Techniques for recycling waste particles may include solidifying particles, which were generated by machining a crystal ingot into a wafer or by machining a semiconductor wafer, into a cake, and melting the cake, for example, into an ingot.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A recycling method for recycling waste particles comprising: machining a crystal ingot into a wafer or machining a semiconductor wafer; solidifying into a cake, particles generated by machining the crystal ingot or the semiconductor wafer; transporting the cake in a container such that dryness is prevented; and melting the cake.
2. A recycling method for recycling waste particles comprising: machining a crystal ingot into a wafer or machining a semiconductor wafer; solidifying into a cake, particles generated by machining the crystal ingot or the semiconductor wafer; transporting the cake in a container such that dryness is prevented; and recycling said cake as an ingot.
3. A recycling method for recycling waste particles comprising: machining a crystal ingot into a wafer or machining a semiconductor wafer; solidifying into a cake at a predetermined water content, particles generated by machining the crystal ingot or the semiconductor wafer; transporting the cake in a container such that dryness is prevented; and melting said cake to recycle said cake as an ingot.
4. A method for fabricating a semiconductor ingot comprising: machining a crystal ingot into a wafer or machining a semiconductor wafer; solidifying into a cake at a predetermined water content and without any chemical reactions, particles generated by machining the crystal ingot or the semiconductor wafer; transporting the cake in a container such that dryness is prevented; and melting said cake.
5. A recycling method according to one of claims 1 to 3 , wherein machining comprises abrading, grinding or polishing, dicing, back grinding or wafer polishing.
6. A method according to claim 4 , wherein machining comprises abrading, grinding or polishing, dicing, back grinding or wafer polishing.
7. A method for processing particles comprising: solidifying into a cake, particles that are generated by machining a crystal ingot into a wafer or machining a semiconductor wafer; transporting the cake in a container such that dryness is prevented; and melting the cake into an ingot.
8. A method according to claim 7 , further comprising: solidifying said particles at a predetermined water content, without any chemical reactions.
9. A method according to claim 7 , wherein machining comprises abrading, grinding or polishing.
10. A method according to claim 7 , wherein machining said semiconductor wafer comprises dicing, back grinding or wafer polishing.
11. A method according to claim 7 , wherein said particles comprises Si flakes.
12. A recycling method for recycling waste particles, comprising: transporting a cake in a container such that dryness is prevented; and melting the cake which is produced by solidifying particles generated by machining a crystal ingot into a wafer or machining a semiconductor wafer.
13. A recycling method for recycling waste particles comprising: transporting a cake in a container such that dryness is prevented; and melting the cake to recycle the cake as an ingot, said cake produced by solidifying particles generated by machining a crystal ingot or a semiconductor wafer at a predetermined water content.
14. A method for fabricating a semiconductor ingot comprising: transporting a cake in a container such that dryness is prevented; and melting the cake which is produced by solidifying particles generated by machining a crystal ingot or a semiconductor wafer at a predetermined water content and without any chemical reactions.
15. A method for processing particles comprising: transporting a cake in a container such that dryness is prevented; and melting the cake into an ingot, said cake produced by solidifying particles that are generated by machining a crystal ingot into a wafer or machining a semiconductor wafer.
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February 18, 2004
May 10, 2005
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