A power semiconductor module and a cooling element for holding the power semiconductor module are described. The power semiconductor module has a housing that has an underside and an upper side. At least one spring element projects from the upper side of the housing and is disposed on the upper side of the housing.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A power semiconductor module, comprising: a cooling element having an opening formed therein; a housing having an underside and an upper side, said housing being disposed in said opening; and at least one spring element integrally formed on said upper side and projecting from said upper side, said at least one spring element pressing said underside of said housing against said cooling element, ensuring thermal contact between said underside and said cooling element.
2. The power semiconductor module according to claim 1 , wherein: said housing has a first edge and a second edge; and said spring element is one of at least two spring elements, a first of said spring elements disposed in a region of said first edge on said upper side and a second of said spring elements disposed in a region of said second edge on said upper-side.
3. The power semiconductor module according to claim 2 , wherein said two spring elements are two of four spring elements and a first two of said spring elements are formed in said region of said first edge and a second two of said spring elements are formed in said region of said second edge.
4. The power semiconductor module according to claim 3 , wherein said spring elements are formed integrally onto said housing.
5. The power semiconductor module according to claim 3 , wherein said spring elements are each formed in an arcuate shape with a first end and a second end, said first end connected to said upper side of said housing and said second end disposed spaced apart from said upper side in a spring mounted manner.
6. The power semiconductor module according to claim 3 , wherein said housing has two sides opposite each other, and said upper side of said housing has a step formed therein in a region of each of said two sides of said housing, said step has an upper side and said spring elements are each disposed on said upper side of said step.
7. The power semiconductor module according to claim 6 , wherein said housing has dome-shaped projections formed on at least one of said two sides, said sides extend between said first edge and said second edge and between said upper side and said underside.
8. The power semiconductor module according to claim 1 , wherein said housing is composed of a thermoplast.
9. A cooling element for holding a power semiconductor module, comprising: a power semiconductor housing having an underside, an upper side, and at least one spring element projecting from said upper side and disposed on said upper side; and a cooling element body having a T-shaped groove formed therein for receiving said power semiconductor module, said at least one spring element pressing said underside of said power semiconductor housing against said cooling element, ensuring thermal contact between said power semiconductor housing and said cooling element.
10. The cooling element according to claim 9 , wherein said cooling element body has cooling ribs extending from a surface of said cooling element body facing away from said groove.
11. The cooling element according to claim 9 , wherein said cooling element body has an extruded section.
12. The power semiconductor module according to claim 1 , wherein said housing is injection-molded.
13. The power semiconductor module according to claim 1 , wherein said at least one spring element is an integrally molded-on spring element.
14. The power semiconductor module according to claim 1 , wherein said housing contains a semiconductor component.
15. A power semiconductor module for placement in a cooling element, comprising: a housing having an underside and an upper side, and at least one spring element integrally formed on said upper side and projecting from said upper side for pressing said underside of said housing against the cooling element, ensuring thermal contact between said underside and the cooling element.
16. The power semiconductor module according to claim 15 , wherein: said housing has a first edge and a second edge; and said spring element is one of at least two spring elements, a first of said spring elements disposed in a region of said first edge on said upper side and a second of said spring elements disposed in a region of said second edge on said upper side.
17. The power semiconductor module according to claim 16 , wherein said two spring elements are two of four spring elements and a first two of said spring elements are formed in said region of said first edge and a second two of said spring elements are formed in said region of said second edge.
18. The power semiconductor module according to claim 17 , wherein said spring elements are formed integrally onto said housing.
19. The power semiconductor module according to claim 17 , wherein said spring elements are each formed in an arcuate shape with a first end and a second end, said first end connected to said upper side of said housing and said second end disposed spaced apart from said upper side in a spring mounted manner.
20. The power semiconductor module according to claim 17 , wherein said housing has two sides opposite each other, and said upper side of said housing has a step formed therein in a region of each of said two sides of said housing, said step has an upper side and said spring elements are each disposed on said upper side of said step.
21. The power semiconductor module according to claim 20 , wherein said housing has dome-shaped projections formed on at least one of said two sides, said sides extend between said first edge and said second edge and between said upper side and said underside.
22. The power semiconductor module according to claim 15 , wherein said housing is composed of a thermoplast.
23. The power semiconductor module according to claim 15 , wherein said housing is injection-molded.
24. The power semiconductor module according to claim 15 , wherein said at least one spring element is an integrally molded-on spring element.
25. The power semiconductor module according to claim 15 , wherein said housing contains a semiconductor component.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
December 24, 2001
September 14, 2004
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