Combined electrical test and mechanical test system for thin film characterization

An apparatus (30) and method (80) for predicting electrical property stability of a thin film or conductive substrate (14) prior to multi-probe testing. The present invention utilizes a nanoindenter type device (10) obtaining mechanical properties as a function of displacement depth and applied load into the bond pad surface to accurately predict electrical property stability of the entire substrate or sample under test. In addition, the present invention includes a nanoindenter type device (10) including a second probe (34) having the ability to measure localized electrical properties of the sample while obtaining the mechanical property measurements. This additional electrical measurement is correlated with the mechanical property measurements to accurately predict electrical property stability of the entire conductive substrate, preferably by predicting the presence of an unwanted material surface layer.