Optoelectronic device packaging assemblies and methods of making the same are described. In one aspect, an optoelectronic device packaging assembly includes an electrical sub-mount that includes a mounting area, a device turning mount, and a light-emitting device. The device turning mount has a sub-mount mounting side that is attached to the mounting area of the electrical sub-mount and a device mounting side that has a device mounting area that is oriented in a plane that is substantially perpendicular to the mounting area of the electrical sub-mount. The light-emitting device includes one or more semiconductor layers that terminate at a common light-emitting surface and are operable to emit light from the light-emitting surface. The light-emitting device is attached to the device mounting area of the device turning mount with the light-emitting surface oriented in a plane that is substantially parallel to the mounting area of the electrical sub-mount.
Legal claims defining the scope of protection, as filed with the USPTO.
1. An optoelectronic device packaging assembly, comprising: an electrical sub-mount including a mounting area and a sub-mount bonding pad; a device turning mount having a sub-mount mounting side attached to the mounting area of the electrical sub-mount and a device mounting side having a device mounting area oriented in a plane substantially perpendicular to the mounting area of the electrical sub-mount; a light-emitting device including a device bonding pad and one or more semiconductor layers terminating at a common light-emitting surface and operable to emit light from the light-emitting surface, wherein the light-emitting device is attached to the device mounting area of the device turning mount with the light-emitting surface oriented in a plane substantially parallel to the mounting area of the electrical sub-mount and the device bonding pad adjacent the sub-mount bonding pad; and a direct electrical connection between the device bonding pad and the sub-mount bonding pad, wherein the electrical connection includes one or more electrically conductive bumps forming a continuous electrical connection from the device bonding pad to the sub-mount bonding pad.
2. The packaging assembly of claim 1 , wherein the light-emitting surface of the light-emitting device is oriented to emit light away from the electrical sub-mount.
3. The packaging assembly of claim 1 , wherein the light-emitting surface of the light-emitting device is oriented to emit light toward the electrical sub-mount.
4. An optoelectronic device packaging assembly, comprising: an electrical sub-mount including a mounting area; a device turning mount having a sub-mount mounting side attached to the mounting area of the electrical sub-mount and a device mounting side having a device mounting area oriented in a plane substantially perpendicular to the mounting area of the electrical sub-mount, wherein the device turning mount includes an electrical trace having a sub-mount bonding portion oriented in a plane substantially parallel to the mounting area of the electrical sub-mount and a device bonding portion oriented in a plane substantially perpendicular to the mounting area of the electrical sub-mount; and a light-emitting device including one or more semiconductor layers terminating at a common light-emitting surface and operable to emit light from the light-emitting surface, wherein the light-emitting device is attached to the device mounting area of the device turning mount with the light-emitting surface oriented in a plane substantially parallel to the mounting area of the electrical sub-mount.
5. The packaging assembly of claim 4 , wherein the electrical trace extends through a volume of the device turning mount.
6. The packaging assembly of claim 4 , wherein the device bonding portion of the electrical trace corresponds to electrically conducting material formed in a groove defined in a surface of the device mounting side of the device turning mount.
7. The packaging assembly of claim 4 , further comprising a wire bond connected between the electrical sub-mount and the sub-mount bonding portion of the electrical trace and a wire bond connected between the device bonding portion of the electrical trace and the light-emitting device.
8. The packaging assembly of claim 1 , wherein one of the electrically conductive bumps is a solder bump directly bonded to the sub-mount bonding pad.
9. The packaging assembly of claim 8 , wherein the one or more electrically conductive bumps include a second solder bump directly bonded to the device bonding pad and directly bonded to the first solder bump.
10. The packaging assembly of claim 8 , wherein the one or more electrically conductive bumps include a wire stud bump directly bonded to the device bonding pad and directly bonded to the solder bump.
11. The packaging assembly of claim 1 , wherein the one or more electrically conductive bumps correspond to a continuous solder mass electrically directly connecting the device bonding pad to the sub-mount bonding pad.
12. The packaging assembly of claim 1 , wherein the electrical sub-mount is formed of silicon.
13. The packaging assembly of claim 1 , wherein the device turning mount is electrically insulating.
14. The packaging assembly of claim 1 , wherein the electrical sub-mount comprises multiple sub-mount bonding pads, and further comprising: one or more additional light-emitting devices each including a respective device bonding pads and one or more semiconductor layers terminating at a common light-emitting surface and operable to emit light from the light-emitting surface, wherein each light-emitting device is attached to the device mounting area of the device turning mount with a respective light-emitting surface oriented in a plane substantially parallel to the mounting area of the electrical sub-mount and the respective device bonding pad adjacent a corresponding one of the sub-mount bonding pads; and direct electrical connections between the device bonding pads and respective ones of the corresponding sub-mount bonding pads, wherein each of the electrical connections includes one or more electrically conductive bumps forming a continuous electrical connection from a respective one of the device bonding pads to the corresponding sub-mount bonding pad.
15. The packaging assembly of claim 1 , further comprising a housing formed of silicon, attached to the electrical sub-mount, and enclosing the device turning mount and the light-emitting device.
16. The packaging assembly of claim 1 , wherein the light-emitting device is an edge-emitting laser.
17. An optoelectronic device packaging assembly, comprising: an electrical sub-mount including a mounting area; a device turning mount having a sub-mount mounting side attached to the mounting area of the electrical sub-mount and a device mounting side having a device mounting area oriented in a plane substantially perpendicular to the mounting area of the electrical sub-mount; and an array of edge-emitting lasers attached to the device mounting area of the device turning mount with each edge-emitting laser oriented to emit light in a direction substantially perpendicular to the electrical sub-mount, each edge-emitting laser being electrically connected to the electrical sub-mount by a direct electrical connection between a respective laser bonding pad and a corresponding bonding pad of the electrical sub-mount.
18. The packaging assembly of claim 17 , wherein each electrical connection includes a wire, one end of each wire being wire bonded to a respective laser bonding pad and another end of each wire being wire bonded to a respective electrical sub-mount bonding pad.
19. The packaging assembly of claim 18 , wherein one end of each wire is stud bump bonded to a respective laser bonding pad and another end of each wire is wire bonded to a respective electrical sub-mount bonding pad.
20. The packaging assembly of claim 18 , wherein each electrical connection includes a solder bump bonded to a respective electrical sub-mount bonding pad.
21. The packaging assembly of claim 20 , wherein each electrical connection includes a second solder bump bonded to a respective laser bonding pad and to a solder ball bonded to a respective electrical sub-mount bonding pad.
22. The packaging assembly of claim 20 , wherein each electrical connection includes a wire stud bump electrically coupled between a respective laser bonding pad and a solder ball bonded to a respective electrical sub-mount bonding pad.
23. The packaging assembly of claim 18 , wherein each electrical connection corresponds to a solder mass electrically connecting a respective laser bonding pad to a respective electrical sub-mount bonding pad.
24. The packaging assembly of claim 1 , wherein the electrical sub-mount is formed of silicon.
25. The packaging assembly of claim 4 , wherein the device turning mount is electrically insulating.
26. The packaging assembly of claim 25 , wherein the device turning mount comprises two electrically insulating substrates.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
March 10, 2003
June 13, 2006
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