There is provided a bipolar transistor that enables a desirably enhanced high-frequency performance to be obtained when used as an oscillation amplifier of an oscillation circuit, and that is miniaturized and reduced in cost. A capacitance adjustment line (11) connected to a base pad (7) forms a parasitic capacitor with respect to an N+ collector substrate by interposing an insulating film (3) and an N collector substrate therebetween, thereby increasing collector-base capacitance Ccb. This capacitor is incorporated into a bipolar transistor, which functions as an oscillation amplifier and has a small transistor operation region (2), at least as a part of a balance capacitor constituting the oscillation circuit in the course of production of a semiconductor.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A bipolar transistor comprising: a semiconductor substrate; a transistor operation region formed on the semiconductor substrate; an insulating film formed so as to cover a surface of the semiconductor substrate; a lead line led to a surface of the insulating film therethrough from the transistor operation region; a pad for wire bonding connected to the lead line; and a capacitance adjustment line connected to the pad, wherein the semiconductor substrate is an N + /N type collector substrate, a collector electrode is formed on a reverse surface of the collector substrate, and the pad is formed on a surface of the collector substrate as an emitter pad and a base pad.
2. The bipolar transistor according to claim 1 , wherein by adjusting lengths of lines opposed to each other of the capacitance adjustment line connected to the emitter pad and the capacitance adjustment line connected to the base pad, a capacitance value of an emitter-base capacitor is adjusted.
3. The bipolar transistor according to claim 2 , wherein the capacitance adjustment line connected to the emitter pad and the capacitance adjustment line connected to the base pad are disposed in a comb shape.
4. The bipolar transistor according to claim 1 , wherein the semiconductor substrate is an N + /N type emitter substrate, an emitter electrode is formed on a reverse surface of the emitter substrate, and the pad is formed on a surface of the emitter substrate as a collector pad and a base pad.
5. The bipolar transistor according to claim 4 , wherein the capacitance adjustment line connected to the collector pad and the capacitance adjustment line connected to the base pad, which is opposed to the capacitance adjustment line connected to the collector pad, interpose the insulating film therebetween to form a collector-base capacitor as a Metal-Insulator-Metal (MIM) type capacitor, and by adjusting an opposed area of the capacitance adjustment lines, a capacitance value of the collector-base capacitor is adjusted.
6. A bipolar transistor comprising: a semiconductor substrate; a transistor operation region formed on the semiconductor substrate: an insulating film formed so as to cover a surface of the semiconductor substrate; a lead line led to a surface of the insulating film therethrough from the transistor operation region; a pad for wire bonding connected to the lead line; and a capacitance adjustment line connected to the pad, wherein the semiconductor substrate is an N+/N type collector substrate, a collector electrode is formed on a reverse surface of the collector substrate, and the pad is formed on a surface of the collector substrate as an emitter pad and a base pad, wherein by adjusting an area of the capacitance adjustment line connected to at least one of the base pad and the emitter pad, at least one capacitance value of a corresponding collector-base capacitor and collector-emitter capacitor is adjusted.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
July 3, 2003
September 6, 2005
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