Patentable/Patents/US-6803328
US-6803328

Print thermally conductive interface assembly

PublishedOctober 12, 2004
Assigneenot available in USPTO data we have
Inventorsnot available in USPTO data we have
Technical Abstract

A novel visible light curable composition for forming a thermally conductive interface and a method of using the same is provided. The composition is used to promote the transfer of heat from a source of heat such as an electronic device to a heat dissipation device such as a heat sink. The composition includes an elastomeric base matrix containing a light curable catalyst, loaded with a thermally conductive filler material such as boron nitride grains or ceramic filler. After the compound is prepared, it is screen or stencil printed onto the desired surface and cured by exposure to visible light. The thermal interface is bonded to the desired surface and has sufficient compressibility to allow it to overcome the voids in the mating surface to which the assembly is mounted.

Patent Claims
7 claims

Legal claims defining the scope of protection, as filed with the USPTO.

1

1. A method of manufacturing a thermal interface for conducting heat, comprising: providing a viscous elastomeric material; mixing a visible light curable catalyst throughout said elastomeric material; mixing a thermally conductive filler material throughout said elastomeric material; applying a layer of said viscous elastomeric material to a heat dissipating surface in an uncured state; and curing said layer of elastomeric material by exposing said layer of elastomeric materiel to visible wavelength light, wherein said thermal interface remains compressible when placed into contact with a heat-generating device.

2

2. The method of claim 1 , said elastomeric material comprising by weight: an elastomeric base matrix between approximately 35 and 75 percent; a visible light curable catalyst between about 0.5 to 15 percent; and a hydrocarbon solvent between about 10 to 30 percent.

3

3. The method of claim 1 , wherein said thermally conductive filler material is boron nitride.

4

4. The method of claim 1 , wherein said thermally conductive filler material is alumna.

5

5. The method of claim 1 , wherein said heat dissipating surface is the surface of a heat sink.

6

6. The method of claim 1 , wherein said step of applying said viscous elastomeric material includes applying said material to said heat dissipating surface by screen printing.

7

7. The method of claim 1 , wherein said step of applying said viscous elastomeric material includes applying said material to said heat dissipating surface by stencil printing.

Classification Codes (CPC)

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Patent Metadata

Filing Date

November 4, 2002

Publication Date

October 12, 2004

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Cite as: Patentable. “Print thermally conductive interface assembly” (US-6803328). https://patentable.app/patents/US-6803328

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