Flip-chip package and fabricating process thereof

1. A flip-chip packaging process, comprising at least the steps of: providing a chip and a substrate, wherein the chip has an active surface with bonding pads disposed thereon, and the substrate has a carrying surface with bump pads disposed thereon, wherein locations of the bump pads correspond to locations of the bonding pads; disposing a plurality of supporters at a periphery of the active surface, and forming an uncured electrically conductive adhesive bump on each bump pad; situating the chip over the carrying surface of the substrate to connect the active surface and the carrying surface via the supporters with a distance between the active surface and the carrying surface; pressing the chip toward the substrate to decrease the distance between the active surface and the carrying surface, so as to cause elastic strain in the supporters and increase a contact area between each pair of electrically conductive adhesive bump and bonding pad; stopping pressing the chip, so that the electrically conductive adhesive bumps, each connecting a bonding pad and a corresponding bump pad, have a smaller diameter at a central portion thereof than at end portions thereof; and curing the electrically conductive adhesive bumps.

2. The flip-chip packaging process of claim 1 , wherein disposing the supporters comprises disposing a plurality of gold bumps.

3. The flip-chip packaging process of claim 1 , wherein each electrically conductive adhesive bump comprises a polymeric material doped with a plurality of electrically conductive particles.

4. The flip-chip packaging process of claim 3 , wherein the electrically conductive particles comprise silver (Ag).

5. The flip-chip packaging process of claim 1 , wherein the electrically conductive adhesive bumps are formed on the bump pads with a screen printing method.