In a method for fabricating a Si—Al alloy packaging material, by adding Al—Si alloy powders to Si powders and pressurizing-forming it, or by pressurizing-filling Si powders or a preforming body of Si powders with Al—Si alloy melt, a Si—Al alloy packaging material having good characteristics can be obtained.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method for fabricating a Si Al alloy packaging material, comprising: mixing Si powders with Al Si alloy powders such that the total weight of Si, x plus y, is 40 90% by weight of the mixture, wherein x is the weight of Si powder and y is the amount of Si in the Al Si alloy powder; filling the mixture into a die having a certain shape; and pressurizing-forming the filled mixture.
2. The method of claim 1 , wherein heat or current is applied to the mixture while pressurizing-forming it.
3. The method of claim 1 , wherein a particle size of the Si powders and the Al Si alloy powders is in the range of 5 500 m.
4. The method of claim 1 , wherein a Si Al packaging material having a three-dimensional shape is directly fabricated by adjusting a pressurization-forming piston and a substrate's shape.
5. The method of claim 1 , wherein the content of microelement such as Cu, Mg, Zn and Fe is below 5% by weight of the Al Si alloy powders.
6. A method for fabricating a Si Al alloy packaging material, comprising: preparing a Si powders and Al Si alloy mixture melt such that the total weight of Si, x plus y, is 40 90% by weight of a packaging material to be obtained, wherein x is the weight of Si powder and y is the amount of Si in the Al Si alloy powder; and pressurizing-filling the Si powder with the Al Si alloy melt in a die having a certain shape.
7. The method of claim 6 , wherein a preforming body of the Si powders is fabricated by applying current and pressure in the range of 1 50 MPa.
8. The method of claim 7 , wherein the preforming body is fabricated by sintering the Si powders in a vacuum state or under gas circumstances such as oxygen, nitrogen and argon, etc.
9. The method of claim 6 or 7 , wherein the Si powders or the preforming body is heated at a temperature in the range of 150 500 C. to facilitate the penetration of the melt.
10. The method of claim 6 or 7 , wherein a pressure is not greater than 1 atmospheric pressure in the pressurizing-filling in order to facilitate the penetration of the melt into the Si powders or the preforming body.
11. The method of claim 6 , wherein a Si Al packaging material having a three-dimensional shape is directly fabricated by adjusting a pressurization-forming piston and a substrate's shape.
12. The method of claim 6 , wherein the content of microelement such as Cu, Mg, Zn and Fe is below 5% by weight of the Al Si alloy melt.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
November 1, 2002
July 6, 2004
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