Semiconductor package and method of fabricating the same

1. A semiconductor package comprising: a semiconductor substrate including a device region on a first surface thereof, and a connecting pad electrically connected to the device region; a connecting wire which is formed on a side of the first surface of the semiconductor substrate and which includes a first end electrically connected to the connecting pad and a second end extending outside of the semiconductor substrate; an insulating film formed on the second surface of the semiconductor substrate and the connecting wire and having a hole at a position corresponding to the second end of the connecting wire; a support substrate formed on the side of the first surface of the semiconductor substrate so as to support the semiconductor substrate; an external electrode formed on the insulating film; and a distribution wire for electrically connecting the connecting wire and external electrode via the hole in the insulating film.

2. The package according to claim 1 , wherein the connecting wire comprises a metal plating layer.

3. The package according to claim 1 , wherein the connecting wire includes a portion in close contact with the first surface of the semiconductor substrate.

4. The package according to claim 1 , wherein the connecting wire is formed in close contact with the support substrate.

5. The package according to claim 1 , further comprising a projecting connecting electrode between the connecting pad and connecting wire.

6. The package according to claim 1 , wherein the external electrode comprises a columnar electrode, and a solder ball is formed on the columnar external electrode.

7. The package according to claim 6 , wherein an encapsulating film is formed around the columnar electrode on the insulating film.

8. The package according to claim 1 , wherein the device region comprises a photoelectric conversion device region.

9. The package according to claim 1 , wherein the support substrate comprises a glass substrate.

10. The package according to claim 9 , wherein one of a transparent adhesive layer and a transparent encapsulating layer is formed between the semiconductor substrate and glass substrate.

11. A semiconductor package comprising: a semiconductor substrate including a device region on a first surface thereof, and a connecting pad electrically connected to the device region; a support substrate formed on a side of the first surface of the semiconductor substrate; an external electrode formed on a side of a second surface of the semiconductor substrate; and connecting means, partially extended outside the semiconductor substrate, for electrically connecting the connecting pad and external electrode; wherein the connecting means includes a distribution wire extended to the side of the second surface of the semiconductor substrate, and a connecting wire formed on a surface of the support substrate opposing the semiconductor substrate, wherein the connecting wire comprises a first end portion connected to the connecting pad, and a second end portion extended outside the semiconductor substrate, and wherein a columnar electrode is formed on the second end portion of the connecting wire, and the distribution wire is connected to the columnar electrode.

12. The package according to claim 11 , wherein an insulating film is formed between the second surface of the semiconductor substrate and the distribution wire.