A solder ball achieves a desired quantity of solder material for a solder joint easily without increasing the thickness of a solder layer formed to cover a core. The solder ball comprises a conductive core having depressions on its outer surface, and a solder layer formed to cover the outer surface of the core in such a way as to fill the depressions of the core. Thus, the quantity of the solder material included in the ball is supplemented by the solder material filled into the depressions. Preferably, the core has a higher melting point than the solder layer and wettability to the solder layer. The core may have a cavity in its inside, thereby forming a shell-shaped core. The core may be made of a porous metal body having pores, in which part of the pores reaches the outer surface of the core, thereby forming the depressions.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A solder ball comprising: a conductive core having depressions on its outer surface; and a solder layer formed to cover the outer surface of the core in such a way as to fill the depressions of the core.
2. The ball according to claim 1 , wherein the core has a higher melting point than the solder layer; and wherein the core has wettability to the solder layer.
3. The ball according to claim 1 , wherein the core has a cavity in its inside.
4. The ball according to claim 3 , wherein the depressions do not reach the cavity.
5. The ball according to claim 3 , wherein the core is shell-shaped by the cavity.
6. The ball according to claim 3 , wherein the core and the cavity are spherical and concentric with each other; and wherein the core is shell-shaped.
7. The ball according to claim 1 , wherein the depressions are directed from the outer surface of the core to approximately a center thereof.
8. The ball according to claim 1 , wherein each of the depressions has a depth larger than a diameter of a mouth thereof.
9. The ball according to claim 3 , wherein each of the depressions has a depth smaller than a diameter of a mouth thereof.
10. The ball according to claim 1 , wherein the core is made of a porous metal body having pores; and wherein part of the pores reaches the outer surface of the core, forming the depressions.
11. An interconnection structure designed for mechanically and electrically interconnecting a first electrode formed on a first member with an opposing second electrode formed on a second member with a conductive joint; wherein the joint is formed by melting and solidifying a solder ball; and wherein the solder ball comprises a conductive core having depressions on its outer surface, and a solder layer formed to cover the outer surface of the core in such a way as to fill the depressions of the core.
12. The structure according to claim 11 , wherein the core has a higher melting point than the solder layer; and wherein the core has wettability to the solder layer.
13. The structure according to claim 11 , wherein the core has a cavity in its inside.
14. The structure according to claim 13 , wherein the depressions do not reach the cavity.
15. The structure according to claim 13 , wherein the core is shell-shaped by the cavity.
16. The structure according to claim 13 , wherein the core and the cavity are spherical and concentric with each other; and wherein the core is shell-shaped.
17. The structure according to claim 11 , wherein the depressions are directed from the outer surface of the core to approximately a center thereof.
18. The structure according to claim 11 , wherein each of the depressions has a depth larger than a diameter of a mouth thereof.
19. The structure according to claim 13 , wherein each of the depressions has a depth smaller than a diameter of a mouth thereof.
20. The structure according to claim 11 , wherein the core is made of a porous metal body having pores; and wherein a part of the pores reaches the outer surface of the core, forming the depressions.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
September 26, 2002
September 21, 2004
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