A method of fabricating a bonding pad anchoring structure comprising the following steps. Providing a substrate. Forming a series of grated metal layers over the substrate separated by an interleaving series of via plug layers having via plugs electrically connecting respective at least a portion of adjacent grated metal layers. The series of grated metal layers having an uppermost grated metal layer. Forming an uppermost via plug layer over the uppermost grated metal layer. The uppermost via plug layer having via plugs. Forming a bonding pad layer over the uppermost via plug layer so that the uppermost via plugs within the uppermost via plug layer electrically connect the bonding pad layer to at least a portion of the uppermost grated metal layer whereby the bonding pad layer is securely bonded to the substrate.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method of fabricating a bonding pad anchoring structure, comprising the steps of: providing a substrate; forming a series of grated metal layers over the substrate separated by a interleaving series of via plug layers having via plugs electrically connecting respective at least a portion of adiacent grated metal layer; the series of grated metal layers having an uppermost grated metal layer; forming an uppermost via plug layer over the uppermost grated metal layer; the uppermost via plug layer having via plugs; and forming a bonding pad layer over the uppermost via plug layer so that the uppermost via plugs within the uppermost via plug layer electrically connect the bonding pad layer to at least a portion of the uppermost grated metal layer; wherby the bonding pad layer is securely bonded to the substrate; wherein the bonding pad layer comprises a bonding pad; the bonding pad comprising an outer metal ring a series of non-continuous, spaced-apart grated metal lines.
2. The method of claim 1 , wherein the grated metal layers include metal lines comprised of a material selected from the group consisting of: copper, aluminum, gold, tungsten and titanium; and the via plugs are comprised of a material selected from the group consisting of: copper, aluminum, gold, tungsten and titanium.
3. The method of claim 1 , wherein the grated metal layers include metal lines comprised of copper; and the via plugs are comprised of copper.
4. The method of claim 1 , wherein the via plug layers comprise via plugs formed through IMD layers.
5. The method of claim 1 , wherein the via plug layers comprise via plug formed through respective IMD layers, the IMD layers being comprised of a material selected from the group consisting of FSG, SiLK, nanoglass, Black Diamond™ and a porous dielectric material; and the grated metal layers comprise grated metal lines formed through respective dielectric layers, the dielectric layer being comprised of a material selected from the group consisting of FSG, SiLK, nanoglass, Black Diamond™ and a porous dielectric material.
6. The method of claim 1 , wherein the grated metal layers comprise grated metal lines formed through respective dielectric layer; the grated metal lines being substantially parallel to one another.
7. The method of claim 1 , wherein the grated metal layers comprise grated metal lines formed through respective dielectric layers; at least some of the grated metal lines being substantially perpendicular to one another.
8. The method of claim 1 , including the step of affixing a bonding pad wire to the bonding pad layer.
9. A method of fabricating a bonding pad anchoring structure, comprising the steps of: providing a substrate; forming a series of grated metal layers over the substrate separated by an interleaving series of via plugs layers having via plugs electrically connecting reapective at least a portion of adjacent grated metal layers; the series of grated metal layers having an uppermost grated metal layer; forming an uppermost via plug layer over the uppermost grated metal layer; the uppermost via plug layer having via plugs; and forming a bonding pad layer over the uppermost via plug layer so that the uppermost via plugs within the uppermost via plug layer electrically connect the bonding pad layer to at least a portion of the uppermost grated metal layer; whereby the bonding pad layer is securely bonded to the substrate; wherein one or more of the series of grated metal layers comprise an outer metal ring and a series of non-continuous, spaced-apart grated metal lines.
10. A method of fabricating a bonding pad anchoring structure, comprising the steps of: providing a substrate; forming a series of grated metal layer over the substrate seperated by an interleaving series of via plug layers having via plugs electrically connecting respective at least a portion of adjacent grated metal layers; the series of grated metal layers having an uppermost grated metal layer; the grated metal layers include metal lines comprised of a material selected from the group consisting of: copper, aluminum, gold, tungsten and titanium; forming an uppermost via plug layer over the uppermost grated metal layer; the uppermost via plug having via plugs; the via plugs are comprised of a material selected from the group consisting of: copper, aluminum, gold, tungsten and titanium; and forming a bonding pad layer over the uppermost via plug layer so that the uppermost via plugs within the uppermost via plug layer electrically connect the bonding pad layer to at least a portion of the uppermost grated metal layer; whereby the bonding pad layer is securely bonded to the substrate; wherein the bonding pad layer comprises a bonding pad; the bonding pad comprising an outer metal ring and a series of non-continuous, spaced-apart grated metal lines.
11. The method of claim 10 , wherein the metal lines are comprised of copper; and the via plugs are comprised of copper.
12. The method of claim 10 , wherein the via plug layers comprise via plugs formed through IMD layers.
13. The method of claim 10 , wherein the via plug layers comprise via plugs formed through respective IMD layers, the IMD layers being comprised of a material selected from the group consisting of FSG, SiLK, nanoglass, Black Diamoad™ and a porous dielectric material; and the grated metal layers comprise grated metal lines formed through respective dielectric layer, the dielectric layer being comprised of a material selected from the group consisting of FSG, SiLK, nanoglass, Black Dimoud™ and a porous dielectric material.
14. The method of claim 10 , wherein the grated metal layers comprise grated metal lines formed through respective dielectric layers; the grated metal lines being substantially parallel to one another.
15. The method of claim 10 , wherein the grated metal layers comprise grated metal lines formed through respective dielectric layers; at least some of the grated metal lines being substantially perpendicular to one another.
16. The method of claim 10 , including the step of affixing a bonding pad wire to the bonding pad layer.
17. The method of claim 10 , wherein one or more of the series of grated metal layers comprise an outer metal ring and a series of non-continuous, spaced-apart grated metal lines.
18. A method of fabricating a bonding pad anchoring structure, comprising the steps of: providing a substrate; forming a series of grated metal layers over the substrate separated by an interleaving series of via plug layers having via plugs electrically connecting respective at least a portion of adjacent grated metal layers; the series of grated metal layers having an uppermost grated metal layer; the grated metal layers include copper metal lines; forming an uppermost via plug layer over the uppermost grated metal layer; the uppermost via plug layer having via plugs; the via plugs are comprised of copper; and forming a bonding pad layer over the uppermost via plug layer so that the uppermost via plugs within the uppermost via plug layer electrically connect the bonding pad layer to at least a portion of the uppermost grated metal layer; whereby the bonding pad layer is securely bonded to the substrate; wherein the bonding pad layer comprises a bonding pad; the bonding pad comprising an outer metal ring and a series of non-continuous spaced-apart grated metal lines.
19. The method of claim 18 , wherein the via plug layers comprise via plugs formed through IMB layers.
20. The method of claim 18 , wherein the via plug layers comprise via plugs formed through respective IMD layers, the IMD layers being comprised of a material selected from the group consisting of FSG, SiLK, nanoglass, Black Diamond™ and a porous dielectric material; and the grated metal layers comprise grated metal lines formed through respective dielectric layers, the dielectric layer being comprised of a material selected from the group consisting of FSG, SilK, nanoglass, Black Diamond™ and a porous dielectric material.
21. The method of claim 18 , wherein the grated metal layers comprise grated metal lines formed through respective dielectric layers; the grated metal lines being substantially parallel to one another.
22. The method of claim 18 , wherein the grated metal layers comprise grated metal lines formed through respective dielectric layers; at least some of the grated metal lines being substantially perpendicular to one another.
23. The method of claim 18 , including the step of affixing a bonding pad wire to the bonding pad layer.
24. The method of claim 18 , wherein one or more of the series of grated metal layers comprise an outer metal ring and a series of non-continuous, spaced-apart grated metal lines.
25. A method of fabricating a bonding pad anchoring structure, comprising the steps of: providing a substrate; forming a series of grated metal layer over the substrate separated by an interleaving series of via plug layers having via plugs electrically connecting respective at least a portion of adjacent grated metal layers; the series of metal layers having an uppermost grated metal layer; the grated metal layers include copper metal lines; forming an uppermost via plug layer over the uppermost grated metal layer; the uppermost via plug layer having via plugs; the via plugs are comprised of copper; forming a bonding pad layer over the uppermost via plug layer so that the uppermost via plugs within the uppermost via plug layer electrically connect the bonding pad layer to at least a portion of the uppermost grated metal layer; whereby the bonding pad layer is securely bonded to the substrate; and affixing a bonding pad wire to the bonding pad layer; wherein the bonding pad layer comprises a bonding pad; the bonding pad comprising an outer metal ring and a series of non-continuous, spaced-apart grated metal lines.
26. The method of claim 25 , wherein the via plug layers comprise via plugs formed through IMD layers.
27. The method of claim 25 , wherein the via plug layers comprise via plugs formed through respective IMD layers, the IMD layers being comprised of a material selected from the group consisting of FSG, SiLK, nanoglass, Black Diamond™ and a porous dielectric material; and the grated metal layers comprise grated metal lines formed through respective dielectric layers, the dielectric layer being comprised of a material selected from the group consisting of FSG, SiLK, nanoglass, Black Dismond™ and a porous dielectric material.
28. The method of claim 25 , wherein the grated metal layers comprise grated metal lines formed through respective dielectric layers; the grated metal lines being substantially parallel to one another.
29. The method of claim 25 , wherein the grated metal layers comprise grated metal lines formed through respective dielectric layers; at least some of the grated metal lines being substantially perpendicular to one another.
30. The method of claim 25 , wherein one or more of the series of grated metal layers comprise an outer metal ring and a series of non-continuous, spaced-apart grated metal lines.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
September 13, 2002
October 18, 2005
Browse 5M+ US patents with plain-English claim translations and AI-generated analysis.