Process for producing a semiconductor chip

1. A process for producing a plurality of semiconductor chips having resilient contact elements protruding on one semiconductor chip side within the context of wafer level packaging; characterized in that wherein the semiconductor chip side provided with the resilient contact elements is coated with a covering compound forming a protective layer from which the protruding resilient contact elements project (a) wherein said plurality of semiconductor chips are arranged in a mold as separated semiconductor chips or bound in a wafer, one half of such mold being directed to rear sides of said semiconductor chips and the other half of said mold directed to said resilient contact elements, wherein one mold half presses the chips against the other mold half to slightly compress the resilient contact elements; (b) wherein said covering compound is filled into said mold and cured in said mold; (c) said mold is removed after said covering compound is cured; and (d) said plurality of semiconductor chips with said resilient contact elements protruding on said one semiconductor chip side are separated by cutting said cured covering compound or by cutting said wafer.

2. The process as claimed in claim 1 , wherein the plurality of semiconductor chips are coated simultaneously with the covering compound.

3. The process as claimed in claim 2 , wherein use is made of a plurality of separated chips or the wafer having the plurality of semiconductor chips formed on it.

4. The process as claimed in claim 3 , wherein the separated chips or the wafer are/is initially arranged on an adhesive carrier, in particular a film, after which the coating is carried out.

5. The process as claimed in claim 3 , wherein in the case of separated chips, in addition to the chip side bearing the contact elements, adjoining side edges are also coated with the compound.

6. The process as claimed in claim 3 , wherein in the case of separated chips, the chip rear side is additionally also coated with the compound, at least in some sections, primarily in an edge region.

7. The process as claimed in claim 1 , wherein the separated chips or the chips bound in the wafer are arranged in the mold whose one mold half has depressions into which the protruding contact elements engage with their front region in such a way that the chip side is spaced somewhat apart from the mold half, after which, following closure of the mold, the compound is introduced and cured.

8. The process as claimed in claim 1 , wherein for the purpose of simultaneous coating of the side edges as well, the separated chips are arranged spaced apart from one another on the carrier, in particular the film.

9. The process as claimed in claim 1 , wherein a structured upper mold is used, which acts on the chip rear side only at points, primarily at its center, so that the remaining free chip rear side can be coated with compound.

10. The process as claimed in claim 1 , wherein the chips, following the curing and the removal from the mold, if necessary following the removal of the carrier, in particular the film, are separated by dividing the cured compound or the wafer.

11. The process as claimed in claim 1 , wherein the compound is applied to the chip front side, if appropriate the side edges or, at least partially, the chip rear side in a printing process.

12. The process as claimed in claim 1 , wherein the compound is applied to the chip front side, if appropriate the side edges or, at last partially, the chip rear side in a dispensing process.

13. The process as claimed in claim 1 , wherein before or after being coated with the compound, the chip rear side, if appropriate to the extent to which it is still exposed, is coated with a further compound.

14. The process as claimed in claim 13 , wherein the coating of the chip rear side is applied in a printing process, a dispensing process, a sputtering process or an injection-molding process.

15. A semiconductor chip, in particular produced in accordance with the process as claimed in claim 1 , having resilient contact elements protruding on one chip side, wherein the chip side provided with the contact elements is coated with the covering compound forming the protective layer, from which the protruding contact elements project.

16. A semiconductor chip as claimed in claim 15 , wherein side edges adjoining the chip side having the contact elements is also coated with the compound.

17. The semiconductor chip as claimed in claim 15 , wherein the chip rear side is also coated with the compound, at least in some sections, primarily in an edge region.

18. The semiconductor chip as claimed in claim 15 , wherein the chip rear side, if appropriate to the extent that it is still exposed, is coated with a further compound.

19. The semiconductor chip as claimed in claim 15 , wherein the compound and, if appropriate, the further compound is a nonconductive compound based on a polymer, in particular a silicone compound or a polyurethane acrylate.