A stiffener for reinforcing a package integrated circuit. The stiffener includes a rigid planar element having a first surface for bonding to a package substrate. The rigid planar element forms a major interior aperture for receiving and surrounding an integrated circuit on all sides of the integrated circuit. The rigid planar element also forms a minor interior aperture for receiving and surrounding a secondary circuit structure on at least three sides of the secondary circuit structure. In this manner, the stiffener provides structural support to the integrated circuit package, which reduces and preferably eliminates twisting and warping of the substrate package as it heats and is subjected to other stresses. Because the major interior apertures does not need to be large enough to fit both the monolithic integrated circuit and the secondary circuit structure, there is more stiffener material available to provide structural support than there would be if the major interior aperture was large enough to fit both the monolithic integrated circuit and the secondary circuit structure.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A stiffener for reinforcing a package integrated circuit, the stiffener comprising: a rigid, planar, wholly electrically conductive element having a first surface for bonding to a package substrate, the rigid planar element forming a major interior aperture extending completely through the rigid planar element, for receiving and surrounding an integrated circuit on all sides of the integrated circuit, and the rigid planar element forming a minor interior aperture extending completely through the rigid planar element, for receiving and surrounding a secondary circuit structure on at least three sides of the secondary circuit structure.
2. The stiffener of claim 1 , wherein the rigid planar element forms a plurality of minor interior apertures for receiving and surrounding a plurality of secondary circuit structures on at least three sides of each of the secondary circuit structures.
3. The stiffener of claim 1 , wherein the minor interior aperture formed by the rigid planar element surrounds the secondary circuit structure on all sides of the secondary circuit structure.
4. The stiffener of claim 1 , wherein the stiffener is formed of metal.
5. The stiffener of claim 1 , wherein the stiffener is formed of copper.
6. The stiffener of claim 1 , wherein the stiffener is about fifty millimeters square in size.
7. The stiffener of claim 1 , wherein the stiffener is about six hundred and forty-five microns in thickness.
8. The stiffener of claim 1 , wherein the major interior aperture is about twenty-two millimeters square in size.
9. The stiffener of claim 1 , wherein the minor interior aperture is about four millimeters square in size.
10. The stiffener of claim 1 , wherein the major interior aperture adjoins the minor interior aperture.
11. A stiffener for reinforcing a package integrated circuit, the stiffener comprising: a rigid, planar, wholly electrically conductive element having a first surface for bonding to a package substrate, and the rigid planar element forming a major interior aperture extending completely through the rigid planar element, for receiving and surrounding an integrated circuit on all sides of the integrated circuit, the major interior aperture having beveled corners.
12. A packaged integrated circuit, comprising: a package substrate, a monolithic integrated circuit mounted at one surface to the package substrate, with electrical connections formed between the monolithic integrated circuit and the package substrate, a secondary circuit structure mounted at one surface to the package substrate, with electrical connections formed between the secondary circuit structure and the package substrate, an electrically conductive stiffener mounted to the package substrate for reinforcing the packaged integrated circuit, the stiffener forming a major interior aperture extending completely through the stiffener, for receiving and surrounding the integrated circuit on all sides of the integrated circuit, and the stiffener also forming a minor interior aperture extending completely through the stiffener, for receiving and surrounding the secondary circuit structure on at least three sides of the secondary circuit structure, where the stiffener is not directly physically connected to either the monolithic integrated circuit or the secondary circuit structure, and a cover enclosing the integrated circuit and the secondary circuit.
13. The packaged integrated circuit of claim 12 , wherein the stiffener forms a plurality of minor interior apertures for receiving and surrounding a plurality of secondary circuit structures on at least three sides of each of the secondary circuit structures.
14. The packaged integrated circuit of claim 12 , wherein the minor interior aperture formed by the stiffener surrounds the secondary circuit structure on all sides of the secondary circuit structure.
15. The packaged integrated circuit of claim 12 , wherein the stiffener is formed of metal.
16. The packaged integrated circuit of claim 12 , wherein the stiffener is formed of copper.
17. The packaged integrated circuit of claim 12 , wherein the stiffener is about fifty millimeters square in size.
18. The packaged integrated circuit of claim 12 , wherein the stiffener is about six hundred and forty-five microns in thickness.
19. The packaged integrated circuit of claim 12 , wherein the major interior aperture is about twenty-two millimeters square in size.
20. The packaged integrated circuit of claim 12 , wherein the minor interior aperture is about four millimeters square in size.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
December 3, 2002
November 30, 2004
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