Patentable/Patents/US-7042016
US-7042016

Semiconductor optical device, method of forming contact in semiconductor optical device

PublishedMay 9, 2006
Assigneenot available in USPTO data we have
Inventorsnot available in USPTO data we have
Technical Abstract

A semiconductor optical device comprises a superlattice contact semiconductor region and a metal electrode. The superlattice contact semiconductor region has a superlattice structure. The superlattice contact semiconductor region includes a II–VI compound semiconductor region and a II–VI compound semiconductor layer. The II–VI compound semiconductor region contains zinc, selenium and tellurium, and the II–VI compound semiconductor layer contains zinc and selenium. The metal electrode is provided on said superlattice contact semiconductor region and the metal electrode is electrically bonded to the first II–VI compound semiconductor layer.

Patent Claims
14 claims

Legal claims defining the scope of protection, as filed with the USPTO.

1

1. A semiconductor optical device comprising: a superlattice contact semiconductor region having a superlattice structure, said superlattice contact semiconductor region including a II–VI compound semiconductor region and a first II–VI compound semiconductor layer, said II–VI compound semiconductor region containing zinc, selenium and tellurium and said first II–VI compound semiconductor layer containing zinc and selenium; and a metal electrode provided on said superlattice contact semiconductor region, said metal electrode being electrically connected to said first II–VI compound semiconductor layer; wherein said II–VI compound semiconductor region includes a second II–VI compound semiconductor layer containing zinc and selenium and a third II–VI compound semiconductor layer containing zinc and tellurium, the first II–VI compound semiconductor layer is provided between the metal electrode and the third II–VI compound semiconductor layer to prevent atoms in the metal electrode from reacting with atoms in the II–VI compound semiconductor layer, and the third II–VI compound semiconductor layer is provided between the first II–VI compound semiconductor layer and the second II–VI compound semiconductor layer.

2

2. A semiconductor optical device comprising: a superlattice contact semiconductor region having a superlattice structure, said superlattice contact semiconductor region including a II–VI compound semiconductor region and a first II–VI compound semiconductor layer, said II–VI compound semiconductor region containing zinc, selenium and tellurium, and said first II–VI compound semiconductor layer containing zinc and selenium; a metal electrode provided on said superlattice contact semiconductor region, said metal electrode being electrically connected to said first II–VI compound semiconductor layer; wherein said II–VI compound semiconductor region includes a plurality of second II–VI compound semiconductor layers and a plurality of third II–VI compound semiconductor layers, wherein each second II–VI compound semiconductor layer contains zinc and selenium, wherein each third II–VI compound semiconductor layer contains zinc and tellurium, wherein one of said second II–VI compound semiconductor layers is nearest to said first II–VI compound semiconductor layer, wherein one of said third II–VI compound semiconductor layers is nearest to said first II–VI compound semiconductor layer, wherein said nearest third II–VI compound semiconductor layer is provided between said first II–VI compound semiconductor layer and said nearest second II–VI compound semiconductor layer, and wherein a thickness of said first II–VI compound semiconductor layer is greater than said nearest second II–VI compound semiconductor layer, the first II–VI compound semiconductor layer is provided between the metal electrode and the third II–VI compound semiconductor layer to prevent atoms in the metal electrode from reacting with atoms in the II–VI compound semiconductor layer, and the third II–VI compound semiconductor layer is provided between the first II–VI compound semiconductor layer and the second II–VI compound semiconductor layer.

3

3. A semiconductor optical device comprising: a superlattice contact semiconductor region having a superlattice structure, said superlattice contact semiconductor region including a II–VI compound semiconductor region and a first II–VI compound semiconductor layer, said II–VI compound semiconductor region containing zinc, selenium and tellurium, and said first II–VI compound semiconductor layer containing zinc and selenium; a metal electrode provided on said superlattice contact semiconductor region, said metal electrode being electrically connected to said first II–VI compound semiconductor layer; wherein said II–VI compound semiconductor region includes a plurality of second II–VI compound semiconductor layers and a plurality of third II–VI compound semiconductor layers, wherein each second II–VI compound semiconductor layer contains zinc and selenium, wherein each third II–VI compound semiconductor layer contains zinc and tellurium, and wherein a total thickness of said second II–VI compound semiconductor layers is greater than a total thickness of said third II–VI compound semiconductor layers, the first II–VI compound semiconductor layer is provided between the metal electrode and the third II–VI compound semiconductor layer to prevent atoms in the metal electrode from reacting with atoms in the II–VI compound semiconductor layer, and the third II–VI compound semiconductor layer is provided between the first II–VI compound semiconductor layer and the second II–VI compound semiconductor layer.

4

4. The semiconductor optical device according to claim 2 , wherein a thickness of said metal electrode is equal to or larger than 10 nanometers and is equal to or less than 30 nanometers.

5

5. The semiconductor optical device according to claim 2 , wherein a thickness of said first II–VI compound semiconductor layer is equal to or larger than 2 nanometers.

6

6. The semiconductor optical device according to claim 2 , further comprising: an active layer of a II–VI compound semiconductor provided on a supporting body, said supporting body including a ZnSe substrate, and said active layer being provided between said ZnSe substrate and said superlattice contact semiconductor region.

7

7. The semiconductor optical device according to claim 1 , wherein a thickness of said metal electrode is equal to or larger than 10 nanometers and is equal to or less than 30 nanometers.

8

8. The semiconductor optical device according to claim 1 , wherein a thickness of said first II–VI compound semiconductor layer is equal to or larger than 2 nanometers.

9

9. The semiconductor optical device according to claim 1 , further comprising: an active layer of a II–VI compound semiconductor provided on a supporting body, said supporting body including a ZnSe substrate, and said active layer being provided between said ZnSe substrate and said superlattice contact semiconductor region.

10

10. The semiconductor optical device according to claim 2 , wherein a thickness of said metal electrode is equal to or larger than 10 nanometers and is equal to or less than 30 nanometers.

11

11. The semiconductor optical device according to claim 2 , wherein a thickness of said first II–VI compound semiconductor layer is equal to or larger than 2 nanometers.

12

12. The semiconductor optical device according to claim 2 , further comprising: an active layer of a II–VI compound semiconductor provided on a supporting body, said supporting body including a ZnSe substrate, and said active layer being provided between said ZnSe substrate and said superlattice contact semiconductor region.

13

13. The semiconductor optical device according to of claim 3 , wherein a thickness of said metal electrode is equal to or larger than 10 nanometers and is equal to or less than 30 nanometers.

14

14. The semiconductor optical device according to claim 3 , wherein a thickness of said first II–VI compound semiconductor layer is equal to or larger than 2 nanometers.

Classification Codes (CPC)

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Patent Metadata

Filing Date

March 23, 2004

Publication Date

May 9, 2006

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