The invention provides a method for forming a film pattern, in which a method for forming a film pattern by the ink-jet method is improved, an increase in film thickness is achieved efficiently with simple steps, a requirement for a decrease in line width is met and, in addition, problems such as breaks and short circuits are not brought about when a conductive film is made. The method can include a first discharging step, wherein droplets are discharged in the whole film formation region with a pitch larger than the diameter of the droplet after being hit onto the substrate. In the second discharging step, droplets are discharged at positions in the whole film formation region different from the discharge positions in the first discharging step with the same pitch as that in the first discharging step. In the third discharging step, droplets are discharged in the whole film formation region with a pitch smaller than the pitch in the first discharging step. The substrate is treated beforehand in order to have the contact angle of 60 degrees or more with respect to the droplets.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method of forming a film, the method comprising: disposing a plurality of first droplets of a liquid material on a substrate with a first pitch larger than diameter of the first droplets after being disposed on the substrate; and disposing a plurality of second droplets of the liquid material on the substrate with a second pitch larger than diameters of the second droplets after being disposed on the substrate.
2. The method for forming according to claim 1 , the first pitch being nearly equal to the second pitch.
3. The method for forming a film according to claim 1 , the first pitch being twice or less than the diameters of the first droplets after being disposed on the substrate.
4. The method for forming a film according to claim 1 , the first pitch being larger than the diameters of the first droplets after being disposed on the substrate by 10 μm or more.
5. The method for forming a film according to claim 1 , further comprising: disposing a plurality of third droplets of the liquid material on the substrate.
6. The method for forming a film according to claim 5 , the plurality of the third droplets being disposed with a third pitch, the third pitch being equal to or less than the diameters of the third droplets after being disposed on the substrate.
7. A method of forming a film, the method comprising: disposing a plurality of first droplets on a substrate such that there is a first space between two adjacent droplets of the plurality of first droplets by discharging a liquid material; and disposing a plurality of second droplets on the substrate such that there is a second space between two adjacent droplets of the plurality of second droplets by discharging the liquid material.
8. The method for forming a film according to claim 7 , further comprising: disposing a plurality of third droplets such that there is a third space between adjacent droplets of the plurality of third droplets by discharging the liquid material.
9. The method of forming a film according to claim 8 , the plurality of third droplets being disposed in a predetermined film formation region and the region being filled with at least the first and the second droplets.
10. A method of forming a film, the method comprising: disposing a plurality of first droplets on a substrate such that there is a first space between two adjacent droplets of the plurality of first droplets by discharging a liquid material; and disposing a plurality of second droplets such that there is a second space between two adjacent droplets of the plurality of second droplets by discharging the liquid material, one of outlines of the second droplets crossing one of outlines of the first droplets.
11. The method for forming a film according to claim 10 , the substrate being surface-treated.
12. The method for forming a film according to claim 11 , a contact angle of the first or the second droplet with the substrate is 60 degrees of more.
13. The method for forming a film according to claim 12 , the liquid material for forming a film including a conductive material.
14. The method for forming a film according to claim 13 , further comprising: converting the liquid material for forming a film into a conductive film by at least one of a heat treatment and an optical treatment before disposing a plurality of second droplets.
15. An apparatus for forming a film pattern, which forms the film pattern by discharging a liquid material on a substrate by an ink-jet method, the apparatus comprising: an ink-jet head; and the film pattern being formed using the ink-jet head by the method for forming a film according to claim 10 .
16. An electro-optical apparatus comprising the conductive film wiring according to claim 10 .
17. Electronic equipment comprising the electro-optical apparatus according to claim 16 .
18. A non-contact card medium comprising the conductive film wiring according to claim 10 as an antenna circuit.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
October 22, 2002
February 7, 2006
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