) dicing the device substrate to separate the packages.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method of mnanufacturing a hermetic package, comprising: forming a plurality of contact-sensitive electronic devices on a device substrate, each of said plurality of devices having an active surface; providing a mounting substrate; forming a grid of dam material between said device substrate and said mounting substrate that is pitched as a function of lateral dimensions of said plurality of devices; bringing said device substrate and said mounting substrate together until said active surface of each of said plurality of devices is proximate, but spaced apart from, said mounting substrate, said mounting substrate and said dam material cooperating to form packages for said plurality of devices, wherein said bringing and said forming a grid of dam material are carried out in a single step; and dicing said device substrate to separate said packages.
2. The method as recited in claim 1 further comprising forming a hermetic seal over said dam material.
3. The method as recited in claim 2 further comprising forming a passivation layer over said hermetic seal.
4. The method as recited in claim 2 wherein said hermetic seal is formed from one selected from the group consisting of: silicon nitride, silicon carbide, silicon oxide, aluminum nitride, and aluminum oxide.
5. The method as recited in claim 1 wherein said dam material is selected from the group consisting of: epoxy resin; polyamide; benzocyclobutene; silicone; and cyanoacrylate.
6. The method as recited in claim 1 wherein said each of said plurality of interconnected contact-sensitive electronic devices is selected from the soup consisting of: a surface acoustic wave device, a micro-electromechanical system device, a mirror device, a pyroelectric device, and a piezoelectric device.
7. The method as recited in claim 1 further comprising positioning a plurality of electrically conductive spacers to physically separate said active surface from said mounting substrate by a predetermined distance.
8. The method as recited in claim 7 wherein said positioning further comprises positioning each of said plurality of electrically conductive spacers inboard of said dam material with respect to said active surface.
9. The method as recited in claim 1 wherein said active surface of each of said plurality of devices is separated from said mounting substrate by at most about 40 microns.
10. The method as recited in claim 1 further comprising: forming a hermetic seal over said dam material; and forming a passivation layer over said hermetic seal.
11. The method as recited in claim 1 further comprising positioning a plurality of electrically conductive spacers to physically separate said active surface from said mounting substrate by a predetermined distance, including positioning each of said plurality of electrically conductive spacers inboard of said dam material with respect to said active surface.
12. A method of manufacturing a hermetic package, comprising: forming a plurality of surface acoustic wave devices on a device substrate, each of said plurality of devices having an active surface; providing a mounting substrate; fomuing a grid of dam material between said device substrate and said mounting substrate that is pitched as a finction of lateral dimensions of said plurality of devices; bringing said device substrate and said mounting substrate together until said active surface of each of said plurality of devices is proximate, but spaced apart from, said mounting substrate, said mounting substrate and said dam material cooperating to form packages for said plurality of devices; dicing said device substrate to separate said packages; and forming a hermetic seal over said dam material at edges of each of said packages.
13. The method as recited in claim 12 further comprising forming a passivation layer over said hermetic seal.
14. The method as recited in claim 12 wherein said dam material is selected from the group consisting of: epoxy resin; polyirde; benzocyclobutene; silicone; and cyanoacrylate.
15. The method as recited in claim 12 wherein said hermetic seal is formed from one selected from the group consisting of: silicon nitride, silicon carbide, silicon oxide, aluminum nitride, and aluminum oxide.
16. The method as recited in claim 12 further comprising positioning a plurality of electrically conductive spacers to physically separate said active surface from said mounting substrate by a predetermined distance.
17. The method as recited in claim 16 wherein said positioning further comprises positioning each of said plurality of electrically conductive spacers inboard of said dam material with respect to said active surface.
18. The method as recited in claim 12 wherein said active surface of each of said plurality of devices is separated from said mounting substrate by at most about 40 microns.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
November 29, 2001
November 18, 2003
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