An active matrix array device, such as an AMLCD, has an array of matrix elements (10) addressed via sets of address conductors (14, 16). An address circuit (35) connected to one set (16) comprises a multiplexing circuit (31) integrated on the same substrate (25) as the matrix elements which has a plurality of signal bus lines (33), the one set of address conductors being organized in groups with each conductor in a group being associated with a respective and different signal bus line and the groups being addressed in sequence. Each signal bus line is connected to a respective signal processing circuit (42), e.g. a D/A converter or sample and hold circuit in the case of an AMLCD, which is also integrated on the substrate. To avoid problems in use due to the manner of fabrication of these circuits and the operation of the multiplexing circuit, the address circuit is arranged so that the individual signal processing circuits associated with adjacent column conductors are located close together on the substrate.
Legal claims defining the scope of protection, as filed with the USPTO.
1. An active matrix array device, comprising: a substrate; an army of individually addressable matrix cements carried on said substrate; a set of address conductors connected to said array of matrix elements and carried on group including successive address conductors; and an addressing circuit including a multiplexing circuit integrated on said substrate and connected to said set of address conductors, said multiplexing circuit including a plurality of signal bus lines, said multiplexing circuit being arranged to couple sequentially each group of said set of address conductors to said plurality of signal bus lines with each address conductor in a group being coupled to a respective one of said signal bus lines, and a plurality of signal processing circuits integrated on said substrate, each signal processing circuit being connected to a respective bus line, wherein a first signal processing circuit associated with a first address conductor of a first group of address conductors and a second signal processing circuit associated with a last address conductor of a second group of address conductors are adjacent on said substrate.
2. The active matrix array device of claim 1 , wherein said signal processing circuits are arranged in series in a line parallel to said multiplexing circuit.
3. The active matrix array device of claim 1 , wherein a first subset of said signal processing circuits are arranged in a first row and a second subset of said signal processing circuits are arranged in a second row and offset from the first row in a brick-like fashion.
4. The active matrix array device of claim 1 , wherein an order in which said signal processing circuits are arranged physically on said substrate is different than a physical order of said signal bus lines to which said signal processing circuit blocks are respectively connected.
5. An active matrix array device, comprising: a substrate; an array of individually addressable matrix elements carried an said substrate; a set of address conductors connected to said army of matrix elements and carried on said substrate, said set of address conductors being arranged in a series of groups with each group including successive address conductors; and an addressing circuit including a multiplexing circuit integrated on said substrate and connected to said set of address conductors, said multiplexing circuit including a plurality of signal bus lines, said multiplexing circuit being arranged to couple sequentially each group of said set of address conductors to said plurality of signal bus lines with each address conductor in a group being coupled to a respective one of said signal bus lines, and a plurality of signal processing circuits integrated on said substrate, each signal processing circuit being connected to a respective bus line, wherein an order in which said signal processing circuits are arranged physically on said substrate is at least partially different than a physical order of said signal bus lines to which said signal processing circuit blocks are respectively connected.
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July 11, 2000
October 17, 2006
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