A semiconductor stacking structure and method of producing the same has a flexible substrate. A plurality of apertures is formed on the flexible substrate. The plurality of apertures may be formed in groups for coupling semiconductor devices to the flexible substrate. A plurality of traces is formed on the flexible substrate for coupling the plurality of apertures together. A first semiconductor device is coupled to a first side of the flexible substrate. A first adhesive layer is placed on a first side of the flexible substrate for coupling the first semiconductor device to the first side of the flexible substrate. A plurality of contacts is coupled to a second side of the flexible substrate. The contacts and the first adhesive layer liquefy and flow into designated apertures when heated to couple the contacts to the first semiconductor device.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A semiconductor stacking structure comprising: a flexible substrate; a plurality of apertures formed on the flexible substrate wherein the plurality of apertures are formed in groups for coupling semiconductor packages to the flexible substrate; a plurality of traces for coupling the plurality of apertures together; a first semiconductor package coupled to a first side of the flexible substrate; and a first adhesive layer for coupling the first semiconductor package to the first side of the flexible substrate.
2. A semiconductor stacking structure in accordance with claim 1 further comprising a second adhesive layer which is placed on a top surface of the first semiconductor package to couple the flexible substrate to the top surface of the first semiconductor package when the flexible substrate is folded.
3. A semiconductor stacking structure in accordance with claim 1 further comprising a plurality of bond pads coupled to the flexible substrate for coupling the semiconductor packages to the flexible substrate.
4. A semiconductor stacking structure in accordance with claim 3 wherein the bond pads are coupled to selected apertures on the flexible substrate.
5. A semiconductor stacking structure package in accordance with claim 1 wherein the first adhesive layer is one of a solder paste or conductive paste.
6. A semiconductor stacking structure comprising: a flexible substrate; a plurality of apertures formed on the flexible substrate; a first semiconductor package coupled to a first side of the flexible substrate and positioned over the plurality of apertures; a plurality of bond pads coupled to the flexible substrate for stacking additional semiconductor packages on the flexible substrate; a plurality of traces coupling the plurality of apertures and the plurality of bond pads; and a first adhesive layer for coupling the first semiconductor package to the first side of the flexible substrate.
7. A semiconductor stacking structure comprising: a flexible substrate; a plurality of apertures formed on the flexible substrate wherein the plurality of apertures are formed in groups for coupling semiconductor packages to the flexible substrate; a plurality of traces for coupling the plurality of apertures together; a first semiconductor package coupled to a first side of the flexible substrate; means for coupling the first semiconductor device to the first side of the flexible substrate; and means placed on a top surface of the first semiconductor device for coupling the flexible substrate to the top surface of the first semiconductor device when the flexible substrate is folded.
8. A semiconductor stacking structure in accordance with claim 7 further comprising bond pads coupled to selected apertures on the flexible substrate.
9. A semiconductor stacking structure comprising: a flexible tape substrate having a plurality of apertures formed thereon; metal traces formed on the flexible tape substrate for coupling the plurality of apertures together; a first semiconductor package coupled to a first side of the flexible tape substrate; a first adhesive layer for coupling the first semiconductor package to the first side of the flexible tape substrate; a plurality of bond pads coupled to the flexible tape substrate for coupling another semiconductor package to the flexible tape substrate after the flexible tape substrate is folded onto the first semiconductor package; and a plurality of contacts coupled to a second side of the flexible tape substrate.
10. A semiconductor stacking structure in accordance with claim 9 further comprising a second adhesive layer which is placed on a top surface of the first semiconductor package to couple the flexible substrate to the top surface of the first semiconductor package when the flexible substrate is folded.
11. A semiconductor stacking structure in accordance with claim 9 wherein the bond pads are coupled to selected apertures on the flexible substrate.
12. A semiconductor stacking structure package in accordance with claim 9 wherein the first adhesive layer is one of a solder paste or conductive paste.
13. A semiconductor stacking structure comprising: a flexible substrate having a plurality of apertures formed thereon, the plurality of apertures are formed on a first end and a second end of the flexible substrate; metal traces formed of the flexible substrate to couple the plurality of apertures together; a first semiconductor package positioned over the plurality of apertures formed on the first end of the flexible substrate; a first adhesive layer for coupling the first semiconductor package over the plurality of apertures formed on the first end of the flexible substrate; and a plurality of bond pads coupled to the plurality of apertures formed on the second end of the flexible substrate for coupling another semiconductor package to the flexible substrate.
14. A semiconductor stacking structure in accordance with claim 13 further comprising a plurality of contacts coupled to a second side of the flexible substrate and to the first semiconductor package.
15. A semiconductor stacking structure in accordance with claim 13 further comprising a second adhesive layer which is placed on a top surface of the first semiconductor package to couple the flexible substrate to the top surface of the first semiconductor package when the flexible substrate is folded.
16. A semiconductor stacking structure package in accordance with claim 13 wherein the first adhesive layer is one of a solder paste or conductive paste.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
February 19, 2003
April 12, 2005
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